JPH0465478U - - Google Patents
Info
- Publication number
- JPH0465478U JPH0465478U JP10901890U JP10901890U JPH0465478U JP H0465478 U JPH0465478 U JP H0465478U JP 10901890 U JP10901890 U JP 10901890U JP 10901890 U JP10901890 U JP 10901890U JP H0465478 U JPH0465478 U JP H0465478U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- lead wire
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る集積回路の搭載構造の一
実施例を示す斜視図、第２図は第１図の−線
断面図、第３図は第１図の−線断面図、第４
図および第５図はそれぞれＨＩＣの従来の搭載構
造を示す断面図である。
１……ハイブリツド集積回路、２……プリント
配線基板、４……リード線、６……スルーホール
、７……電子部品、８……ランド部、９……半田
、１１……高さ設定用のリード線。
FIG. 1 is a perspective view showing an embodiment of an integrated circuit mounting structure according to the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 1, FIG.
FIG. 5 is a cross-sectional view showing a conventional mounting structure for an HIC. 1...Hybrid integrated circuit, 2...Printed wiring board, 4...Lead wire, 6...Through hole, 7...Electronic component, 8...Land portion, 9...Solder, 11...For height setting lead wire.
Claims (1)
えた集積回路の各対向側面のリード線のうちの幾
つかをそれ以外のものより短く形成すると共に集
積回路の回路と電気的に不導通とし、長いリード
線をプリント配線基板のスルーホールに挿通して
その突出端を前記プリント配線基板のランド部に
半田接続し、短いリード線の先端を前記プリント
配線基板の表面に当接して集積回路の取付高さを
設定し、かつ前記集積回路とプリント配線基板間
の空間に電子部品を組込むようにしたことを特徴
とする集積回路の搭載構造。 In an integrated circuit having a plurality of lead wires on each of two opposing sides, some of the lead wires on each opposing side are formed shorter than the others, and electrically non-conducting with the circuit of the integrated circuit, and a long one is formed. Insert the lead wire into the through hole of the printed wiring board, solder the protruding end to the land of the printed wiring board, and touch the tip of the short lead wire to the surface of the printed wiring board to adjust the mounting height of the integrated circuit. 1. A mounting structure for an integrated circuit, characterized in that an electronic component is installed in a space between the integrated circuit and a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10901890U JPH0465478U (en) | 1990-10-19 | 1990-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10901890U JPH0465478U (en) | 1990-10-19 | 1990-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465478U true JPH0465478U (en) | 1992-06-08 |
Family
ID=31856173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10901890U Pending JPH0465478U (en) | 1990-10-19 | 1990-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465478U (en) |
-
1990
- 1990-10-19 JP JP10901890U patent/JPH0465478U/ja active Pending
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