JPH0468098B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component automatic mounting device for automatically mounting electronic components onto a printed circuit board, and particularly relates to a bare chip in which a semiconductor chip is not molded in a synthetic resin mold body. The present invention relates to a device for automatically mounting multiple pieces of paper onto a printed circuit board with high work efficiency and high precision.

(Prior Art) In recent years, devices for automatically mounting electronic components (generally called bare chips) on printed circuit boards, in which semiconductor chips are not molded into a molded body, have been developed that can accurately and reliably mount electronic components at predetermined positions on the circuit board. Furthermore, in order to improve work efficiency, there is an increasing demand for shorter wearing time.

FIG. 6 is a perspective view of a conventional electronic component automatic mounting device, in which 5 is a board, and electronic components 11 are mounted on this board 5 in the following manner. Reference numeral 9 denotes an electronic component supply device, in which electronic components 11 are placed on a jig 21.
A wafer is provided, and the electronic component 11 is moved in the XY direction (arrow A). 23
is a push-up device (ejector) that pushes up the electronic components 11 on the wafer from below.

Reference numeral 71 denotes a positional deviation correction device (hereinafter referred to as pre-center) that corrects positional deviation of the electronic component 11. 72 is a die picker, which has a transfer head 70 at the tip of its arm. By reciprocating the transfer head 70 in the direction of arrow O, the electronic component 11 on the jig 21 is picked up and transferred onto the precenter 71.

At this pre-center 71, the electronic component 11
Positioning claws are pressed against the electronic component 11 from four directions (arrow directions), correcting the positional deviation of the electronic component 11 in the XYθ directions, and also moving the electronic component 11 in the horizontal direction (arrow S
direction), the rotation angle of the electronic component 11 is set. Note that this rotation angle setting is for setting the orientation of the electronic component 11 mounted on the board 5.

1 is a transfer device, and a slide unit 96
have. A shaft 95 protrudes from this slide unit 96, and this shaft includes:
An adhesive application head 68 and a transfer head 69 are provided. A plurality of both heads 68 and 69 are mounted on the circumferential surface of the drum, and the shaft 95 is
By rotating in the direction, the most suitable heads 68 and 69 for the electronic component 11 are selected.

As the shaft 95 reciprocates in its axial direction (direction of arrow P), one head 68 connects to the adhesive supply device (hereinafter referred to as epoxy unit) 27.
An adhesive is applied onto the substrate 5. The other head 69 is connected to the electronic component 11 whose positional deviation has been corrected in the precenter 71 as described above.
is picked up and mounted on the adhesive applied to the substrate 5. The substrate 5 is positioned on a substrate holder 7, and when the substrate holder 7 is driven, the substrate 5 moves in the XY direction (in the direction of arrow B), whereby adhesive is applied to a predetermined position on the substrate 5. , and electronic components 11 are mounted on this adhesive. Reference numerals 67 and 17 are guide rails for transporting substrates.

(Problems to be Solved by the Invention) However, the above conventional means had the following problems.

(1) The dimensions and shapes of the electronic components 11 on the jig 21 vary. Therefore, it is desirable to equip the die picker with nozzles of various sizes so as to be compatible with the types of electronic components 11, and to use different nozzles depending on the types of electronic components 11. However, since the die pickup device 72 of the conventional means has only one nozzle, it cannot correspond to various types of electronic components 11, and the types of electronic components 11 that can be picked up with this nozzle are limited to a very small number.

(2) At the pre-center 71, the electronic components 11 are
In addition to correcting the positional deviation in the XYθ directions, the rotation angle is also set, and after the rotation angle is set, the transfer head 69 picks up the electronic component 11. However, since it takes time to set the rotation angle, the pick-up of the transfer head 69 is delayed, the cycle time becomes longer, and the efficiency of mounting the electronic components 11 onto the board 5 is not improved.

(3) In the pre-center 71, after correcting the positional deviation of the electronic component 11, the electronic component 11 is horizontally rotated by a predetermined angle and the rotation angle is set. Otherwise, the mounting accuracy will not improve.

Accordingly, an object of the present invention is to provide an electronic component automatic mounting apparatus that can solve the problems of the conventional means described above.

(Means for Solving the Problem) For this purpose, the present invention includes three devices: an electronic component supply device, an electronic component misalignment correction device, and a board holder that positions and moves the printed circuit board in the XY directions. A sub that is arranged side by side and moves back and forth between the electronic component supply device and the positional deviation correction device to adsorb the electronic components provided in the electronic component supply device to the nozzle and transfer them to the positional deviation correction device. The transfer head moves back and forth between the positional deviation correction device and the board holder, and the electronic component whose positional deviation has been corrected in the positional deviation correction device is sucked into a nozzle and attached to the printed circuit board positioned on the board holder. The sub-transfer head is equipped with a transfer head for transferring and an adhesive application means for applying adhesive to the position where electronic components are mounted on the printed circuit board positioned in the board holder, and the sub-transfer head has a plurality of large and small nozzles. and a nozzle selection means,
Further, a rotation angle setting means is provided for setting the rotation angle of the electronic component by rotating the nozzle that has picked up the electronic component.

(Function) In the above configuration, the sub-transfer head moves between the electronic component supply device and the positional deviation correction device, and transfers the electronic component from the electronic component supply device to the positional deviation correction device. In this case, the nozzle of the sub-transfer head is selected depending on the type of electronic component. Furthermore, while transferring the electronic component to the misalignment correction device, the nozzle that has picked up the electronic component is rotated to set the rotation angle, and then the electronic component is mounted on the misalignment correction device. Then, the transfer head picks up the electronic component whose positional deviation has been corrected by the positional deviation correction device, and transfers it onto a printed circuit board to which adhesive has been applied in advance by the adhesive application means.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

In FIG. 2, reference numeral 1 denotes a transfer device, on the back side of which there is a substrate stocker 4 for storing printed circuit boards 5, a lifter device (loader) 3, an extrusion device 2 for pushing out printed circuit boards 5, and a conveyor 6.
is provided. In addition, in front of conveyor 6
A substrate holder 7 is provided that moves in the XY directions (see also FIG. 1). 8 is a conveying device.

The substrate 5 of the stocker 4 is conveyed on the conveyor 6 and positioned on the substrate holder 7. This board holder 7 moves the board 5 in the XY directions in order to apply adhesive to a predetermined coordinate position of the board 5 and to mount the electronic component 11 on the adhesive. Moreover, the electronic component 11 is placed on the board holder 7.
The board 5 on which is mounted is transferred to a lifter device (unloader) 14 by an unloading conveyor 17 and a transfer device 15.
The substrate stocker 4 holds the substrate.

In FIGS. 1 to 3, 9 is an electronic component supply device. This electronic component supply device 9 is provided with an XY table 10 and an index device 12. As shown in FIG. 1, a jig 21 is fixed to the indexing device 12 with screws 22, and the electronic component 11 is mounted on the jig 21. When the indexing device 12 is driven, the jig 2
1 rotates horizontally, and a jig 21 having a desired electronic component 11 is moved directly below a sub-transfer head 40a (described later). Also, when the XY table 10 is driven,
This jig moves in the XY directions and positions the electronic component 11 directly below the nozzle 73 (described later) of the sub-transfer head 40a.

In FIGS. 1 and 3, below the jig 21 is a push-up device 23 having a push-up pin 24 that pushes up the electronic component 11 upward (in the direction of arrow C).
(hereinafter referred to as an ejector) is provided.
Further, on the side thereof, a positional deviation correction device 13 (hereinafter referred to as precenter) for correcting positional deviation of the electronic component 11 is provided. Reference numeral 39 denotes a position regulating claw provided on the precenter 13. Further, the substrate holder 7 is provided on the side thereof, and has a motor 26 that drives the X axis and a motor 25 that drives the Y axis, and moves the substrate 5 in the B direction (XY direction).

Furthermore, an adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided on the side thereof. This epoxy unit 27 includes a ring 29 having a ring-shaped groove, and this ring 29 stores adhesive. A motor 28 horizontally rotates the ring 29.

the electronic component supply device 9, the precenter 13,
Four devices, the substrate holder 7 and the epoxy unit 27, are arranged side by side, and the transfer device 1 is located above them. Further, the carry-in conveyor 6 and the carry-out conveyor 17 are disposed in a direction perpendicular to this side-by-side direction. By laying out the entire device in this way, the entire device can be configured compactly. Next, the detailed structure of the transfer device 1 will be explained.

In FIG. 1, each of the devices 9, 1 arranged side by side
A block 31 is provided on the back side of the blocks 3, 7, and 27. This block 31 has a guide rail 7
6 is provided, and plates 44a and 44b are provided via a guide rail nut 38.
A sub-transfer head 40a is provided on the plate 44b. By moving laterally along the guide rail 76, the sub-transfer head 40a reciprocates between the electronic component supply device 9 and the precenter 13, and the electronic component 11 pushed up by the pin 24 of the ejector 23 , the nozzle 73 is H
It is picked up by moving up and down in the direction, and transferred and mounted on the pre-center 13. This sub-transfer head 40a is provided with a motor 41 for setting the rotation angle of the electronic component 11 attracted to the nozzle 73.

As shown in FIG. 5, the sub-transfer head 40a
is connected to the shaft 78 of the cylinder 77. Further, this sub-transfer head 40a has a small diameter nozzle 73a and a large diameter nozzle 73b. 79a and 79b are the respective nozzles 73a and 7
This is the shaft above 3b. As shown in FIG. 5A, when the rod 78 of the cylinder 77 protrudes in the N1 direction, one arm 79b is located in front of the lever 37, and when the lever 37 swings in this state,
Pushed by this, the arm 79b swings and the nozzle 7
3b descends and picks up the large electronic component 11a.

Also, as shown in Figure 5B, the rod 78 is N2
When the other arm 79a is pulled in the direction, the other arm 79a is located in front of the lever 37, and when the lever 37 swings in this state, the arm 79a is pushed by this and swings, and the nozzle 73a descends, discharging small electronic components. 11b
Pick up. That is, cylinder 77
serves as a nozzle 73 selection means for selecting nozzles 73, 73a, 73b according to the type of electronic components 11, 11a, 11b.

Next, referring to FIG. 4, the means for setting the rotation angle of the electronic component 11 will be explained.

In FIG. 4B, 79a is the above-mentioned arm, which swings in the direction of arrow F about the shaft 80. A roller 81 is attached to the tip of the arm 79a. This roller 81 is in contact with the upper surface of the shaft 82. Further, this shaft 82 is connected to the nozzle 73 via a block 83 and a nozzle shaft 85. Reference numerals 84 and 90 are elastic bodies for impact.

In the above configuration, when the arm 79a is pushed on its back surface by the lever 37 and swings in the F direction,
The shaft 82 is pushed down by the roller 81,
The nozzle 73 connected to the shaft 82 also descends in the H direction to pick up the electronic component 11 on the jig 21.

In Fig. 4, 88 is the motor 4 in A, B, and C.
It is a gear that is driven by the gear 1 and rotates. This gear 8
8 is engaged with gears 87, 87a, and 87b. The gear 87 is connected to the nozzles 73, 73a, 73b.
is on the same axis as When the motor 41 is driven, the gear 87 rotates, and the nozzle 73 also rotates around its axis, thereby setting the rotation angle of the electronic component 11 attracted to the nozzle 73. In other words, the motor 41 and gears 87 and 88 constitute means for setting the rotation angle of the nozzle 73. 92a, 92
b is an origin detector for setting the rotation angle.

In FIG. 1, a transfer head 40b and adhesive application means 40c are attached to a plate 44a. The transfer head 40b has a guide rail 76.
By moving in the lateral direction along the substrate holder 7, the electronic component 11 is reciprocated between the pre-center 13 and the substrate holder 7, and the electronic component 11 whose positional deviation has been corrected at the pre-center 13 is transferred to the substrate 5 positioned on the substrate holder 7. Transfer and load to. Also, adhesive application means 4
0c similarly moves back and forth between the epoxy unit 27 and the substrate holder 7, and applies the adhesive from the epoxy unit 27 to the substrate 5.

The transfer head 40b is equipped with a plurality of nozzles 74 for sucking electronic components 11, and a motor 42
By driving and rotating the electronic component 11
Select a nozzle 74 that matches the size and shape of. Similarly, the adhesive application means 40c also has a plurality of nozzles 75, and by driving and rotating the motor 43, a nozzle 75 suitable for the size and shape of the electronic component 11 is selected. .

In FIG. 1, a bearing 66 mounted on the side surface of the block 31 is provided with a shaft 33 that rotates about its axis. This shaft 3
3 includes a sub transfer head 40a and a transfer head 40.
b, the position where the adhesive application means 40c stops, that is, above the electronic component supply device 9, precenter 13, board holder 7, and epoxy unit 27;
Levers 36 and 37 are provided to move the nozzles 73, 74, and 75 up and down. 35 is a plate attached to the lever 36, and 34 is a solenoid that operates independently in response to trouble or the like.

When the shaft 33 rotates about its axis, each lever 36, 37 swings simultaneously.
Then, as explained with reference to Figure 4 B,
The lever 37 pushes the arms 79a, 79b from the back, causing the arms 79a, 79b to swing around the shaft 80 to move the nozzle 73 up and down, and the lever 36 to swing to move the nozzles 74, 75 up and down.

In FIG. 3, 54 is a motor, 55 is a cam drive device, and 56 is a motor driven by the cam drive device 55.
57 is a lever that swings in the L direction about a pin 58, and 59 is a rod that is driven by the lever 57 and reciprocates in the E direction. The plates 44a, 44b are connected to this rod 59, so when the motor 54 is driven, the sub transfer head 40a, the transfer head 40
b. The adhesive application means 40c reciprocates laterally along the guide rail 76 as described above.

Further, the shaft 33 is connected to a cam drive device 55 via a rod 97, a ball joint 64, and an arm 65. When the motor 54 is driven, the rod 97 moves up and down in the I direction, and the shaft 3
3 rotates around its axis, and the lever 3
6 and 37 swing, and nozzles 73, 74, and 75 move up and down.

Further, the ejector 23 is connected to a cam drive device 55 via a lever 63 that is pivotally supported by a rod 61 and a pin 62. When the motor 54 is driven, the rod 61 reciprocates in the K direction, and the lever 6
3 swings around the pin 62, the pin 24 moves up and down, and pushes up the electronic component 11 on the jig 21.
The sub-transfer head 40a attracts the electronic component 11 pushed up by the pin 24 to the nozzle 73 and picks it up.

In this way, this device uses one motor 54 to operate the sub transfer head 40a, transfer head 40b,
These drive systems are simplified by reciprocating the adhesive application means 40c in the lateral direction, vertically moving each of the nozzles 73, 74, and 75, and vertically moving the pin 24 of the ejector 23. This makes it easier to time the movements. In particular, the push-up pin 24 and the nozzle 7 of the sub-transfer head 40a
3 by the same motor 54, the push-up timing of the pin 24 and the pick-up timing of the nozzle 73 are reliably matched, and the pick-up error of the electronic component 11 due to the deviation of both timings is eliminated.

This device has the above-mentioned configuration, and its operation will be explained next.

The substrate 5 extruded from the stocker 4 by the extrusion device 2 is sent onto the substrate holder 7 by the carry-in conveyor 6, and is positioned on the substrate holder 7. Next, by driving the motor 54, the sub transfer head 40 is moved as shown in FIG.
a, transfer head 40b, adhesive application means 40c
are respectively Egictor 23 and Precenter 1.
3. Stop right above the substrate holder 7. In this state, as the shaft 33 rotates, the levers 36, 37 swing, and the nozzles 73, 74,
75 moves up and down. At the same time, the pin 24 of the ejector 23 pushes up the electronic component 11 of the jig 21 from below, and the nozzle 73 suctions and picks up the electronic component 11 while moving up and down. Further, the nozzle 74 of the transfer head 40b is connected to the precenter 1.
The electronic component 11 whose positional deviation has been corrected in step 3 is picked up, and the nozzle 7 of the adhesive application means 40c is picked up.
5 applies adhesive to the substrate 5.

Next, by further driving the motor 54, the sub transfer head 40a, the transfer head 40b,
The adhesive applying means 40c moves to the right along the guide rail 76 and applies the adhesive to the precenter 1, respectively.
3. Stop directly above the substrate holder 7 and epoxy unit 27. Next, by swinging the levers 36 and 37, the nozzle 7 of the sub-transfer head 40a
3 moves up and down to place the electronic component 11 in the precenter 13
The nozzle 74 of the transfer head 40b also moves up and down, and the electronic component 11 adsorbed to the lower end of the nozzle 74 moves up and down.
is mounted on the adhesive previously applied to the substrate 5 as described above, and the nozzle 75 of the adhesive application means 40c is also moved up and down to adhere the adhesive stored in the ring 29 to the lower end thereof. . That is, in this case, while applying the adhesive to the substrate 5 one point at a time by the adhesive applying means 40c, each time,
Immediately thereafter, the electronic component 11 is bonded onto this adhesive by the transfer head 40b.

Then, by further driving the motor 54,
The sub transfer head 40a, the transfer head 40b, and the adhesive application means 40c move to the left and stop at the ejector 23, precenter 13, and substrate holder 7, respectively, and return to the state shown in FIG. 3.
Next, the nozzle 73 moves up and down to pick up the electronic component 11 on the jig 21, the nozzle 74 picks up the electronic component 11 on the pre-center 13, and the nozzle 75 transfers the adhesive attached to the lower end to the substrate. Apply to 5.

As described above, the motor 54 is driven and the sub-transfer head 40a, the transfer head 40b, and the adhesive application means 40c simultaneously reciprocate in the lateral direction, thereby pre-centering the electronic component 11 on the jig 21.
Transfer to 3 and electronic parts 1 on pre-center 13
1 to the board 5 and the application of adhesive to the electronic component mounting position of the board 5 are carried out simultaneously and repeatedly as a series of operations, and the board 5 on which the electronic components 11 have been mounted is transferred to the unloading conveyor. 17 and collected by the stocker 4.

In this device, multiple types of electronic components 11 are mounted on a board 5. Therefore, as shown in FIGS. 1 and 2, a plurality of jigs 21 are arranged in the electronic component supply device 9, with the indexing device 12 at its center. Electronic components 11 of various types are equipped. Further, the indexing device 12 is installed on the XY table 10 and is movable in the XY directions. Therefore, by driving the indexing device 12 and horizontally rotating each jig 21, the jig 21 equipped with the desired electronic component 11 is moved to the ejector 23.
Position it directly above. In this state, by driving the XY table 10 and moving the jig 21 in the XY direction, the predetermined electronic component 11 is placed on the pin 2.
4, and is picked up by the nozzle 73 of the sub-transfer head 40a. In the above operation, by protruding the rod 78 of the cylinder 77, as explained with reference to FIG.
Selection b is made. Also, the sub transfer head 40a
When the electronic component 11 that has been picked up is transferred to the pre-center 13, the motor 41 is driven to move the nozzle 73 as described above with reference to FIG.
The rotation angle of the electronic component 11 is set by rotating the electronic component 11 around its axis. Therefore, the time for setting this rotation angle does not become a dead time, and the cycle time can be shortened accordingly. As mentioned above, the conventional means shown in FIG. 6 corrects the positional deviation of the electronic component 11 in the XYθ directions at the precenter 71, and then rotates the precenter 71 to set the rotation angle. , until this rotation angle setting is completed, the transfer head 6
9 cannot pick up the electronic component 11, which lengthens the cycle time and reduces the mounting efficiency on the board 5. In addition, as the precenter 71 rotates, a new error in the θ direction (rotation direction) is generated. As a result, mounting accuracy could not be improved.

(Effects of the Invention) As explained above, according to the present invention, it is possible to apply adhesive to a predetermined position of a board, transfer and mount an electronic component from an electronic component supply device to a misalignment correction device (pre-center), and perform pre-centering. The transfer and mounting of the electronic components, whose positional deviations have been corrected, onto the board can be carried out as a series of operations in close coordination with each other with good workability. Moreover, the sub-transfer head can select the optimal nozzle according to the type of electronic component, and also allows the rotation angle of the electronic component to be set by rotating the nozzle while transferring the picked-up electronic component to the pre-center. The time required to set this rotation angle does not become a dead time, and multiple types of chips can be efficiently mounted on the board.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an electronic component automatic mounting device according to an embodiment of the present invention, Fig. 2 is a perspective view of the same, Fig. 3 is a front view of the device, and Fig. 4 A, B, and C are partial plan views and 5A and 5B are partial front views, and FIG. 6 is a perspective view of a conventional electronic component automatic mounting device. 5... Board, 7... Board holder, 9... Electronic component supply device, 11... Electronic component, 13... Pre-center (positional deviation correction device), 24... Push-up pin, 36, 37... Vertical movement Means, 40a...
Sub-transfer head, 40b...Transfer head, 40c
...Adhesive application means, 41, 87, 88 ... Rotation angle setting means, 54 ... Motor, 73, 74, 7
5... Nozzle, 77... Nozzle selection means.

Claims (1)

[Claims] 1 Three devices, an electronic component supply device, an electronic component misalignment correction device, and a board holder for positioning and moving a printed circuit board in the XY directions, are installed side by side, and the electronic component supply device and the position a sub-transfer head that moves back and forth between the misalignment correction devices to adsorb electronic components provided in the electronic component supply device onto a nozzle and transfer them to the misalignment correction device; the misalignment correction device and the substrate holder; a transfer head that moves back and forth between the nozzles to adsorb the electronic components whose positional deviations have been corrected in the positional deviation correction device and transfers them onto the printed circuit board positioned in the board holder; the sub-transfer head has a plurality of large and small nozzles, a nozzle selection means, and an electronic An electronic component automatic mounting device characterized by being provided with a rotation angle setting means for setting the rotation angle of the electronic component by rotating a nozzle that has sucked the component.