JPH0466104B2 - - Google Patents

Info

Publication number
JPH0466104B2
JPH0466104B2 JP60098090A JP9809085A JPH0466104B2 JP H0466104 B2 JPH0466104 B2 JP H0466104B2 JP 60098090 A JP60098090 A JP 60098090A JP 9809085 A JP9809085 A JP 9809085A JP H0466104 B2 JPH0466104 B2 JP H0466104B2
Authority
JP
Japan
Prior art keywords
film
thin film
isolation trench
polycrystalline
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60098090A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61256740A (ja
Inventor
Juro Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60098090A priority Critical patent/JPS61256740A/ja
Publication of JPS61256740A publication Critical patent/JPS61256740A/ja
Publication of JPH0466104B2 publication Critical patent/JPH0466104B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment

Landscapes

  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP60098090A 1985-05-10 1985-05-10 半導体装置の製造方法 Granted JPS61256740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60098090A JPS61256740A (ja) 1985-05-10 1985-05-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60098090A JPS61256740A (ja) 1985-05-10 1985-05-10 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61256740A JPS61256740A (ja) 1986-11-14
JPH0466104B2 true JPH0466104B2 (de) 1992-10-22

Family

ID=14210642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60098090A Granted JPS61256740A (ja) 1985-05-10 1985-05-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61256740A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249332A (ja) * 1987-04-06 1988-10-17 Toshiba Corp 半導体装置の製造方法
TW274628B (de) * 1994-06-03 1996-04-21 At & T Corp

Also Published As

Publication number Publication date
JPS61256740A (ja) 1986-11-14

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