JPH046671B2 - - Google Patents
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- Publication number
- JPH046671B2 JPH046671B2 JP58081249A JP8124983A JPH046671B2 JP H046671 B2 JPH046671 B2 JP H046671B2 JP 58081249 A JP58081249 A JP 58081249A JP 8124983 A JP8124983 A JP 8124983A JP H046671 B2 JPH046671 B2 JP H046671B2
- Authority
- JP
- Japan
- Prior art keywords
- sintering
- density
- sintered body
- nitriding
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005245 sintering Methods 0.000 claims description 32
- 238000005121 nitriding Methods 0.000 claims description 20
- 239000012298 atmosphere Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011863 silicon-based powder Substances 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- -1 or a metallic boride Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明は、高密度な窒化珪素反応焼結体の製法
に関する。
窒化珪素Si3N4の製品のうち、反応焼結体とよ
ばれるものは、ふつう、Si粉末の成形体または
(Si+Si3N4)粉末混合物の成形体に窒素ガスを
作用させて窒化しつつ焼結することにより製造さ
れている。この種の製品は、耐熱衝撃性、硬度、
高温での電気絶縁性および化学的安定性にすぐれ
ているうえ、反応焼結時の収縮がほとんどなく、
寸法精度が高く得られるという利点があるため、
耐火材料、耐摩耗材料、耐食材料、絶縁材料など
の用途に広く使用されている。
従来の窒化珪素反応焼結体の欠点は機械的に弱
いことであつて、曲げ強度は20Kgf/mm2程度、高
くても30Kgf/mm2止まりであり、耐熱構造用材料
としては不満足なことである。これは、珪素を完
全に窒化して得た製品でも、230〜30%の気孔率
をもつ比較的低密度の焼結体でしかないことが原
因である。より高密度の反応焼結体を製造できれ
ば、常温から高温にわたつて強度をはじめとする
諸特性を改善できるから、高温でも強度が低下し
ないという特徴を生かして、耐熱構造用材料とし
てきわめて有用なものとなる。
反応焼結体の密度を向上させるためにこれまで
とられた対策は、Siまたは(Si+Si3N4)成形体
の密度を高めることである。具体的には、まず粉
末成形圧力の増大であるが、実用できる限度で高
い圧力を加えても、窒化後の製品の密度は、せい
ぜい2.39g/cm3(理論密度の75%)でしかない。
粉末の粒度を調節して種々の粒径のものを配合す
ることも試みられたが、それでも反応焼結体の密
度は2.54g/cm3が限界とされていた。
さらに高密度の反応焼結体を得る目的で、Si成
形体の予備焼結、すなわち窒化に先立つ不活性雰
囲気中での焼結を導入して、Si成形体の高密度の
焼結体をつくることが提案された(特開昭52−
121613号)。
しかし、上記開示の方法は、予備焼結によるSi
成形体の高密度を実効あるものとするために、平
均粒径0.2μ以下というきわめて微細なSi粉末を使
用することを必須条件とする。そのような微粉末
の製造が容易でないという問題は別にしても、得
られる反応焼結体の密度は、なお、2.39g/cm3
(理論密度の92%)が限度であつた。
本発明者は、予備焼結を利用するSi成形体の高
密度化をさらにおし進めることを意図して協働者
とともに研究を重ね、最高3.05g/cm3(理論密度
の96%)に達するきわめて高密度の反応焼結体を
得ることに成功し、すでに開示した(特開昭57−
188465号および57−188466号)。その方法は、Si
粉末に特定量のホウ素を加えて焼結性を向上させ
るか、または特定の元素、すなわちFe、Co、
Ni、Cr、Mo、Mn、W、Ti、Zr、Ta、Nb、V、
Mg、Ca、Cu、ZnおよびSnからえらんだ1種ま
たは2種以上の元素またはその化合物を一定量加
えて、窒化を促進することを要旨とする。その後
の研究により、Feなどの窒化促進剤は焼結性向
上の効果もあり、広い添加量範囲で有用であるこ
とがわかつた。上記BおよびFeなどの添加剤は、
もちろん併用してもよく、それが好ましい。
さらに本発明者は、窒化珪素反応焼結体の強度
を高めることを企てて種々検討したところ、密度
とともに、不純物として反応焼結体中に生成する
SiO2やSiON2が重大な影響をもつことがわかつ
た。すなわち、これらの不純物は、Si3N4組織の
中にあつて、強度上の弱点を形成するから、極力
その量を低減しなければならない。
その対策としてここに提案する窒化珪素反応焼
結体の製法は、ホウ素またはその化合物をBとし
て0.15〜5.0重量%、ならびに(または)Fe、Co、
Ni、Cr、Mo、Mn、W、Ti、Zr、Ta、Nb、V、
Mg、Ca、Cu、ZnおよびSnの1種または2種以
上の元素またはその化合物を上記元素として(2
種以上の場合は合計量で)0.05〜2.0重量%含有
する珪素粉末を成形し、成形体を不活性ガス雰囲
気中で1100℃以上であるがSiの融点よりは低い温
度に加熱して予備焼結し、得られた予備焼結体を
1100〜1500℃の温度に加熱してN2を作用させ窒
化することからなる高密度な窒化珪素反応焼結体
の製法において、予備焼結の雰囲気として、水素
ガスまたは0.5容積%以上の水素とアルゴンまた
ヘリウムとの混合ガスを使用することを特徴とす
る。
従来の製法において、原料Si粉末中に含まれて
いる酸素は主としてSiO2の形で存在すると考え
られ、予備焼結に際して
SiO2+Si→2SiO↑
の反応により揮散し、続く窒化工程にまでは残ら
なかつたものと理解される。ところが、高密度な
反応焼結体を製造するため微細なSi粉末を使用す
ると、その中に含まれる酸素量は、たとえば表面
積の増大による酸化被膜の増大により、どうして
も多くなる。すると、酸素が予備焼結の過程で、
上記機構で揮散しきれなくなるのであろう。これ
が、微細粉末を使用するという努力にもかかわら
ず、反応焼結体の強度の向上を妨げていたわけで
ある。
本発明に従つて予備焼結の工程で水素を存在さ
せることにより、原料Si粉末中の酸素が除去さ
れ、続く窒化工程におけるSiO2の残留や、
SiON2の生成が回避される。
この効果は、予備焼結の雰囲気ガス中に容積で
0.5%以上のH2が存在するときに得られる。好ま
しくは、1%以上数%ないし10%程度のH2を存
在させる。
焼結促進または窒化促進の効果をもつ前記諸物
質の含有量の限界とその理由は、さきに開示の発
明と同じである。すなわち、ホウ素の効果を期待
するためには、少なくとも0.15重量%の含有を必
要とする。しかしホウ素は窒化工程において窒化
硼素BNを生成し、これが多量になると反応焼結
を阻害する。そのため、5.0重量%以内に止めな
ければならない。
Feその他の物質の含有量は、Si粉末に対し0.05
重量%以上ないと効果が得られない。この下限未
満では予備焼結体の密度が高くなることもあつ
て、Siを高度に窒化するのに要する時間が、実用
的といえないほど長くなる。一方、2.0%を越え
る含有は、著しい粒成長を招き、予備焼結におけ
る高密度化を妨げるので、避けなければならな
い。好ましい範囲は使用元素により異なるが、ふ
つう0.1〜0.6重量%である。
存在形態は、ホウ素の場合、金属ホウ素、非晶
物質、または金属ホウ化物などのいずれであつて
もよく、Feその他は、元素状態であつても、も
た酸化物などの化合物であつてもよく、それら同
士の化合物は、もちろん好ましいものである。両
者を併用する場合は、ホウ素とこれら元素との化
合物をえらべば、両者を一挙に存在させることが
できて好ましい。
原料のSi粉末は、予備焼結における高密度化を
容易にするために、平均粒径が15μ以下のものを
使用すべきであつて、望ましいのは1μ以下の微
粉末である。
焼結促進剤および窒化促進剤の諸物質も、Si粉
末の粒度と同等またはそれ以下の微粒子であるこ
とが望ましい。
粉末成形および予備焼結に関する技術は、さき
に開示したところと変らない。すなわち、原料粉
末または粉末混合物の成形は、常用のダイス成形
をはじめとして、等方圧成形、スリツプキヤス
ト、射出成形など任意の手段によることができる
のはもちろんである。
予備焼結する成形体の密度は、その取り扱いや
加工を容易にするとともに、予備焼結における焼
結性を確保するために、0.82g/cm3(理論密度の
35%)以上にすべきである。これより低い密度で
は、予備焼結により高密度化できても、均一な組
織を有する焼結体を得ることが困難となる。
予備焼結の方法は、自由焼結のほか、一軸加圧
焼結(いわゆるホツトプレス)、熱間等方圧焼結
などの通常の方法をとることができる。
予備焼結は、1100℃以上の温度において行な
う。これより低い温度では、微細な粉末を使用し
ても高密度化が期待できない。上限の温度は、も
ちろんSiの融点である。雰囲気はアルゴンのよう
な不活性ガスが好適であるが、真空であつてもよ
い。
予備焼結の段階での高密度化の程度は、焼結に
伴う収縮量であらわされる。これは焼結する成形
体の密度によつても同じではないが、本発明で実
現しようとする高密度反応焼結製品を与えるに
は、体積収縮率にして、少なくとも10%必要であ
り、20%以上あることが好ましい。
予備焼結体は、H2の存在によりSiO2の揮散が
助力される結果、従来の予備焼結法によるものよ
り、いく分ポーラスで低密度となる。これを酸化
性の雰囲気にさらすと、せつかく除去した酸素が
再び加わつてしまい、雰囲気を制御して予備焼結
を行なつた意味が薄れるから、非酸化性の雰囲気
中に置かねばならない。予備焼結終了後、直ちに
窒化雰囲気に置き、窒化工程に移行することが好
ましい。実際には、同一の炉を用い、予備焼結に
続いて、雰囲気ガスおよび温度を変更して窒化を
実施すればよい。
上記の点を配慮すれば、Si予備焼結体の窒化
は、本発明においても、従来の窒化珪素反応焼結
体の製造に際して行なわれていたところと同じよ
うにして実施できる。すなわち、一般的には大気
圧の窒素ガス雰囲気下で、1100〜1500℃の温度に
加熱する。温度は、1100〜1350℃の低温側から段
階的に昇温してゆくこともできる。反応速度を調
節するためには、窒素の圧力を減圧(最大100分
の1気圧程度まで)から加圧(最高2000気圧)ま
での範囲で選択すればよい。なお、純窒素ガスの
ほかにも、水素混合窒素ガスやアンモニアも使用
できる。
窒化に要する時間は、予備焼結体の密度、平均
粒径、窒化温度および雰囲気条件により、また許
容できる残留Si量により大きく異なるが、数時間
から200時間程度である。
実施例および比較例
平均粒径0.15μの珪素微粉末に下記の添加剤を
加え、
実施例1および比較例1 B 0.4%
実施例2および比較例2 Fe2O3 1.2%
実施例3および比較例3 B 0.4%
+Nb2O3 1.2%
実施例4 B 0.4%
ラバープレスにより成形して、径30mm×高さ10
mmのタブレツトを得た。成形体の密度はいずれも
52%であつた。
この成形体を、それぞれ下記の雰囲気で、温度
1375℃×1時間の予備焼結を行なつた。
実施例1、2、3 Ar+10%H2
実施例1 Ar+1%H2
比較例1、2、3 Ar
予備焼結体の密度は、それぞれ次のとおりであ
つた。
実施例1 80% 比較例1 82%
2 82 2 82
3 85 3 86
実施例4 80%
これらの予備焼結体を、N2雰囲気下で、1350
℃×20時間→1380℃×60時間→1410℃×20時間の
加熱により窒化した。
得られた各反応焼結体について、密度、不純物
含有量(粉砕してX線回折にかけた)および強度
を測定した。その結果をつぎに示す。
本発明の窒化珪素反応焼結体は、SiO2や
Si2ON2などの不純物の生成がなく、強度がすぐ
れていることが、このデータから明らかである。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a high-density silicon nitride reaction sintered body. Among silicon nitride Si 3 N 4 products, those called reaction sintered bodies are usually made by applying nitrogen gas to a molded body of Si powder or a molded body of (Si + Si 3 N 4 ) powder mixture while nitriding it. Manufactured by sintering. This kind of product has thermal shock resistance, hardness,
It has excellent electrical insulation and chemical stability at high temperatures, and has almost no shrinkage during reaction sintering.
Because it has the advantage of achieving high dimensional accuracy,
Widely used in applications such as fireproof materials, wear-resistant materials, corrosion-resistant materials, and insulation materials. The drawback of conventional silicon nitride reaction sintered bodies is that they are mechanically weak, with a bending strength of around 20Kgf/ mm2 , or at most 30Kgf/ mm2 , which is unsatisfactory as a material for heat-resistant structures. be. This is because even products obtained by completely nitriding silicon are only relatively low-density sintered bodies with a porosity of 230 to 30%. If a reaction sintered body with higher density can be produced, it will be possible to improve various properties such as strength from room temperature to high temperature, making it extremely useful as a material for heat-resistant structures by taking advantage of its characteristic of not losing strength even at high temperatures. Become something. The measures taken so far to increase the density of reaction sintered bodies are to increase the density of Si or (Si+Si 3 N 4 ) compacts. Specifically, the first step is to increase the powder compaction pressure, but even if the pressure is as high as practical, the density of the product after nitriding is only 2.39 g/cm 3 (75% of the theoretical density). .
Attempts have been made to adjust the particle size of the powder and mix powders with various particle sizes, but the density of the reaction sintered body was still limited to 2.54 g/cm 3 . In order to obtain a reaction sintered body with even higher density, pre-sintering of the Si molded body, that is, sintering in an inert atmosphere prior to nitriding, is introduced to create a high-density sintered body of the Si molded body. It was proposed that
121613). However, the method disclosed above does not allow Si by pre-sintering.
In order to effectively achieve high density of the compact, it is essential to use extremely fine Si powder with an average particle size of 0.2μ or less. Apart from the problem that such fine powder is not easy to manufacture, the density of the resulting reaction sintered body is still 2.39 g/cm 3
(92% of the theoretical density) was the limit. The present inventor has conducted extensive research with collaborators with the intention of further increasing the density of Si molded bodies using pre-sintering, and has achieved a maximum density of 3.05 g/cm 3 (96% of the theoretical density). We succeeded in obtaining an extremely high-density reaction sintered body, which we have already disclosed (Japanese Unexamined Patent Application Publication No. 1987-1999).
188465 and 57-188466). The method is Si
Adding a certain amount of boron to the powder to improve sinterability or adding certain elements i.e. Fe, Co,
Ni, Cr, Mo, Mn, W, Ti, Zr, Ta, Nb, V,
The gist is to promote nitriding by adding a certain amount of one or more elements selected from Mg, Ca, Cu, Zn, and Sn, or a compound thereof. Subsequent research revealed that nitridation promoters such as Fe have the effect of improving sinterability and are useful over a wide range of addition amounts. Additives such as B and Fe mentioned above are
Of course, they may be used in combination, which is preferred. Furthermore, the present inventor conducted various studies with the aim of increasing the strength of the silicon nitride reaction sintered body, and found that, along with the density, impurities are generated in the reaction sintered body.
It was found that SiO 2 and SiON 2 have a significant effect. That is, since these impurities are present in the Si 3 N 4 structure and form weak points in terms of strength, their amount must be reduced as much as possible. As a countermeasure to this problem, the method for manufacturing a silicon nitride reaction sintered body proposed here uses boron or its compound as B of 0.15 to 5.0% by weight, and/or Fe, Co,
Ni, Cr, Mo, Mn, W, Ti, Zr, Ta, Nb, V,
One or more elements of Mg, Ca, Cu, Zn, and Sn or their compounds are used as the above elements (2
Silicon powder containing 0.05 to 2.0% by weight (if the total amount is more than The obtained preliminary sintered body is
In the method for producing a high-density silicon nitride reaction sintered body, which consists of heating to a temperature of 1100 to 1500°C and nitriding by applying N2 , the pre-sintering atmosphere is hydrogen gas or 0.5% by volume or more of hydrogen. It is characterized by the use of a mixed gas with argon or helium. In the conventional manufacturing method, the oxygen contained in the raw material Si powder is thought to exist mainly in the form of SiO 2 , which is volatilized by the reaction of SiO 2 +Si→2SiO↑ during preliminary sintering, and does not remain until the subsequent nitriding process. It is understood that it was lost. However, when fine Si powder is used to produce a high-density reaction sintered body, the amount of oxygen contained therein inevitably increases, for example, due to an increase in the oxide film due to an increase in surface area. Then, during the pre-sintering process, oxygen is
It is likely that the above mechanism will not be able to volatilize it completely. This has prevented improvements in the strength of reaction sintered bodies despite efforts to use fine powders. By making hydrogen present in the pre-sintering step according to the present invention, oxygen in the raw Si powder is removed, and SiO 2 remains in the subsequent nitriding step.
Generation of SiON 2 is avoided. This effect is due to the volume in the pre-sintering atmosphere gas.
Obtained when more than 0.5% H2 is present. Preferably, H 2 is present in an amount of 1% or more, several % to about 10%. The limits and reasons for the contents of the various substances having the effect of promoting sintering or nitriding are the same as in the invention disclosed above. That is, in order to expect the effect of boron, it is necessary to contain at least 0.15% by weight. However, boron generates boron nitride BN in the nitriding process, and in large amounts this inhibits reaction sintering. Therefore, it must be kept within 5.0% by weight. The content of Fe and other substances is 0.05 to Si powder.
If the amount is less than % by weight, no effect will be obtained. Below this lower limit, the density of the pre-sintered body may become high and the time required to nitridize Si to a high degree becomes impractically long. On the other hand, a content exceeding 2.0% causes significant grain growth and prevents high density during preliminary sintering, so it must be avoided. The preferred range varies depending on the element used, but is usually 0.1 to 0.6% by weight. In the case of boron, the existing form may be metallic boron, an amorphous substance, or a metallic boride, and Fe and others may be in an elemental state or in a compound such as an oxide. Well, compounds between them are of course preferred. When both are used together, it is preferable to select a compound of boron and these elements because both can be present at once. The raw material Si powder should have an average particle size of 15 μm or less, and preferably a fine powder of 1 μm or less in order to facilitate high density during preliminary sintering. The sintering accelerator and the nitriding accelerator are also desirably fine particles with a particle size equal to or smaller than that of the Si powder. The techniques for powder compaction and pre-sintering are the same as previously disclosed. That is, it goes without saying that the raw material powder or powder mixture can be formed by any means such as conventional die forming, isostatic pressing, slip casting, injection molding, and the like. The density of the compact to be pre-sintered is set at 0.82 g/cm 3 (the theoretical density
35%) or more. If the density is lower than this, it is difficult to obtain a sintered body having a uniform structure even if the density can be increased by preliminary sintering. As a preliminary sintering method, in addition to free sintering, ordinary methods such as uniaxial pressure sintering (so-called hot press) and hot isostatic pressure sintering can be used. Pre-sintering is performed at a temperature of 1100°C or higher. At temperatures lower than this, high density cannot be expected even if fine powder is used. The upper limit temperature is, of course, the melting point of Si. The atmosphere is preferably an inert gas such as argon, but may also be a vacuum. The degree of densification at the preliminary sintering stage is expressed by the amount of shrinkage caused by sintering. This does not depend on the density of the compact to be sintered, but in order to provide the high-density reaction sintered product that the present invention aims to achieve, the volumetric shrinkage rate must be at least 10%, and 20%. % or more is preferable. The pre-sintered body is somewhat more porous and less dense than that produced by conventional pre-sintering methods as a result of the presence of H 2 aiding the volatilization of SiO 2 . If this is exposed to an oxidizing atmosphere, the oxygen that has been so painstakingly removed will be added again, and the purpose of pre-sintering by controlling the atmosphere will be diminished, so it must be placed in a non-oxidizing atmosphere. After the preliminary sintering is completed, it is preferable to immediately place it in a nitriding atmosphere and proceed to the nitriding step. In practice, nitriding may be carried out using the same furnace and changing the atmospheric gas and temperature following preliminary sintering. Taking the above points into consideration, the nitriding of the Si pre-sintered body can be carried out in the present invention in the same manner as in the production of conventional silicon nitride reaction sintered bodies. That is, it is generally heated to a temperature of 1100 to 1500°C under a nitrogen gas atmosphere at atmospheric pressure. The temperature can also be increased stepwise from the low temperature side of 1100 to 1350°C. In order to adjust the reaction rate, the nitrogen pressure may be selected from a range of reduced pressure (up to about 1/100 atm) to increased pressure (up to 2000 atm). In addition to pure nitrogen gas, hydrogen-mixed nitrogen gas and ammonia can also be used. The time required for nitriding varies greatly depending on the density of the preliminary sintered body, average grain size, nitriding temperature, and atmospheric conditions, as well as on the allowable amount of residual Si, but ranges from several hours to about 200 hours. Examples and Comparative Examples The following additives were added to silicon fine powder with an average particle size of 0.15μ. Example 1 and Comparative Example 1 B 0.4% Example 2 and Comparative Example 2 Fe 2 O 3 1.2% Example 3 and Comparative Example Example 3 B 0.4% + Nb 2 O 3 1.2% Example 4 B 0.4% Molded using a rubber press, diameter 30 mm x height 10
I got a mm tablet. The density of the molded body is
It was 52%. These molded bodies were heated in the following atmosphere and at a temperature of
Preliminary sintering was performed at 1375°C for 1 hour. Examples 1, 2, 3 Ar + 10% H 2 Example 1 Ar + 1% H 2 Comparative Examples 1, 2, 3 Ar The densities of the preliminary sintered bodies were as follows. Example 1 80% Comparative Example 1 82% 2 82 2 82 3 85 3 86 Example 4 80% These preliminary sintered bodies were heated to 1350% in an N 2 atmosphere.
Nitriding was carried out by heating at 1380°C for 20 hours → 1410°C for 20 hours. For each reaction sintered body obtained, the density, impurity content (ground and subjected to X-ray diffraction) and strength were measured. The results are shown below. The silicon nitride reaction sintered body of the present invention contains SiO 2 and
It is clear from this data that impurities such as Si 2 ON 2 are not generated and the strength is excellent. 【table】
Claims (1)
5.0重量%、ならびに(または)Fe、Co、Ni、
Cr、Mo、Mn、W、Ti、Zr、Ta、Nb、V、
Mg、Ca、Cu、ZnおよびSnの1種または2種以
上の元素またはその化合物を上記元素として(2
種以上の場合は合計量で)0.05〜2.0重量%含有
する珪素粉末を成形し、成形体を不活性ガス雰囲
気中で1100℃以上であるがSiの融点よりは低い温
度に加熱して予備焼結し、得られた予備焼結体を
1100〜1500℃の温度に加熱してN2を作用させ窒
化することからなる高密度な窒化珪素反応焼結体
の製法において、予備焼結の雰囲気として、水素
ガスまたは0.5容積%以上の水素とアルゴンまた
ヘリウムとの混合ガスを使用することを特徴とす
る製法。 2 予備焼結の後、得られた予備焼結体を酸化雰
囲気に置くことなく窒化雰囲気に移して窒化させ
る特許請求の範囲第1項の製法。 3 予備焼結体の体積収縮率が10%以上である特
許請求の範囲第1項または第2項のいずれかの製
法。[Claims] 1 Boron or its compound as B is 0.15 to
5.0% by weight, and/or Fe, Co, Ni,
Cr, Mo, Mn, W, Ti, Zr, Ta, Nb, V,
One or more elements of Mg, Ca, Cu, Zn, and Sn or their compounds are used as the above elements (2
Silicon powder containing 0.05 to 2.0% by weight (if the total amount is more than The obtained preliminary sintered body is
In the method for producing a high-density silicon nitride reaction sintered body, which consists of heating to a temperature of 1100 to 1500°C and nitriding by applying N2 , the pre-sintering atmosphere is hydrogen gas or 0.5% by volume or more of hydrogen. A manufacturing method characterized by the use of a gas mixture with argon or helium. 2. The manufacturing method according to claim 1, wherein after preliminary sintering, the obtained preliminary sintered body is transferred to a nitriding atmosphere and nitrided without being placed in an oxidizing atmosphere. 3. The manufacturing method according to claim 1 or 2, wherein the pre-sintered body has a volumetric shrinkage rate of 10% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58081249A JPS59207878A (en) | 1983-05-10 | 1983-05-10 | Manufacturing method for high-density silicon nitride reaction sintered bodies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58081249A JPS59207878A (en) | 1983-05-10 | 1983-05-10 | Manufacturing method for high-density silicon nitride reaction sintered bodies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59207878A JPS59207878A (en) | 1984-11-26 |
| JPH046671B2 true JPH046671B2 (en) | 1992-02-06 |
Family
ID=13741117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58081249A Granted JPS59207878A (en) | 1983-05-10 | 1983-05-10 | Manufacturing method for high-density silicon nitride reaction sintered bodies |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59207878A (en) |
-
1983
- 1983-05-10 JP JP58081249A patent/JPS59207878A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59207878A (en) | 1984-11-26 |
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