JPH0412683U - - Google Patents
Info
- Publication number
- JPH0412683U JPH0412683U JP5299990U JP5299990U JPH0412683U JP H0412683 U JPH0412683 U JP H0412683U JP 5299990 U JP5299990 U JP 5299990U JP 5299990 U JP5299990 U JP 5299990U JP H0412683 U JPH0412683 U JP H0412683U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- component mounting
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す要部分解斜視
図、第２図は本考案実施例の平面図、第３図は第
２図におけるＢ−Ｂ断面図、第４図は従来例の平
面図、第５図は第４図のＡ−Ａ断面図である。
１１……リード部品実装印刷配線板、１１ａ…
…スルーホール、１２……絶縁接着層、１２ａ，
１３ａ……透孔、１３……印刷配線板、１４……
多層印刷配線板、１５……リード型実装部品、１
５ａ……リード、１６……はんだフイレツト。
Fig. 1 is an exploded perspective view of essential parts showing an embodiment of the present invention, Fig. 2 is a plan view of the embodiment of the invention, Fig. 3 is a sectional view taken along line B-B in Fig. 2, and Fig. 4 is a conventional example. FIG. 5 is a sectional view taken along line AA in FIG. 4. 11...Lead component mounting printed wiring board, 11a...
...Through hole, 12...Insulating adhesive layer, 12a,
13a...Through hole, 13...Printed wiring board, 14...
Multilayer printed wiring board, 15...Lead type mounting component, 1
5a...Lead, 16...Solder fillet.
Claims (1)
実装印刷配線板と、 このスルーホールに対向して、該スルーホール
から突出するリードはんだフイレツトを収容可能
な透孔を設けた層間の絶縁接着層及び他の印刷配
線板とを、 対向させて積層一体化してなる多層印刷配線板
における部品取付け構造。[Scope of Claim for Utility Model Registration] A lead component mounting printed wiring board provided with a through hole for inserting the leads, and a through hole that can accommodate a lead solder fillet protruding from the through hole opposite the through hole. A component mounting structure for a multilayer printed wiring board, which is formed by laminating and integrating an insulating adhesive layer between layers and another printed wiring board so that they face each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5299990U JPH0412683U (en) | 1990-05-23 | 1990-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5299990U JPH0412683U (en) | 1990-05-23 | 1990-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412683U true JPH0412683U (en) | 1992-01-31 |
Family
ID=31573799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5299990U Pending JPH0412683U (en) | 1990-05-23 | 1990-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412683U (en) |
-
1990
- 1990-05-23 JP JP5299990U patent/JPH0412683U/ja active Pending