JPH0468577U - - Google Patents
Info
- Publication number
- JPH0468577U JPH0468577U JP11299890U JP11299890U JPH0468577U JP H0468577 U JPH0468577 U JP H0468577U JP 11299890 U JP11299890 U JP 11299890U JP 11299890 U JP11299890 U JP 11299890U JP H0468577 U JPH0468577 U JP H0468577U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- composite
- glass substrate
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
図は本考案に係る複合基板構造を示す断面図で
ある。
図において、1はコンポジツト基板、2はガラ
ス基板、3はスルーホール、4はチツプ抵抗又は
、チツプ形積層コンデンサである。
The figure is a sectional view showing a composite substrate structure according to the present invention. In the figure, 1 is a composite substrate, 2 is a glass substrate, 3 is a through hole, and 4 is a chip resistor or a chip-type multilayer capacitor.
Claims (1)
ると共に両基板に形成した導電パターンの一部を
電気的に接続して複合基板を構成し、少なくとも
チツプ抵抗又はチツプ形積層セラミツクコンデン
サは前記ガラス基板上の導電パターンにはんだ付
け接続したことを特徴とする複合基板構造。 A glass substrate and a composite substrate are insulated and bonded together, and a part of the conductive pattern formed on both substrates is electrically connected to form a composite substrate, and at least a chip resistor or a chip-shaped multilayer ceramic capacitor is connected to the conductive pattern on the glass substrate. A composite board structure characterized by soldering connections to patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112998U JP2529037Y2 (en) | 1990-10-26 | 1990-10-26 | Composite board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112998U JP2529037Y2 (en) | 1990-10-26 | 1990-10-26 | Composite board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0468577U true JPH0468577U (en) | 1992-06-17 |
| JP2529037Y2 JP2529037Y2 (en) | 1997-03-12 |
Family
ID=31860531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990112998U Expired - Lifetime JP2529037Y2 (en) | 1990-10-26 | 1990-10-26 | Composite board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2529037Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928996A (en) * | 1982-08-06 | 1984-02-15 | 三洋電機株式会社 | Balance ring of dehydrator |
-
1990
- 1990-10-26 JP JP1990112998U patent/JP2529037Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928996A (en) * | 1982-08-06 | 1984-02-15 | 三洋電機株式会社 | Balance ring of dehydrator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2529037Y2 (en) | 1997-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |