JPS6448067U - - Google Patents
Info
- Publication number
- JPS6448067U JPS6448067U JP14343087U JP14343087U JPS6448067U JP S6448067 U JPS6448067 U JP S6448067U JP 14343087 U JP14343087 U JP 14343087U JP 14343087 U JP14343087 U JP 14343087U JP S6448067 U JPS6448067 U JP S6448067U
- Authority
- JP
- Japan
- Prior art keywords
- conductive path
- wiring board
- printed wiring
- integrated circuit
- path provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は従来例を示す断面図である。
１は金属基板、２は舌片部、３は絶縁フイルム
、４は導電路、５は半導体素子、６はケース、７
はプリント配線板、８は回路導体。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. 1 is a metal substrate, 2 is a tongue piece, 3 is an insulating film, 4 is a conductive path, 5 is a semiconductor element, 6 is a case, 7
is a printed wiring board, and 8 is a circuit conductor.
Claims (1)
も相対向する側辺終端部より延在された舌片部を
有する絶縁フイルムと、前記絶縁フイルム上に設
けられた所望の導電路と前記導電路上に固着され
た複数の半導体素子と前記半導体素子を密封する
ケースとを備えた混成集積回路において、前記ケ
ースをプリント配線板上の所定の位置に搭載し、
前記プリント配線板上に設けられた回路導体と前
記舌片部上に設けられた前記導電路とを接続させ
前記混成集積回路を前記プリント配線板上にサー
フエイスマウント実装することを特徴とする混成
集積回路。 a metal substrate; an insulating film having tongue portions attached to the metal substrate and extending from at least opposing side end portions; a desired conductive path provided on the insulating film; and a desired conductive path provided on the conductive path. In a hybrid integrated circuit comprising a plurality of fixed semiconductor elements and a case that seals the semiconductor elements, the case is mounted at a predetermined position on a printed wiring board,
The hybrid integrated circuit is surface-mounted on the printed wiring board by connecting the circuit conductor provided on the printed wiring board and the conductive path provided on the tongue portion. integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343087U JPS6448067U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343087U JPS6448067U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448067U true JPS6448067U (en) | 1989-03-24 |
Family
ID=31410249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14343087U Pending JPS6448067U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448067U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923432U (en) * | 1982-08-03 | 1984-02-14 | デルタ工業株式会社 | Automobile rear seat structure |
-
1987
- 1987-09-18 JP JP14343087U patent/JPS6448067U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923432U (en) * | 1982-08-03 | 1984-02-14 | デルタ工業株式会社 | Automobile rear seat structure |