JPH046748B2 - - Google Patents
Info
- Publication number
- JPH046748B2 JPH046748B2 JP21166585A JP21166585A JPH046748B2 JP H046748 B2 JPH046748 B2 JP H046748B2 JP 21166585 A JP21166585 A JP 21166585A JP 21166585 A JP21166585 A JP 21166585A JP H046748 B2 JPH046748 B2 JP H046748B2
- Authority
- JP
- Japan
- Prior art keywords
- block copolymer
- styrene
- copolymer resin
- resin
- styrene block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 41
- 229920001083 polybutene Polymers 0.000 claims description 21
- 239000007787 solid Substances 0.000 claims description 15
- 229920006132 styrene block copolymer Polymers 0.000 claims description 13
- 239000004831 Hot glue Substances 0.000 claims description 12
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 5
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はホツトメルト接着剤組成物、更に詳し
くは、スチレンブロツク共重合体樹脂を主成分と
し、加熱溶融後塗布した直後の接着可能時間（オ
ープンタイム）を延長したホツトメルト接着剤組
成物に関する。
従来技術
スチレンブロツク共重合体樹脂は熱可塑性ゴム
特性を有し、特に未加硫ゴムの易溶性と加硫ゴム
の優れたストレス・ストレイン特性を兼備し、そ
の優れた物理的・化学的性質から各種の分野で利
用されているが、更にその用途範囲の拡大が望ま
れつつある。
本発明者らは、このスチレンブロツク共重合体
樹脂の用途開発について検討を進めたところ、こ
れに通常の粘着付与樹脂および常温固形の変性ポ
リブテンを配合して溶融混合すれば、オープンタ
イムを良好に延長したホツトメルト接着剤が得ら
れることを見出し、本発明を完成させるに至つ
た。
発明の構成と効果
すなわち、本発明は、スチレンブロツク共重合
体樹脂、粘着付与樹脂および常温固形の変性ポリ
ブテンから成り、スチレンブロツク共重合体樹脂
が、スチレン−ブタジエンブロツク共重合体樹
脂、スチレン−ブタジエン−スチレンブロツク共
重合体樹脂またはスチレン−イソプレン−スチレ
ンブロツク共重合体樹脂、および常温固形の変性
ポリブテンが、常温固形のポリブテンを有機過酸
化物の存在下で加熱して分子を切断したものであ
ることを特徴とするホツトメルト接着剤組成物を
提供するものである。
本発明におけるスチレンブロツク共重合体樹脂
としては、スチレン−ブタジエンブロツク共重合
体樹脂（SB樹脂と称す）、スチレン−ブタジエン
−スチレンブロツク共重合体樹脂（SBS樹脂と称
す）、スチレン−イソプレン−スチレンブロツク
共重合体樹脂（SIS樹脂と称す）が挙げられ、例
えばシエル化学(株)製の「カリフレツクスTR−
1101」、「同TR−1102」、「同TR−1107」等が市
販されている。特にSIS樹脂が好ましい。
本発明における粘着付与樹脂としては、通常の
ものが使用されてよく、例えばクマロン樹脂、ク
マロン−インデン樹脂、スチレン樹脂、合成炭化
水素樹脂、ロジン樹脂、ポリテルペン樹脂、水添
テルペン樹脂等が挙げられ、これらの１種または
２種以上を使用に供する。使用量は通常、スチレ
ンブロツク共重合体樹脂100部（重量部、以下同
様）に対し５〜100部の範囲で選定すればよい。
本発明における常温固形の変性ポリブテンと
は、通常の常温固形ポリブテンを有機過酸化物
（例えばベンゾイルパーオキサイド、メチルエチ
ルケトンパーオキサイド、ジクミルパーオキサイ
ド、クメンハイドロパーオキサイド、ジブチルパ
ーオキサイド、ｔ−ブチルパーオキシベンゾエー
ト、１，３−ビス−（ｔ−ブチルパーオキシイソ
プロピル）ベンゼンなど）の存在下150〜250℃の
温度で加熱して分子を切断ししたものを指称す
る。上記常温固形ポリブテンとしては、一般に分
子量100万〜300万のものが使用することができ
る。常温固形であると、常温液状のものに比し耐
久接着強度を高めることができ、また上述の如く
変性しておくと、低温時または高温時（80℃以
上）のいずれの場合にも接着強度の低下が見られ
ず、耐寒性、耐熱性の点で有利であり、かつオー
プンタイムの延長化が可能となる。当該変性ポリ
ブテンの使用量は通常、スチレンブロツク共重合
体樹脂100部に対し５〜40部、好ましくは８〜20
部の範囲で選定すればよい。５部未満であると、
所望のオープンタイムが得られず、また40部を越
えると、溶融粘度が増大するので、塗布作業上の
難点となる傾向にある。
本発明に係るホツトメルト接着剤組成物は、上
記所定割合のスチレンブロツク共重合体樹脂、粘
着付与樹脂および常温固形の変性ポリブテン、お
よび必要に応じて通常の充填剤、可塑剤、溶融粘
度調整剤等を適量配合し、これらを常法により溶
融混合することにより得られる。かかる本発明組
成物は、耐久接着強度およびその耐寒性、耐熱性
共に良好であり、適度のオープンタイムを具備す
るホツトメルト接着剤として使用することができ
る。
次に実施例を挙げて本発明を具体的に説明す
る。
実施例 １
変性ポリブテン
常温固形のポリブテン（分子量約200万を200
万、三井石油化学工業(株)製、ポリブテンＭ−
8640）10Kgに、１，３−ビス（ｔ−ブチルパーオ
キシイソプロピル）ベンゼン（化薬ヌーリー(株)
製、パーカドツクス−14）５ｇを加え、充分に分
散させた後エクスクルーダーで200℃にて加熱処
理を行い、常温固形の変性ポリブテンを得る。
ホツトメルト接着剤
SIS樹脂（シエル化学(株)製、カリフレツクス
TR−1107、スチレン／イソプレン比＝14／86）
100部に、脂環式炭化水素樹脂（荒川化学工業(株)
製、アルコンＰ−115）80部および上記変性ポリ
ブテン12部を加え、ニーダーで180℃にて溶融混
練し、均一なホツトメルト接着剤を得る。
比較例 １
実施例１のホツトメルト接着剤において、変性
ポリブテンの代わりに変性していない常温固形の
ポリブテン（ポリブテンＭ−8640）５部（実施例
１と同程度の実用的な粘度に合わせて）を用いる
以外は、同様な条件でホツトメルト接着剤を得
る。
上記実施例１、比較例１の接着剤を180℃で溶
融して５cm×２cm×0.5cm（厚）のビード状に塗
布し、指触にてオープンタイムを判定する。結果
を表１に示す。
【表】DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a hot melt adhesive composition, more specifically, a hot melt adhesive composition containing a styrene block copolymer resin as a main component, which has a bondable time (open time) immediately after application after being heated and melted. The present invention relates to a hot melt adhesive composition having an extended period of time. Prior art Styrene block copolymer resin has thermoplastic rubber properties, and in particular combines the easy solubility of unvulcanized rubber with the excellent stress and strain properties of vulcanized rubber, and its excellent physical and chemical properties. Although it is used in various fields, it is desired to further expand its range of applications. The inventors of the present invention have investigated the development of applications for this styrene block copolymer resin and found that if it is blended with a normal tackifying resin and a modified polybutene that is solid at room temperature and melt-mixed, the open time can be improved. It was discovered that a hot melt adhesive having an extended length can be obtained, and the present invention was completed. Structure and Effects of the Invention That is, the present invention comprises a styrene block copolymer resin, a tackifying resin, and a modified polybutene solid at room temperature, and the styrene block copolymer resin is composed of a styrene-butadiene block copolymer resin, a styrene-butadiene block copolymer resin, and a styrene-butadiene block copolymer resin. - Styrene block copolymer resin or styrene-isoprene-styrene block copolymer resin and modified polybutene that is solid at room temperature are obtained by heating polybutene, which is solid at room temperature, in the presence of an organic peroxide to cleave the molecules. The present invention provides a hot melt adhesive composition characterized by the following. Examples of the styrene block copolymer resin in the present invention include styrene-butadiene block copolymer resin (referred to as SB resin), styrene-butadiene-styrene block copolymer resin (referred to as SBS resin), and styrene-isoprene-styrene block copolymer resin. Examples include copolymer resins (referred to as SIS resins), such as ``Califlex TR-'' manufactured by Ciel Chemical Co., Ltd.
1101'', ``TR-1102'', ``TR-1107'', etc. are commercially available. Particularly preferred is SIS resin. As the tackifying resin in the present invention, common ones may be used, such as coumaron resin, coumaron-indene resin, styrene resin, synthetic hydrocarbon resin, rosin resin, polyterpene resin, hydrogenated terpene resin, etc. One or more of these may be used. The amount to be used is usually selected within the range of 5 to 100 parts per 100 parts (parts by weight, same hereinafter) of the styrene block copolymer resin. In the present invention, the modified polybutene that is solid at room temperature refers to ordinary polybutene that is solid at room temperature. Benzoate, 1,3-bis-(t-butylperoxyisopropyl)benzene, etc.) is heated at a temperature of 150 to 250°C to cleave the molecule. As the room-temperature solid polybutene, those having a molecular weight of 1 million to 3 million can generally be used. If it is a solid at room temperature, it can increase the durable adhesive strength compared to a liquid at room temperature, and if it is modified as described above, the adhesive strength will be increased at both low and high temperatures (80℃ or higher). No deterioration is observed, and it is advantageous in terms of cold resistance and heat resistance, and it is possible to extend the open time. The amount of the modified polybutene used is usually 5 to 40 parts, preferably 8 to 20 parts, per 100 parts of the styrene block copolymer resin.
The selection can be made within the scope of the department. If it is less than 5 copies,
If the desired open time is not obtained and the amount exceeds 40 parts, the melt viscosity increases, which tends to be a problem in coating operations. The hot melt adhesive composition according to the present invention contains the styrene block copolymer resin, tackifying resin, and modified polybutene solid at room temperature in the above-mentioned predetermined proportions, and if necessary, ordinary fillers, plasticizers, melt viscosity modifiers, etc. It can be obtained by blending appropriate amounts of these and melt-mixing them by a conventional method. The composition of the present invention has good durable adhesive strength and good cold resistance and heat resistance, and can be used as a hot melt adhesive having an appropriate open time. Next, the present invention will be specifically explained with reference to Examples. Example 1 Modified polybutene Polybutene that is solid at room temperature (molecular weight of about 2 million
Polybutene M- manufactured by Mitsui Petrochemical Industries, Ltd.
8640) 10Kg, 1,3-bis(t-butylperoxyisopropyl)benzene (Kayaku Nouri Co., Ltd.)
After thoroughly dispersing 5 g of Parkadox-14) manufactured by Manufacturer Co., Ltd., heat treatment is performed at 200°C using an excluder to obtain modified polybutene that is solid at room temperature. Hot melt adhesive SIS resin (manufactured by Ciel Chemical Co., Ltd., Califrex
TR-1107, styrene/isoprene ratio = 14/86)
100 parts, alicyclic hydrocarbon resin (Arakawa Chemical Industry Co., Ltd.)
80 parts of Alcon P-115) manufactured by Alcon P-115) and 12 parts of the above-mentioned modified polybutene were added and melted and kneaded at 180°C in a kneader to obtain a uniform hot melt adhesive. Comparative Example 1 In the hot melt adhesive of Example 1, 5 parts of unmodified room temperature solid polybutene (Polybutene M-8640) (adjusted to the same practical viscosity as Example 1) was added instead of the modified polybutene. A hot melt adhesive was obtained under the same conditions except for the following. The adhesives of Example 1 and Comparative Example 1 were melted at 180° C. and applied in a bead shape of 5 cm x 2 cm x 0.5 cm (thickness), and the open time was determined by touch with a finger. The results are shown in Table 1. 【table】
Claims (1)
脂および常温固形の変性ポリブテンから成り、ス
チレンブロツク共重合体樹脂が、スチレン−ブタ
ジエンブロツク共重合体樹脂、スチレン−ブタジ
エン−スチレンブロツク共重合体樹脂またはスチ
レン−イソプレン−スチレンブロツク共重合体樹
脂、および常温固形の変性ポリブテンが、常温固
形のポリブテンを有機過酸化物の存在下で加熱し
て分子を切断したものであることを特徴とするホ
ツトメルト接着剤組成物。 ２ 各成分の割合が、スチレンブロツク共重合体
樹脂100重量部に対し粘着付与樹脂５〜100重量部
および変性ポリブテン５〜40重量部である前記第
１項記載の組成物。[Scope of Claims] 1 Consisting of a styrene block copolymer resin, a tackifying resin, and a modified polybutene solid at room temperature, the styrene block copolymer resin is composed of a styrene-butadiene block copolymer resin, a styrene-butadiene-styrene block copolymer resin, and a styrene-butadiene-styrene block copolymer resin. The polymer resin or styrene-isoprene-styrene block copolymer resin and the modified polybutene that is solid at room temperature are obtained by heating polybutene that is solid at room temperature in the presence of an organic peroxide to cleave the molecules. hot melt adhesive composition. 2. The composition according to item 1 above, wherein the proportions of each component are 5 to 100 parts by weight of the tackifying resin and 5 to 40 parts by weight of the modified polybutene per 100 parts by weight of the styrene block copolymer resin.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21166585A JPS6270471A (en) | 1985-09-24 | 1985-09-24 | Hot-melt adhesive composition |
| US06/902,654 US4734447A (en) | 1985-09-24 | 1986-09-02 | Hot-melt adhesive |
| EP86112413A EP0216238B1 (en) | 1985-09-24 | 1986-09-08 | Hot-melt adhesive |
| DE8686112413T DE3686013T2 (en) | 1985-09-24 | 1986-09-08 | HOT MELT ADHESIVE. |
| KR1019860007975A KR870003175A (en) | 1985-09-24 | 1986-09-24 | Adhesion imparting agent composition and high heat melting adhesive composition containing same |
| AU63106/86A AU587284B2 (en) | 1985-09-24 | 1986-09-24 | Hot-melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21166585A JPS6270471A (en) | 1985-09-24 | 1985-09-24 | Hot-melt adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6270471A JPS6270471A (en) | 1987-03-31 |
| JPH046748B2 true JPH046748B2 (en) | 1992-02-06 |
Family
ID=16609564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21166585A Granted JPS6270471A (en) | 1985-09-24 | 1985-09-24 | Hot-melt adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270471A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030002367A (en) * | 2001-06-29 | 2003-01-09 | 주식회사 하이닉스반도체 | Method for manufacturing pellicle of semiconductor device |
| CN111516067B (en) * | 2020-07-03 | 2020-09-18 | 东营市盛基环保工程有限公司 | Method for measuring open time of aldehyde-free adhesive |
-
1985
- 1985-09-24 JP JP21166585A patent/JPS6270471A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6270471A (en) | 1987-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4734447A (en) | Hot-melt adhesive | |
| JP3824658B2 (en) | Low viscosity low application temperature hot-melt adhesive styrene-isoprene-styrene block copolymer composition | |
| JPH08506127A (en) | Pressure sensitive adhesive containing liquid rubber and solid rubber | |
| JP4847515B2 (en) | Adhesive composition comprising a mixture of block copolymers | |
| US5330832A (en) | Pressure-sensitive adhesives of polyvinyl methyl ether | |
| JPH07157738A (en) | Tacky adhesive composition | |
| JP2005008747A (en) | Rubber adhesive composition and adhesive sheet thereof | |
| US20070249781A1 (en) | Low Hot-Melt Viscosity Adhesive Composition for Non-Wovens | |
| JPH03160083A (en) | Hot-melt adhesive composition | |
| KR920000243B1 (en) | Hot Melt Adhesive Composition | |
| JPH046748B2 (en) | ||
| JP4651767B2 (en) | Solid-type adhesive composition and its adhesive sheet | |
| JP3355671B2 (en) | Composition for adhesives | |
| GB2041949A (en) | Pressure Sensitive Adhesive Composition and Article | |
| JPH1150031A (en) | Styrene block copolymer rubber adhesive composition | |
| JPH046749B2 (en) | ||
| JPS62151481A (en) | Hot-melt adhesive | |
| JPH01306450A (en) | Butyl rubber hot-melt composition | |
| JP2000204334A (en) | Heat-stable hot-melt adhesive composition | |
| JPS60152576A (en) | Hot-melt pressure-sensitive adhesive | |
| JPH01306449A (en) | Hot-melt composition | |
| JPS62257978A (en) | Adhesive composition | |
| JPS6327573A (en) | Adhesive composition | |
| JPH11198288A (en) | Polyurethane composite molding | |
| JPS5928353B2 (en) | Method for manufacturing hot melt pressure sensitive adhesive |