JPH0470795B2 - - Google Patents

Info

Publication number
JPH0470795B2
JPH0470795B2 JP1073652A JP7365289A JPH0470795B2 JP H0470795 B2 JPH0470795 B2 JP H0470795B2 JP 1073652 A JP1073652 A JP 1073652A JP 7365289 A JP7365289 A JP 7365289A JP H0470795 B2 JPH0470795 B2 JP H0470795B2
Authority
JP
Japan
Prior art keywords
metal plate
adhesive layer
electronic component
insulating adhesive
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1073652A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02347A (ja
Inventor
Tooru Higuchi
Toshuki Yamaguchi
Takeshi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP1073652A priority Critical patent/JPH02347A/ja
Publication of JPH02347A publication Critical patent/JPH02347A/ja
Publication of JPH0470795B2 publication Critical patent/JPH0470795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1073652A 1989-03-24 1989-03-24 電子部品チップ用チップキャリア Granted JPH02347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1073652A JPH02347A (ja) 1989-03-24 1989-03-24 電子部品チップ用チップキャリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1073652A JPH02347A (ja) 1989-03-24 1989-03-24 電子部品チップ用チップキャリア

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP19345085A Division JPS6252992A (ja) 1985-09-02 1985-09-02 電子素子用チツプキヤリア

Publications (2)

Publication Number Publication Date
JPH02347A JPH02347A (ja) 1990-01-05
JPH0470795B2 true JPH0470795B2 (de) 1992-11-11

Family

ID=13524433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1073652A Granted JPH02347A (ja) 1989-03-24 1989-03-24 電子部品チップ用チップキャリア

Country Status (1)

Country Link
JP (1) JPH02347A (de)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694074U (de) * 1979-12-20 1981-07-25
JPS5753674U (de) * 1980-09-12 1982-03-29
JPS59217385A (ja) * 1983-05-25 1984-12-07 イビデン株式会社 プリント配線基板

Also Published As

Publication number Publication date
JPH02347A (ja) 1990-01-05

Similar Documents

Publication Publication Date Title
EP0262965B1 (de) Substrate für gedruckte Schaltung
US4835598A (en) Wiring board
US4858073A (en) Metal substrated printed circuit
JP3198796B2 (ja) モールドモジュール
US6002169A (en) Thermally enhanced tape ball grid array package
US6212076B1 (en) Enhanced heat-dissipating printed circuit board package
US6130477A (en) Thin enhanced TAB BGA package having improved heat dissipation
KR950024311A (ko) 얇은 회로기판과 반도체 장치가 접합되어 있는 열전도성 지지부재를 갖춘 전자 패키지
KR19990062684A (ko) 집적 회로 패키지 및 이를 기판에 접속하는 방법
US20240114614A1 (en) Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor Embedded
US5528458A (en) Integrated circuit device and its manufacturing method
CN115280495A (zh) 功率模块
KR102553052B1 (ko) 방열형 회로기판 및 그 제조 방법
JP2973646B2 (ja) ベアチップｌｓｉの実装構造
JPH0470795B2 (de)
JPH07321471A (ja) 多層基板
KR100328251B1 (ko) 패키지 기판
JPH07297518A (ja) 電子部品の実装構造
JPH0362956A (ja) 半導体チップキャリア
KR20010057046A (ko) 캐비티를 갖는 패키지 기판
JPS61147554A (ja) ハイブリツドｉｃモジユ−ル
JPS6252991A (ja) 電子素子用チツプキヤリア
JPS60236279A (ja) 配線用板
JP2001102760A (ja) 多層金属プリント基板
JPH0360191B2 (de)