JPH0468599U - - Google Patents
Info
- Publication number
- JPH0468599U JPH0468599U JP11111490U JP11111490U JPH0468599U JP H0468599 U JPH0468599 U JP H0468599U JP 11111490 U JP11111490 U JP 11111490U JP 11111490 U JP11111490 U JP 11111490U JP H0468599 U JPH0468599 U JP H0468599U
- Authority
- JP
- Japan
- Prior art keywords
- shield layer
- molded body
- resin molded
- circuit
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
図−１ないし図−４はそれぞれ本考案に係る電
子機器の実施例を示す断面図、図−５は従来の電
子機器を示す断面図である。
１１……樹脂成形体、１２……シールド層、１
３……突起、１４……シールド層付き樹脂成形体
、１５……プリント回路基板、２１……アース回
路導体、２３……セルフタツピングねじ、２４…
…金属パイプ、２５……ナツト、２６……ビス、
２７……ボルト、２８……ナツト、２９……フラ
ンジ。
1 to 4 are cross-sectional views showing embodiments of electronic equipment according to the present invention, and FIG. 5 is a cross-sectional view showing conventional electronic equipment. 11... Resin molded body, 12... Shield layer, 1
3... Protrusion, 14... Resin molded body with shield layer, 15... Printed circuit board, 21... Earth circuit conductor, 23... Self-tapping screw, 24...
...metal pipe, 25...nut, 26...screw,
27...Bolt, 28...Nut, 29...Flange.
Claims (1)
ド層付き樹脂成形体のシールド層側に、プリント
回路基板や電子部品等の回路部材を締付け部材に
より固定してなる電子機器において、シールド層
付き樹脂成形体と回路部材の間に締付け部材を囲
むように金属パイプを介在させ、樹脂成形体のシ
ールド層と回路部材のアース回路導体とを金属パ
イプを介して電気的に接続したことを特徴とする
電子機器。 In an electronic device in which a circuit member such as a printed circuit board or an electronic component is fixed by a fastening member to the shield layer side of a resin molded body with a shield layer to which a shielding material made of metal foil is pasted, the resin molded body with a shield layer is used. An electronic device characterized in that a metal pipe is interposed between circuit members so as to surround a tightening member, and a shield layer of a resin molded body and a ground circuit conductor of the circuit member are electrically connected via the metal pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111490U JPH0468599U (en) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111490U JPH0468599U (en) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468599U true JPH0468599U (en) | 1992-06-17 |
Family
ID=31858530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11111490U Pending JPH0468599U (en) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468599U (en) |
-
1990
- 1990-10-25 JP JP11111490U patent/JPH0468599U/ja active Pending
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