JPH0468547U - - Google Patents

Info

Publication number
JPH0468547U
JPH0468547U JP1990111623U JP11162390U JPH0468547U JP H0468547 U JPH0468547 U JP H0468547U JP 1990111623 U JP1990111623 U JP 1990111623U JP 11162390 U JP11162390 U JP 11162390U JP H0468547 U JPH0468547 U JP H0468547U
Authority
JP
Japan
Prior art keywords
cooling
integrated circuit
cooling pipe
circuit element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990111623U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990111623U priority Critical patent/JPH0468547U/ja
Publication of JPH0468547U publication Critical patent/JPH0468547U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第1図は、本考案の実施例を示す図であり、第
2図は、コールドプレートと冷却パイプの斜視図
であり、第3図は、冷却パイプと冷却カムの分解
斜視図であり、第4図は、本考案の冷却作用を示
す図であり、第5図は、従来例を示す図である。 図において、1……基板、2……LSI、3…
…コールドプレート、4……冷却パイプ、5……
冷却カム、6……スプリング、をそれぞれ示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板1と、 該基板1上に実装された集積回路素子2と、 冷却水が流動する冷却パイプ4と、 該冷却パイプ4をスプリング6によつて支持す
    るコールドプレート3と、 該冷却パイプ4と同心軸上に配置され、且つ該
    集積回路素子2と当接する接点5aを有すること
    で、当該集積回路素子2が発する熱を該冷却パイ
    プ4内の冷却水に伝導する冷却カム5と、 を有することを特徴とする伝導冷却装置。
JP1990111623U 1990-10-26 1990-10-26 Pending JPH0468547U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990111623U JPH0468547U (ja) 1990-10-26 1990-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990111623U JPH0468547U (ja) 1990-10-26 1990-10-26

Publications (1)

Publication Number Publication Date
JPH0468547U true JPH0468547U (ja) 1992-06-17

Family

ID=31859091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990111623U Pending JPH0468547U (ja) 1990-10-26 1990-10-26

Country Status (1)

Country Link
JP (1) JPH0468547U (ja)

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