JPH08130230A - Flip chip mounting equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide a flip chip mounting apparatus capable of mounting a flip chip having bumps on a substrate with good workability and at high speed. [Structure] A first pickup head 5 picks up a flip chip 2 on a wafer sheet 1 and transfers it to a stage 12 of a rotary member 11 of an upside-down reversing unit 10. The rotating member 11 is rotated by 180 °, the flip chip 2 is turned upside down and transferred to the table 20. After correcting the displacement of the flip chip 2 on the table 20, the second pickup head 22 picks up the flip chip 2 and mounts it on the substrate 26 on the movable table 25. Since the first pickup head 5 merely transfers the flip chip 2 on the wafer sheet 1 to the upside-down reversing unit 10, the takt time is greatly shortened, and the flip chip 2 can be mounted on the substrate 26 at a high speed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip mounting apparatus for mounting a flip chip having bumps on a substrate.

[0002]

2. Description of the Related Art As an electronic component, a flip chip formed by forming bumps (protruding electrodes) on the surface of a chip is known. The flip chip is mounted on the substrate by bonding bumps to electrodes of a circuit pattern on the substrate.

The applicant of the present invention has previously proposed a flip chip mounting apparatus for mounting a flip chip on a substrate (Japanese Patent Laid-Open No. 2-56945). As shown in FIG. 2, the motor M is driven by a motor M (the reference numeral is used in the same publication, hereinafter the same) to rotate the arm 26 in a clockwise direction.
When the suction portion 27 at the tip of the wafer 5 approaches the wafer 5, the pin 7a of the lower die ejector 7 projects and the wafer 5
The upper flip chip F is pushed up, and the suction part 27 picks up the flip chip F by sucking it on the bump forming surface. Next, the arm 26 rotates counterclockwise to turn the flip chip F upside down. Then, the nozzle 6a of the transfer head 6 approaches this and picks up this flip chip F. Next, the transfer head 6 moves to the appearance inspection device 21 and temporarily stops above the eyepiece portion 21b, and in this state, the displacement of the flip chip F adsorbed by the nozzle 6a in the xyθ directions is observed. Next, the transfer head 6 is positioned by the positioning unit 1.
Then, the flip chip F is mounted on the substrate 4 positioned on the substrate 4.

[0004]

However, in the above-mentioned conventional apparatus, the wafer 5 is attached to the suction portion 27 at the tip of the arm 26.
Pick up the flip chip F of this arm 26
Rotates to flip the flip chip F upside down (that is, the flip chip F on the wafer 5 is picked up and the flipped chip F picked up is turned upside down by the arm 26, which is a single component). ,
Since the tact time is controlled by the operation of the arm 26, the tact time becomes long and there is a problem that the work efficiency does not increase.

Therefore, it is an object of the present invention to provide a flip chip mounting apparatus capable of mounting a flip chip provided in a chip supply unit such as a wafer on a substrate with good work efficiency.

[0006]

To this end, the flip-chip mounting apparatus of the present invention is provided with a first pickup head for picking up a flip-chip, which is provided with bumps on the chip supply portion on the upper surface side, and the first pickup head. The flip chip is transferred from the pickup head and the flip chip is turned upside down to turn the flip chip upside down so that the flip chip is turned upside down. A second pickup head for picking up the flip chip on the table and transferring and mounting it on the substrate, and a position deviation correcting means for correcting the position deviation of the flip chip flipped up and down by the up / down reversing unit are configured.

[0007]

According to the above construction, the first pickup head only needs to transfer the flip chip of the chip supply section to the upside-down section, and the operation for the first pickup head to pick up the flip chip of the chip supply section. The flip-chip receives the flip chip upside down while performing the process, so that the takt time of the first pickup head and the flip-up part is extremely short, and the flip chip is processed at high speed with good workability. Can be implemented in.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is an overall configuration diagram of a flip-chip mounting apparatus according to a first embodiment of the present invention, and FIG. 2 is an enlarged side view of the flip-up unit. In FIG. 1, reference numeral 1 denotes a wafer sheet as a chip supply unit, to which a flip chip 2 is attached. Bumps 3 are formed on the upper surface of the flip chip 2. An ejector device 4 pushes up the flip chip 2 on the wafer sheet 1 from below with a pin 4a. As the chip supply unit, a tray in which the flip chips 2 are stored in a matrix pocket is also used.

Reference numeral 5 is a first pickup head,
It has a collet 6 for vacuum-sucking the flip chip 2. The first pickup head 5 is held on the moving table 7, and is moved in the horizontal direction by driving the moving table 7.

Reference numeral 10 is a vertically inverted portion, and a stage 12 is provided at the tip of an arm-shaped rotating member 11 which is bent in a hook shape. A base end portion of the rotating member 11 is pivotally attached to a hinge 13, and is driven by a motor 14 to move vertically in a vertical direction.
Rotate 80 °. In FIG. 2, suction holes 15 are formed in the rotary member 11 and the stage 12. The suction hole 15 is connected to a vacuum device 17 via a tube 16, and by driving the vacuum device 17, the flip chip 2 on the stage 12 is vacuum-sucked and fixed.

In FIG. 1, reference numeral 20 is a table for positional deviation correction, and a position correction claw 21 is provided on the upper surface thereof. The position correcting claw 21 slides on the table 20 and is pressed against the side surface of the flip chip 2 by being driven by a driving unit (not shown), thereby correcting the positional deviation of the flip chip 2 in the XYθ directions.

Reference numeral 22 denotes a second pickup head, which has a collet 23 for vacuum-sucking the flip chip 2. The second pickup head 22 is held on a moving table 24, and is horizontally moved by driving the moving table 24. A movable table 25 has a substrate 26 mounted on its upper surface. By driving the movable table 25, the substrate 26 is horizontally moved in the XY directions, and its position is adjusted. Flip chip 2
Bumps 3 and the electrodes of the circuit pattern formed on the upper surface of the substrate 26 are aligned, and the flip chip 2 is mounted on the substrate 26.
Will be implemented in.

The flip-chip mounting apparatus is constructed as described above, and its operation will be described below. In FIG. 1, the pin 4a of the ejector device 4 rises to push up the flip chip 2 on the wafer sheet 1 from below.
At this time, the collet 6 of the first pickup head 5 moves down and up to pick up the flip chip 2 pushed up by the pin 4a by vacuum suction.

Next, the first pickup head 5 moves to above the stage 12 of the upside-down reversing unit 10 waiting at the solid line position, where the collet 6 again descends and rises,
Moreover, the flip chip 2 is transferred onto the stage 12 by releasing the vacuum suction state of the flip chip 2.
At this time, the vacuum device 17 shown in FIG. 2 is driven, and the flip chip 2 on the stage 12 is vacuum-sucked and fixed.

Next, when the motor 14 is driven, the rotary member 11 rotates 180 ° in the clockwise direction (see the rotary member 11 indicated by the chain line). Next, the vacuum device 17 stops driving and the vacuum suction state of the flip chip 2 is released, so that the flip chip 2 is transferred onto the table 20. By rotating the rotating member 11 by 180 ° in this manner, the flip chip 2 is turned upside down and the bumps 3 are placed on the lower surface side. Therefore, the position correction claw 21 is pressed against the side surface of the flip chip 2 to correct the positional deviation of the flip chip 2 in the XYθ directions.

Next, the rotating member 11 is rotated 180 ° counterclockwise.
While rotating and returning to the original position, the second pickup head 22 moves above the flip chip 2 on the table 20, and the collet 23 moves down and up to pick up the flip chip 2. Next, the second pickup head 22 moves to the substrate 26 on the movable table 25.
And the picked-up flip chip 2 is mounted on the substrate 26 at a predetermined coordinate position. The method of aligning the bumps 3 of the flip chip 2 with the electrodes of the substrate 26 is a well-known method, and a detailed description thereof will be omitted. However, by correcting the positional deviation of the flip chip 2 on the table 20, the flip chip 2 is corrected. The bumps 3 are correctly aligned with the electrodes of the circuit pattern on the substrate 26.

In the above operation, the first pickup head 5 merely transfers and mounts the flip chip 2 on the wafer sheet 1 onto the stage 12 of the upside down unit 10.
While the first pickup head 5 moves onto the wafer sheet 1 and picks up the next flip chip 2, the rotating member 11 of the upside-down reversing unit 10 moves clockwise 18 times.
The flip chip 2 on the stage 12 is rotated upside down by 0 ° to be mounted on the table 20 and then rotated counterclockwise by 180 ° to return to the original position. Compared with the conventional pickup head that has performed two operations of the reversing operation,
The takt time of the first pickup head 5 and the vertical inversion unit 10 is greatly shortened, the workability of the entire apparatus is improved accordingly, and the flip chip 2 can be mounted on the substrate 26 at a high speed.

FIG. 3 is an overall configuration diagram of a flip-chip mounting apparatus according to the second embodiment of the present invention. This second embodiment is
The flip chip positional deviation correcting means is different from that of the first embodiment. That is, 30 is a table installed in place of the table 20 for positional deviation correction of the first embodiment,
The flip chip 2 is transferred onto the table 30 by the vertically inverting unit 10. The second pickup head 22 vacuum-sucks and picks up the flip chip 2 on the table 30, and transfers and mounts it on the substrate 26 on the movable table 25. A camera 31 is provided below the moving path of the second pickup head 22. Is provided. The flip chip 2 is observed by the camera 31, the position of the flip chip 2 is recognized, and the positional deviation between the bump 3 and the electrode of the substrate 26 is detected. The detected positional deviations in the X direction, Y direction, and θ direction (horizontal rotation direction) are driven by the movable table 25 to move the substrate 26 horizontally or by a motor incorporated in the second pickup head 22 to collect the collet. It is corrected by horizontally rotating 23. Of course, the movable table 25 is provided with a horizontal rotation mechanism so that the substrate 26 can be moved by this horizontal rotation mechanism.
The position shift in the θ direction may be corrected by horizontally rotating.

[0019]

As described above, the flip chip mounting apparatus of the present invention receives the flip chip picked up by the first pickup head, turns it upside down, and then transfers it to the second pickup head side. Since the inversion unit is provided, the first pickup head only needs to perform the operation of picking up the flip chip of the chip supply unit and delivering it to the upside-down inversion unit, and the up-down inversion unit only needs to perform up-down inversion. Therefore, the takt time of the first pickup head and the upside-down reversal portion is significantly shortened, and the flip chip can be mounted on the substrate with good workability and high speed. Further, by providing a stage for vacuum-adsorbing the flip chip in the upside down portion, the flip chip can be firmly fixed and turned upside down, and can be delivered to the second pickup head side.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a flip-chip mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged side view of a vertically-inverted portion of the flip-chip mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is an overall configuration diagram of a flip-chip mounting device according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer sheet 2 Flip chip 3 Bump 5 First pickup head 10 Upside down part 11 Rotating member 12 Stage 15 Suction hole 17 Vacuum device 20 Table for positional deviation correction 22 Second pickup head 25 Movable table 26 Substrate 30 Table 31 camera

Claims (2)

[Claims] 1. A first pickup head for picking up a flip chip provided with a bump on an upper surface side of a chip supply section, and a flip chip transferred from the first pickup head to turn the flip chip upside down. By doing so, the upside down portion with the bumps on the lower surface side, the table on which the flip chips upside down by this upside down portion are placed, and the flip chip on the table is picked up and transferred and mounted on the substrate. A flip-chip mounting device comprising: a pickup head; and a positional deviation correcting unit that corrects positional deviation of the flip chip that is vertically inverted by the vertical inversion unit. 2. A rotating member, in which the upside down portion is driven by a rotation driving means to rotate clockwise and counterclockwise,
2. The flip chip mounting apparatus according to claim 1, further comprising a stage which is provided at a front end portion of the rotating member and which holds the flip chip by vacuum suction.