JPH0465477U - - Google Patents

Info

Publication number
JPH0465477U
JPH0465477U JP1990109263U JP10926390U JPH0465477U JP H0465477 U JPH0465477 U JP H0465477U JP 1990109263 U JP1990109263 U JP 1990109263U JP 10926390 U JP10926390 U JP 10926390U JP H0465477 U JPH0465477 U JP H0465477U
Authority
JP
Japan
Prior art keywords
surface mount
solder
adhesive
view
sopic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990109263U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990109263U priority Critical patent/JPH0465477U/ja
Publication of JPH0465477U publication Critical patent/JPH0465477U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例によるＳＯＰＩＣ
の平面図、第２図は第１図の背面図、第３図はこ
の考案の他の実施例を示すチツプ部品の斜視図、
第４図は第３図の背面斜視図、第５図は従来のＳ
ＯＰＩＣの平面図、第６図は第５図の背面図、第
７図は従来およびこの考案共通のＳＯＰＩＣの斜
視図である。 図において、１はＳＯＰＩＣ、２は粘着剤を塗
布したＳＯＰＩＣの底面、第３図はチツプ部品、
４はチツプ部品３の電極端子、５は粘着剤を塗布
したチツプ部品３の底面、７はリード端子を示す
。なお、図中、同一符号は同一、又は相当部分を
示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に半田を用いて実装する表面実装用ＩＣ
    において、前記基板面に対向する表面実装用部品
    の底面全体に半田溶融時の張力よりも強い粘力を
    持つた粘着剤を塗布したことを特徴とする表面実
    装用ＩＣ。
JP1990109263U 1990-10-16 1990-10-16 Pending JPH0465477U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109263U JPH0465477U (ja) 1990-10-16 1990-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109263U JPH0465477U (ja) 1990-10-16 1990-10-16

Publications (1)

Publication Number Publication Date
JPH0465477U true JPH0465477U (ja) 1992-06-08

Family

ID=31856435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109263U Pending JPH0465477U (ja) 1990-10-16 1990-10-16

Country Status (1)

Country Link
JP (1) JPH0465477U (ja)

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