JPH0465489U - - Google Patents
Info
- Publication number
- JPH0465489U JPH0465489U JP1990108049U JP10804990U JPH0465489U JP H0465489 U JPH0465489 U JP H0465489U JP 1990108049 U JP1990108049 U JP 1990108049U JP 10804990 U JP10804990 U JP 10804990U JP H0465489 U JPH0465489 U JP H0465489U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- screw seat
- electronic components
- substrate
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本実施例の分解斜視図、第３図は従来構造の断面
図、第４図は従来構造の斜視図である。
１，１１……セラミツク基板、２……集積回路
素子、３……キヤツプ、４，１４……プリント基
板、４ａ……ストツパー、５，１５……ヒートシ
ンク、５ａ……ヒートシンク凹部、５ｂ……放熱
フイン、５ｃ……貫通穴、１６……接着剤。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is an exploded perspective view of this embodiment, FIG. 3 is a sectional view of a conventional structure, and FIG. 4 is a perspective view of a conventional structure. 1, 11... Ceramic substrate, 2... Integrated circuit element, 3... Cap, 4, 14... Printed circuit board, 4a... Stopper, 5, 15... Heat sink, 5a... Heat sink recess, 5b... Heat radiation Fin, 5c...Through hole, 16...Adhesive.
Claims (1)
制対流冷却機構であつて、単体または複数の前記
電子部品を固着した基板と、この基板の端部に設
けられたねじ座と、前記電子部品の位置とあい対
する面の反対面に放熱フインを設け且つ前記ねじ
座とあい対する部分に取付穴を有してなるヒート
シンクとを具備し、前記電子部品を挟むようにし
て前記基板と前記ヒートシンクとを重ね前記ねじ
座と前記取付穴の部分にてねじ締結して一体構造
としたことを特徴とするヒートシンク取付け構造
。 A forced convection cooling mechanism for electronic components such as ICs used in electronic devices, etc., comprising a substrate to which one or more of the electronic components are fixed, a screw seat provided at the end of the substrate, and the electronic components. and a heat sink having heat dissipation fins on a surface opposite to the surface facing the screw seat, and a heat sink having a mounting hole in a portion facing the screw seat, and overlapping the board and the heat sink so as to sandwich the electronic component. A heat sink mounting structure characterized in that the screw seat and the mounting hole are screwed together to form an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108049U JPH0465489U (en) | 1990-10-16 | 1990-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108049U JPH0465489U (en) | 1990-10-16 | 1990-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465489U true JPH0465489U (en) | 1992-06-08 |
Family
ID=31854838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990108049U Pending JPH0465489U (en) | 1990-10-16 | 1990-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465489U (en) |
-
1990
- 1990-10-16 JP JP1990108049U patent/JPH0465489U/ja active Pending
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