JPH0471664B2 - - Google Patents

Info

Publication number
JPH0471664B2
JPH0471664B2 JP60161493A JP16149385A JPH0471664B2 JP H0471664 B2 JPH0471664 B2 JP H0471664B2 JP 60161493 A JP60161493 A JP 60161493A JP 16149385 A JP16149385 A JP 16149385A JP H0471664 B2 JPH0471664 B2 JP H0471664B2
Authority
JP
Japan
Prior art keywords
polishing
workpiece
plate
holding
polishing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60161493A
Other languages
Japanese (ja)
Other versions
JPS6224955A (en
Inventor
Takashi Myatani
Yasuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60161493A priority Critical patent/JPS6224955A/en
Publication of JPS6224955A publication Critical patent/JPS6224955A/en
Publication of JPH0471664B2 publication Critical patent/JPH0471664B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、被加工物のエツジ部に生じたバリ
を除去するための面取り装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a chamfering device for removing burrs formed on the edges of a workpiece.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

たとえば、金属部品、プラスチツク部品あるい
はセラミツク部品などの種々の被加工物は、これ
らを成形することによつてそのエツジ部にバリが
発生することがどうしても避けられない。したが
つて、このような被加工物は所定形状に形成した
のち、バリを取る面取り加工を行なわなければな
らない。
For example, when various workpieces such as metal parts, plastic parts, and ceramic parts are formed, it is inevitable that burrs will be generated on the edges thereof. Therefore, after forming such a workpiece into a predetermined shape, it must be chamfered to remove burrs.

従来、このような被加工物の面取り加工として
は、容器内に被加工物と砥粒とを投入して上記容
器を回転させて行なう、いわゆるバレル加工が知
られている。しかしながら、このようなバレル加
工では、容器内を被加工物とともに砥粒が自由に
動き回るので、被加工物は砥粒によつてバリが発
生しているエツジ部以外の箇所も研磨されること
になり、この被加工物の寸法が小さくなつてしま
うということがあつた。また、容器内で被加工物
同士が互いにぶつかり合うので、被加工物の表面
に傷が付くということもあつた。さらに、バレル
加工は、被加工物のバリが除去されるまでにかな
りの時間が掛かるということもあつた。
Conventionally, so-called barrel machining is known as a method for chamfering such a workpiece, in which the workpiece and abrasive grains are put into a container and the container is rotated. However, in this type of barrel machining, the abrasive grains move freely within the container along with the workpiece, so the workpiece is polished by the abrasive grains in areas other than the edges where burrs are generated. As a result, the dimensions of this workpiece became smaller. Furthermore, since the workpieces collide with each other within the container, the surfaces of the workpieces may be scratched. Furthermore, barrel machining sometimes takes a considerable amount of time to remove burrs from the workpiece.

〔発明の目的〕[Purpose of the invention]

この発明は、被加工物がエツジ部以外の部分を
研磨されてその寸法が小さくなつたり、互いにぶ
つかり合つて表面に傷が付くなどのことがなく、
しかも能率よく確実にバリを除去することができ
るようにした面取り装置を提供することにある。
This invention prevents parts of the workpieces other than the edges from being polished and their dimensions becoming smaller, or from colliding with each other and causing scratches on the surface.
Moreover, it is an object of the present invention to provide a chamfering device that can efficiently and reliably remove burrs.

〔発明の概要〕[Summary of the invention]

この発明は、被加工物を回転自在に保持する保
持孔が形成されほぼ水平に保持された保持板と、
この保持板の下面に対向して配置され上記保持孔
に保持された被加工物と接触した状態で回転駆動
される研磨体と、上記保持板の上面に対向して配
設され上記被加工物のエツジ部が上記研磨体によ
つて摩擦されるときにこの被加工物を弾性的に押
圧する弾性体が下面に設けられた規制板とを具備
した面取り装置である。
The present invention includes a holding plate formed with a holding hole for rotatably holding a workpiece and held substantially horizontally;
A polishing body is arranged opposite to the lower surface of the holding plate and rotates while being in contact with the workpiece held in the holding hole; This chamfering device includes a regulating plate provided on the lower surface of the elastic body that elastically presses the workpiece when the edge portion is rubbed by the polishing body.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図面を参照して説
明する。第1図に示す面取り装置は円盤状の研磨
体1を有する。この研磨体1の上面はたとえば砥
粒を取着するなどして研磨面3に形成され、下面
の中央には図示せぬ駆動源によつて回転駆動され
る駆動軸5が固着されている。この研磨体1の上
面側には保持板7が離間対向して配設されてい
る。この保持板7の外周からは複数の取付け片9
が延出され、これらの取付け片9は固定部11に
ねじ13によつて取付け固定されている。また、
保持板7にはこの回転中心から等しい半径で多数
の保持孔15…が穿設されている。そして、これ
らの保持孔15…にはたとえば断面が六角形をな
した多面体状の被加工物17…がそれぞれ入れら
れている。つまり、被加工物17…は上記研磨体
1の研磨面3に接触し、かつ自由に回転できる状
態で上記保持孔15…に保持されている。上記保
持板7の上面側には規制板19が配置されてい
る。この規制板19の下面には、たとえばゴムな
どの材料からなる弾性体20が貼着され、上面の
中心部には図示せぬ駆動源によつて回転駆動され
る駆動軸21が連結されている。上記弾性体20
と研磨体1との間隔は、被加工物17…がそのエ
ツジ部17a…を研磨体1に接触させたときにこ
の被加工物17…を弾性的に押圧し、被加工物1
7…がその平坦面17b…を接触させているとき
には押圧されない状態に設定されている。つま
り、研磨体1と弾性体20との間隔は被加工物1
7…の対角線寸法dよりもわずかに小さく設定さ
れている。さらに、規制板19の上面には突起2
5が環状に突設され、これよりも径方向内方の部
分には複数の通孔23…が周方向に所定間隔で穿
設されている。そして、この規制板19の上面側
の突起25の内側の箇所には研磨液Lが供給管2
7によつて供給されるようになつている。この研
磨液Lは上記通孔23…を通つて上記研磨体1の
上面に導かれる。このとき、規制板19が回転駆
動されていれば、研磨液Lは研磨体1の上面にほ
ぼ均一に分散されて供給されることになる。上記
供給管27にはポンプ29が接続され、このポン
プ29の吸込側は研磨液Lが収容されたタンク3
1に連通している。なお、詳細は図示しないが、
上記供給管27から研磨体1に供給された研磨液
Lは上記タンク31に回収されるようになつてい
る。また、規制板19は駆動軸21とともに上
方、つまり保持板7から離間する方向に移動させ
ることができるようになつている。
An embodiment of the present invention will be described below with reference to the drawings. The chamfering device shown in FIG. 1 has a disc-shaped polishing body 1. The chamfering device shown in FIG. The upper surface of this polishing body 1 is formed into a polishing surface 3 by, for example, attaching abrasive grains, and a drive shaft 5 that is rotationally driven by a drive source (not shown) is fixed to the center of the lower surface. A holding plate 7 is arranged on the upper surface side of the polishing body 1 so as to be spaced apart from each other and facing each other. A plurality of mounting pieces 9 are attached from the outer periphery of this holding plate 7.
are extended, and these attachment pieces 9 are attached and fixed to the fixed part 11 with screws 13. Also,
A large number of holding holes 15 are bored in the holding plate 7 at equal radii from the center of rotation. For example, polyhedral workpieces 17 having a hexagonal cross section are inserted into these holding holes 15, respectively. That is, the workpieces 17 are held in the holding holes 15 in a state where they are in contact with the polishing surface 3 of the polishing body 1 and can freely rotate. A regulating plate 19 is arranged on the upper surface side of the holding plate 7. An elastic body 20 made of a material such as rubber is attached to the lower surface of the regulation plate 19, and a drive shaft 21 that is rotationally driven by a drive source (not shown) is connected to the center of the upper surface. . The elastic body 20
The distance between the workpiece 17 and the polishing body 1 is determined by elastically pressing the workpiece 17 when the workpiece 17 brings its edge portion 17a into contact with the polishing body 1.
7... is set in a state in which it is not pressed when the flat surfaces 17b... are in contact with each other. In other words, the distance between the polishing body 1 and the elastic body 20 is
7... is set slightly smaller than the diagonal dimension d. Further, a projection 2 is provided on the upper surface of the regulation plate 19.
5 protrudes in an annular shape, and a plurality of through holes 23 are bored at predetermined intervals in the circumferential direction in a portion radially inward from this. The polishing liquid L is supplied to the supply pipe 2 at a location inside the protrusion 25 on the upper surface side of this regulation plate 19.
7. This polishing liquid L is guided to the upper surface of the polishing body 1 through the through holes 23 . At this time, if the regulating plate 19 is rotationally driven, the polishing liquid L will be supplied to the upper surface of the polishing body 1 in a substantially uniformly distributed manner. A pump 29 is connected to the supply pipe 27, and a suction side of the pump 29 is connected to a tank 3 containing polishing liquid L.
It is connected to 1. Although details are not shown,
The polishing liquid L supplied to the polishing body 1 from the supply pipe 27 is collected into the tank 31. Further, the regulating plate 19 can be moved upward together with the drive shaft 21, that is, in a direction away from the holding plate 7.

このように構成された面取り装置においては、
規制板19を保持板7から離間させてこの保持板
7の保持孔15…に被加工物17…を保持したな
らば、上記規制板19をその下面に設けられた弾
性体20と研磨体1との間隔が被加工物17…の
対角線寸法dよりもわずかに小さくなる状態に位
置決めする。この状態で研磨液Lを供給するとと
もに、研磨体1を回転駆動する。すると、保持孔
15…に回転自在に保持された被加工物17…が
研磨面3との接触摩擦によつてこの研磨面3で研
磨されながら回転する。そして、被加工物17…
のエツジ部17a…が研磨面3に接触したとき、
この被加工物17…は、規制板19に設けられた
弾性体20によつて第3図に示すように上記研磨
面3に押圧される。したがつて、被加工物17…
のエツジ部17a…と研磨面3との摩擦力が一時
的に増大するから、そのエツジ部17a…にある
バリが確実かつ迅速に研磨除去されることにな
る。また、被加工物17…は、第4図に示すよう
に、そのエツジ部17a…以外の平坦面17b…
も研磨面3と接触するが、そのときは弾性体21
によつて押圧されないから、エツジ部17a…に
比べて研磨面3との接触抵抗が小さく、ほとんど
研磨されることがない。また、被加工物17…
は、それぞれ保持孔15…に保持されているた
め、互いにぶつかりあつて表面に傷が付くという
ことがない。また、規制板19を回転させれば、
研磨液Lが均一に分散されるばかりか、その下面
の弾性体20の被加工物17…が接触したときに
これを強制的に回転させるから、このことによつ
てもエツジ部17a…のバリが良好に除去され
る。
In the chamfering device configured in this way,
When the regulating plate 19 is separated from the holding plate 7 and the workpiece 17 is held in the holding hole 15 of the holding plate 7, the regulating plate 19 is moved between the elastic body 20 provided on the lower surface and the polishing body 1. The workpieces 17 are positioned so that the distance therebetween is slightly smaller than the diagonal dimension d of the workpieces 17. In this state, the polishing liquid L is supplied and the polishing body 1 is rotationally driven. Then, the workpieces 17 rotatably held in the holding holes 15 rotate while being polished by the polishing surface 3 due to contact friction with the polishing surface 3. And the workpiece 17...
When the edge portion 17a... of comes into contact with the polishing surface 3,
The workpieces 17 are pressed against the polishing surface 3 by an elastic body 20 provided on the regulating plate 19, as shown in FIG. Therefore, the workpiece 17...
Since the frictional force between the edge portions 17a and the polishing surface 3 is temporarily increased, the burr on the edge portions 17a is reliably and quickly removed by polishing. Moreover, as shown in FIG. 4, the workpieces 17... have flat surfaces 17b... other than the edge portions 17a...
also comes into contact with the polishing surface 3, but at that time the elastic body 21
Since it is not pressed by the edge portions 17a, the contact resistance with the polishing surface 3 is smaller than that of the edge portions 17a, so that they are hardly polished. In addition, the workpiece 17...
are held in the holding holes 15, respectively, so that they do not collide with each other and cause scratches on the surface. Moreover, if the regulation plate 19 is rotated,
Not only is the polishing liquid L uniformly dispersed, but the elastic body 20 on the lower surface is forcibly rotated when it comes into contact with the workpiece 17, which also prevents burrs on the edge portions 17a. is effectively removed.

なお、上記一実施例では研磨体に砥粒を取着し
て研磨面を形成したが、上記研磨体を鋳鉄や非鉄
金属などで形成する一方、研磨液にアルミナやケ
イ素などの微粉を混入させ、この研磨液と上記研
磨体とで被加工物を研磨するようにしてもよい。
また、規制板に対して駆動軸を偏心して取着し、
この規制板を偏心回転させれば、規制板に取着さ
れた弾性体により被加工物があらゆる方向に回転
させられるから、これによつて被加工物のバリ取
り加工の能率向上が計れる。さらに、研磨体と規
制板との回転中心をずらすことによつても被加工
物をあらゆる方向に回転させてそのバリ取り加工
を良好に行なうことができる。
In the above embodiment, abrasive grains were attached to the polishing body to form the polishing surface, but while the polishing body was made of cast iron or non-ferrous metal, it was also possible to mix fine powder such as alumina or silicon into the polishing liquid. The workpiece may be polished using this polishing liquid and the polishing body.
In addition, the drive shaft is mounted eccentrically with respect to the regulation plate,
By eccentrically rotating this regulating plate, the workpiece can be rotated in all directions by the elastic body attached to the regulating plate, thereby improving the efficiency of deburring the workpiece. Furthermore, by shifting the rotation centers of the polishing body and the regulating plate, the workpiece can be rotated in all directions and deburring can be performed satisfactorily.

〔発明の効果〕〔Effect of the invention〕

以上述べたようにこの発明は、被加工物を保持
板の保持孔に回転自在に保持するとともに、上記
保持板の下面側に上記被加工物に接触させて研磨
体を配設し、上面側には規制板を配設し、この規
制板の下面に上記被加工物のエツジ部が研磨体の
上面で研磨されるときにこの被加工物を弾性的に
押圧する弾性体を設けた。したがつて、従来のバ
レル加工のように被加工物相互がぶつかりあつて
表面に傷が付くということがない。また、被加工
物はそのエツジ部が研磨体に接触したときには弾
性体に押圧されて強く研磨されるが、他の部分が
研磨体に接触しているときには弾性体に押圧され
ないからエツジ部のように強く研磨されることが
ない。したがつて、被加工物のエツジ部以外の部
分が必要以上に研磨されてその形状が小さくなる
ということがない。さらに、研磨体と規制板を回
転駆動させ且つ通孔を介して研磨部位に研磨液を
供給するようにしているので、面取り加工を能率
良く且つ確実に行なうことができるなどの利点を
有する。
As described above, the present invention rotatably holds a workpiece in a holding hole of a holding plate, and a polishing body is disposed on the lower surface side of the holding plate in contact with the workpiece, and the polishing body is disposed on the lower surface side of the holding plate, and A regulating plate is disposed on the lower surface of the regulating plate, and an elastic body is provided on the lower surface of the regulating plate to elastically press the workpiece when the edge portion of the workpiece is polished by the upper surface of the polishing body. Therefore, unlike conventional barrel machining, the workpieces do not collide with each other and cause scratches on the surface. In addition, when the edges of the workpiece come into contact with the polishing body, they are pressed by the elastic body and are strongly polished, but when other parts are in contact with the polishing body, they are not pressed by the elastic body. It will not be strongly polished. Therefore, the portions other than the edge portions of the workpiece will not be polished more than necessary and the shape of the workpiece will not become smaller. Furthermore, since the polishing body and the regulating plate are driven to rotate and the polishing liquid is supplied to the polishing area through the through hole, there is an advantage that chamfering can be carried out efficiently and reliably.

【図面の簡単な説明】[Brief explanation of drawings]

図面はこの発明の一実施例を示し、第1図は装
置全体の概略的構成図、第2図は保持板の平面
図、第3図は被加工物が弾性体によつて押圧され
た状態の拡大図、第4図は同じく押圧されていな
い状態の拡大図である。 1……研磨体、5……駆動軸(第1の回転駆動
手段)、7……保持板、15……保持孔、17…
…被加工物、19……規制板、20……弾性体、
21……駆動軸(第2の回転駆動手段)、23…
…通孔、27……供給管(研磨液供給手段)、L
……研磨液。
The drawings show an embodiment of the present invention, in which Fig. 1 is a schematic configuration diagram of the entire device, Fig. 2 is a plan view of the holding plate, and Fig. 3 shows a state in which the workpiece is pressed by an elastic body. FIG. 4 is an enlarged view of the unpressed state. DESCRIPTION OF SYMBOLS 1... Polishing body, 5... Drive shaft (first rotational drive means), 7... Holding plate, 15... Holding hole, 17...
...Workpiece, 19...Regulation plate, 20...Elastic body,
21... Drive shaft (second rotational drive means), 23...
...Through hole, 27... Supply pipe (polishing liquid supply means), L
...polishing liquid.

Claims (1)

【特許請求の範囲】 1 エツジ部を有する被加工物を回転自在に保持
する保持孔が形成されほぼ水平に保持された保持
板と、この保持板の下面に対向して配置され上記
保持孔に保持された被加工物のエツジ部を研磨す
る研磨体と、この研磨体を回転駆動する第1の回
転駆動手段と、上記保持板の上面に対向して配設
された規制板と、この規制板を回転駆動する第2
の回転駆動手段と、上記規制板の下面に上記研磨
体の上面と対向して設けられ上記保持板に保持さ
れている被加工物を上記研磨体に弾性的に押圧す
る弾性体と、この弾性体と上記規制板との厚さ方
向に貫通して設けられた複数の通孔と、これら通
孔を介して上記研磨体の上面側に研磨液を供給す
る研磨液供給手段とを具備し、上記弾性体と上記
研磨体との間隔は上記被加工物の最大外形寸法よ
りもわずかに小さく設定されていることを特徴と
する面取り装置。 2 上記規制板と上記研磨体との回転中心はずれ
ていることを特徴とする特許請求の範囲第1項記
載の面取り装置。
[Scope of Claims] 1. A holding plate having a holding hole for rotatably holding a workpiece having an edge portion and held substantially horizontally; A polishing body for polishing the edge portion of the held workpiece, a first rotational drive means for rotationally driving the polishing body, a regulating plate disposed opposite to the upper surface of the holding plate, and the regulating plate. A second drive that rotates the plate.
an elastic body provided on the lower surface of the regulating plate facing the upper surface of the polishing body and elastically pressing the workpiece held by the holding plate against the polishing body; a plurality of through holes provided through the body and the regulating plate in the thickness direction, and a polishing liquid supply means for supplying polishing liquid to the upper surface side of the polishing body through these through holes, A chamfering device characterized in that a distance between the elastic body and the polishing body is set to be slightly smaller than a maximum external dimension of the workpiece. 2. The chamfering device according to claim 1, wherein the rotation centers of the regulating plate and the polishing body are shifted from each other.
JP60161493A 1985-07-22 1985-07-22 Chamfering device Granted JPS6224955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60161493A JPS6224955A (en) 1985-07-22 1985-07-22 Chamfering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60161493A JPS6224955A (en) 1985-07-22 1985-07-22 Chamfering device

Publications (2)

Publication Number Publication Date
JPS6224955A JPS6224955A (en) 1987-02-02
JPH0471664B2 true JPH0471664B2 (en) 1992-11-16

Family

ID=15736116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60161493A Granted JPS6224955A (en) 1985-07-22 1985-07-22 Chamfering device

Country Status (1)

Country Link
JP (1) JPS6224955A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS452078Y1 (en) * 1965-12-24 1970-01-28
JPS4915441A (en) * 1972-05-18 1974-02-09
JPS5515953Y2 (en) * 1975-07-15 1980-04-14

Also Published As

Publication number Publication date
JPS6224955A (en) 1987-02-02

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