JPH0469752B2 - - Google Patents
Info
- Publication number
- JPH0469752B2 JPH0469752B2 JP60076669A JP7666985A JPH0469752B2 JP H0469752 B2 JPH0469752 B2 JP H0469752B2 JP 60076669 A JP60076669 A JP 60076669A JP 7666985 A JP7666985 A JP 7666985A JP H0469752 B2 JPH0469752 B2 JP H0469752B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- circuits
- block
- wiring board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002950 deficient Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント配線板の検査方法に関し、特
に、回路の欠陥部を溶断して不良品を選別するプ
リント配線板の検査方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a printed wiring board inspection method, and more particularly to a printed wiring board inspection method in which defective parts of a circuit are fused to select defective products. .
（従来の技術）
絶縁基板に印刷回路を設けたプリント配線板
は、現在、種々の電気機器に組み込まれている
が、電気機器の小型化に伴い、小型で高密度のも
のが用いられるようになつてきた。(Prior art) Printed wiring boards, which have printed circuits on insulating substrates, are currently incorporated into various electrical devices, but as electrical devices become smaller, smaller, higher-density boards are being used. I'm getting old.
プリント配線板は、小型で高密度にするために
は、ライン幅の狭い構造となり、ラインに切り欠
け等の損傷部があると、持ち運びの際あるいは使
用時等に容易に断線し易い欠点があつた。 Printed wiring boards have a structure with narrow lines in order to be compact and high-density, and if the lines have damaged parts such as notches, they can easily break when being carried or used. Ta.
そのため、通常は製造工程の段階において、拡
大鏡を用いて目視検査等を行い、断線不良の不良
品をチエツクし選別している。 Therefore, visual inspection using a magnifying glass is usually performed during the manufacturing process to check and sort out defective products with broken wires.
（発明が解決しようとする問題点）
しかしながら、この方法では、検査に要する時
間が長くなり量産が困難であり、また、目視であ
るため検査ミスを生じ易い欠点があつた。(Problems to be Solved by the Invention) However, this method has disadvantages in that the time required for inspection is long, making mass production difficult, and since inspection is performed visually, inspection errors are likely to occur.
これ等の欠点を解決するために、絶縁基板に印
刷された個々の回路に通電流を流して欠陥部分を
溶断する方法が考えられる。が、単独の回路数の
多いプリント配線板の場合、過電流をその回路数
分だけ通電しなければならず、検査時間はあまり
短縮されず、自動化の長所を生かせない欠点があ
る。 In order to solve these drawbacks, a method can be considered in which a current is passed through each circuit printed on an insulating substrate to blow out the defective portion. However, in the case of a printed wiring board with a large number of individual circuits, the overcurrent must be applied for the number of circuits, so the inspection time is not reduced much and the advantages of automation cannot be utilized.
本発明の目的は、以上の欠点を改良し、断線不
良となり易い欠陥回路を有するプリント配線板を
短時間にかつ確実にチエツクでき、自動化の可能
なプリント配線板の検査方法を提供するものであ
る。 An object of the present invention is to improve the above-mentioned drawbacks, and to provide a method for inspecting printed wiring boards that can be automated and that can quickly and reliably check printed wiring boards that have defective circuits that are prone to disconnections. .
（問題点を解決するための手段）
本発明は、上記の目的を達成するために、プリ
ント配線板の回路に通電流を流し欠陥部を溶断す
るプリント配線板の検査方法において、任意個数
の回路を直列接続してブロツク化し、該ブロツク
に過電流を流して前記回路の欠陥部を溶断するこ
とを特徴とするプリント配線板の検査方法を提供
するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for inspecting a printed wiring board in which a current is passed through the circuits of the printed wiring board to melt down defective parts. The present invention provides a method for inspecting a printed wiring board, characterized in that circuits are connected in series to form blocks, and defective portions of the circuits are blown out by passing an overcurrent through the blocks.
（作用）
本発明によれば、多数の独立した回路を幾つか
にまとめてブロツク化し、ブロツク内の回路を互
いに直列接続し、ブロツク毎に過電流を流して回
路の欠陥部を溶断しているために、過電流の通電
回数を減少でき、検査に要する時間を短縮でき
る。また、過電流により欠陥部を溶断するため、
検出ミスを防止でき自動化が可能となる。(Function) According to the present invention, a large number of independent circuits are grouped into several blocks, the circuits in the blocks are connected in series with each other, and an overcurrent is applied to each block to blow out defective parts of the circuit. Therefore, the number of overcurrent energizations can be reduced, and the time required for inspection can be shortened. In addition, because the defective part is fused due to overcurrent,
Detection errors can be prevented and automation possible.
なお、通常、ブロツクは複数個となるが、回路
が少ない場合には全体を直列接続して１ブロツク
としてもよい。 Note that normally there are a plurality of blocks, but if the number of circuits is small, they may all be connected in series to form one block.
（実施例）
以下、本発明の実施例を図面に基づいて説明す
る。(Example) Hereinafter, an example of the present invention will be described based on the drawings.
第２図において、１はプリント配線板であり、
互いに電気的に独立して多数の回路２が印刷され
ている。 In FIG. 2, 1 is a printed wiring board,
A large number of circuits 2 are printed electrically independent of each other.
また、第３図において、３はピンボードであ
り、回路２のランド４の位置に対応して接触ピン
５が貫設されている。そして両端の接触ピン５を
除いて、互いに隣り合う接触ピン５が接続コード
６により一つおきに電気的に接続されている。 Further, in FIG. 3, reference numeral 3 denotes a pin board, through which contact pins 5 are provided corresponding to the positions of the lands 4 of the circuit 2. Except for the contact pins 5 at both ends, every other contact pin 5 adjacent to each other is electrically connected by a connection cord 6.
第１図は、本発明方法により不良品を検出する
場合の回路図を示す。プリント配線板１の回路２
は、ピンボード３の接触ピン５を回路２のランド
４に接触することにより、複数個が直列接続さ
れ、ブロツク７−１〜７−５に区分けされてい
る。端部に設けられた接触ピン５は、一方は電源
８に接続され、他方は切替スイツチ９の一端に接
続されている。また、切替スイツチ９の他端は電
源８に接続されている。 FIG. 1 shows a circuit diagram when defective products are detected by the method of the present invention. Circuit 2 of printed wiring board 1
are connected in series by contacting the contact pins 5 of the pin board 3 with the lands 4 of the circuit 2, and are divided into blocks 7-1 to 7-5. One end of the contact pin 5 provided at the end is connected to a power source 8, and the other end is connected to one end of a changeover switch 9. Further, the other end of the changeover switch 9 is connected to a power source 8.
上記実施例に基づいて不良品を検出するには、
先ず、切替スイツチ９をブロツク７−１に接続し
て過電流を所定時間、ブロツク７−１に流す。こ
の時、ブロツク７−１内の回路２が一つでも溶断
すれば、不良品として処理する。ブロツク７−１
内の回路２が溶断されない場合には、切替スイツ
チ９をブロツク７−２に接続して同様な処理を行
う。以下、ブロツク７−５まで上記処理を繰り返
す。 To detect defective products based on the above example,
First, the changeover switch 9 is connected to the block 7-1, and an overcurrent is applied to the block 7-1 for a predetermined period of time. At this time, if even one circuit 2 in the block 7-1 is blown out, it is treated as a defective product. Block 7-1
If the circuit 2 in the block 7-2 is not fused, the changeover switch 9 is connected to the block 7-2 and the same process is performed. Thereafter, the above processing is repeated up to block 7-5.
すなわち、上記実施例によれば、互いに独立し
た回路２を複数個まとめて１ブロツクにし、接触
ピン５を用いてこのブロツク内の回路２を直列接
続し、一回の通電により１ブロツク内の回路２の
欠陥部を検出できる。そのために、欠陥部の検出
に要する時間は大幅に短縮され、検出ミスもなく
なる。 That is, according to the above embodiment, a plurality of mutually independent circuits 2 are combined into one block, and the circuits 2 in this block are connected in series using the contact pin 5, and the circuits in one block are connected in series by one energization. 2 defects can be detected. Therefore, the time required to detect defective parts is significantly shortened and detection errors are eliminated.
例えば、独立した回路を300個有するプリント
配線板を検査する場合、回路を15個づつ20ブロツ
クに分ける。15個の回路を直列接続すると、抵抗
はほぼ0.5〜１〔Ω〕となる。それ故、電圧15〔Ｖ〕
の定電圧定電流の電源を用いて、１ブロツク当た
り15〜30〔Ａ〕の過電流を最大0.1秒間流す。切替
スイツチの切替えに要する時間は、半導体を用い
た場合には、通常、最大0.05秒間である。従つ
て、20ブロツクの検査に要する時間は（0.1＋
0.05）×20＝３秒である。これに対して、300個の
回路を個個に過電流を流して検査する場合には、
回路の通電時間だけで30秒かかる。 For example, when inspecting a printed wiring board with 300 independent circuits, divide the circuits into 20 blocks of 15 each. If 15 circuits are connected in series, the resistance will be approximately 0.5 to 1 [Ω]. Therefore, the voltage is 15 [V]
Using a constant voltage constant current power supply, an overcurrent of 15 to 30 [A] is applied to each block for a maximum of 0.1 seconds. The time required for switching the changeover switch is usually a maximum of 0.05 seconds when semiconductors are used. Therefore, the time required to inspect 20 blocks is (0.1 +
0.05)×20=3 seconds. On the other hand, when testing 300 circuits by applying overcurrent to each one,
It takes 30 seconds just to energize the circuit.
（発明の効果）
以上の通り、本発明によれば、回路を複数のブ
ロツクに区分けし、ブロツク毎に過電流を流して
欠陥部を溶断する方法により不良品の検査を行な
つているために、検査時間を大幅に短縮でき、か
つミスなく検査でき、自動化の可能なプリント配
線板の検査方法が得られる。(Effects of the Invention) As described above, according to the present invention, defective products are inspected by dividing a circuit into a plurality of blocks and blowing out defective parts by passing an overcurrent in each block. , a printed wiring board inspection method that can significantly shorten inspection time, perform error-free inspection, and can be automated is obtained.
第１図はプリント配線板の平面図、第２図はピ
ンボードの側面断面図、第３図は本発明の実施例
の回路図を示す。
１……プリント配線板、２……回路、７−１〜
７−ｎ……ブロツク、８……電源。
FIG. 1 is a plan view of a printed wiring board, FIG. 2 is a side sectional view of a pin board, and FIG. 3 is a circuit diagram of an embodiment of the present invention. 1...Printed wiring board, 2...Circuit, 7-1~
7-n...Block, 8...Power supply.
Claims (1)
を溶断するプリント配線板の検査方法において、
任意個数の回路を直列接続してブロツク化し、該
ブロツクに過電流を流して前記回路の欠陥部を溶
断することを特徴とするプリント配線板の検査方
法。1. In a printed wiring board inspection method in which an overcurrent is applied to the printed wiring board circuit to melt down defective parts,
1. A method for inspecting a printed wiring board, which comprises connecting an arbitrary number of circuits in series to form a block, and passing an overcurrent through the block to blow out a defective portion of the circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076669A JPS61235765A (en) | 1985-04-12 | 1985-04-12 | Inspecting method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076669A JPS61235765A (en) | 1985-04-12 | 1985-04-12 | Inspecting method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61235765A JPS61235765A (en) | 1986-10-21 |
| JPH0469752B2 true JPH0469752B2 (en) | 1992-11-09 |
Family
ID=13611820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60076669A Granted JPS61235765A (en) | 1985-04-12 | 1985-04-12 | Inspecting method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61235765A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002357628A (en) * | 2001-06-04 | 2002-12-13 | Denki Kagaku Kogyo Kk | Inspection method for metal-based circuit boards |
-
1985
- 1985-04-12 JP JP60076669A patent/JPS61235765A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61235765A (en) | 1986-10-21 |
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