JPH0472080A - Etching device - Google Patents

Abstract

PURPOSE:To efficiently avoid the side etching alpha, etc., by opposing the surface of a work to be treated to the liq. injection hole of a spray pipe and vertically moving the work in a liq. etchant. CONSTITUTION:The surface S of a work to be treated is etched with a liq. etchant 15 delivered from a spray pipe 16 opposed to a work 1 dipped in the etchant 15. The work 1 is vertically moved when etched by a cam mechanism 10. The fresh etchant 15 is always brought into contact with the surface S of the work 1 as the laminar flow of the etchant 15, and consequently the infiltration of the etchant 15 into the work 1 is reduced.

Description

[Detailed Description of the Invention] [Summary] Regarding an etching device used in the manufacturing process of printed circuit boards, etc., the purpose of the present invention is to provide an etching device that can obtain highly accurate patterns. a processing tank arranged to be immersed in the etching solution;
The apparatus is equipped with a cam mechanism for vertically moving a work in the etching solution, the workpiece being arranged with its processing surface facing the liquid injection hole of the spray tube.

[Industrial Application Field] The present invention relates to an etching apparatus used in the manufacturing process of printed circuit boards and the like.

[Conventional technology]

FIGS. 4(a), 4(b), and 4(c) are diagrams showing an example of the configuration of a conventional etching apparatus and the etching results, in which (a) is a schematic side sectional view of the main part of the immersion type etching apparatus; b) is a schematic side view of the main part of the spray type etching device, (C)
is a schematic side sectional view of a main part showing etching results using these conventional devices.

As shown in FIG. 4(a), the immersion type etching apparatus includes a processing tank 2OA and a liquid circulation section 55 for circulating the etching solution 15 in the processing tank 2OA. This liquid circulation section 55, which is composed of a pump 50, a suction pipe 51, and a delivery pipe 52, returns the etching solution 15 sucked in from the suction pipe 51 into the processing tank 20A from the delivery pipe 52 using the pump 50, and sends it in the direction of the arrow. circulate. As is clear from the figure, this etching apparatus is an apparatus that etches the workpiece 1 by immersing it in the etching liquid 15 in the processing tank 2OA. shows.

4) is a spray type etching device, which includes a belt pulley 31, a conveyor belt 30 driven by the belt pulley 31, and a plurality of etching devices arranged above the conveyor belt 30. It is composed of a spray pipe 16. This etching device has a conveyor belt 30
Etching is carried out by spraying the etching liquid 15 from a liquid injection hole (not shown) of the spray pipe 16 onto the workpiece 1 placed on top and moving in the direction of the arrow.

[Problems to be Solved by the Invention] These conventional etching devices, whether of the immersion type shown in FIG. 4(a) or the spray type shown in FIG. There is a tendency for the etching liquid 15 to permeate inward from the treated surface S of the resist 3. Therefore, the side etching phenomenon α as shown in FIG. 4(C) or the surface etching phenomenon (this phenomenon is caused by Peeling, etc. (which is thought to be due to damage to the resist 3), etc. occurs. Note that when etching a workpiece 1 with a multilayer film, the etching speed of the inner layer is faster than the surface layer (the surface layer is made of, for example, chromium, the middle layer is made of, for example, aluminum, and the lower layer is made of, for example, titanium). This is the case in cases where the side etch phenomenon □ is configured as follows.

The object of the present invention is to provide an etching apparatus that can efficiently avoid the occurrence of the side etching phenomenon α.

Means for Solving Ran] As shown in FIGS. 1 and 3, the etching apparatus according to the present invention is arranged such that a spray pipe 16 that sprays an etching liquid 15 in a horizontal direction is immersed in the etching liquid 15. The treatment tank 20 and the treatment surface S are connected to the spray pipe 16.
A cam mechanism 10 is provided for vertically moving a workpiece 1 placed so as to face a liquid injection hole 17 in the etching liquid 15.

[For production]

This etching apparatus is arranged such that the processing surface S of the work l immersed in the etching liquid 15 faces the liquid injection hole 17 of the spray pipe 16.

Since the workpiece 1 is moved in the vertical direction by the cam mechanism 10, a phenomenon in which the etching liquid 15 penetrates into the interior from the processing surface S of the workpiece 1 is avoided. Therefore, compared to conventional etching equipment, the incidence of side etching phenomena α etc. is lower, so that high quality patterns can be obtained.

〔Example〕

EMBODIMENT OF THE INVENTION The present invention will be described in detail below based on embodiment figures.

FIG. 1 is a schematic side sectional view of essential parts showing an embodiment of the present invention;
FIG. 2 is a schematic perspective view showing an example of the configuration of a cam mechanism used in the present invention, and FIG. 3 is a schematic perspective view of essential parts showing the operation of the etching apparatus according to the present invention, which is the same as FIG. 4. Parts are given the same reference numerals.

As shown in FIG. 1, the etching apparatus according to the present invention includes:
Etching liquid 15 sent via delivery pipe 52
a processing tank 20 equipped with a spray pipe 16 for horizontally spraying etching liquid 15 immersed in the etching liquid 15;
The treatment surface S is connected to the liquid injection hole 17 (third
The apparatus is equipped with a cam mechanism 10 that moves a workpiece 1, which is placed facing the etching liquid 15 (see the figure), in the vertical direction (in the direction of the arrow U-D) in the etching liquid 15. In the figure, 5 is an elevating member driven in the direction of arrow U-D by a cam mechanism 10, 6 is a hook provided at the tip of the elevating member, and 8 is a support that slidably holds the elevating member 5. The members 9 are fixing screws for fixing the support member 8 to the device frame 70, and 60 is a motor for driving the cam mechanism IO.

This etching apparatus etches the processing surface S with the etching liquid 15 sent out from a spray pipe 16 disposed at a position facing the workpiece l immersed in the etching liquid 15. During this etching process, the workpiece l is etched.
is adapted to perform reciprocating motion in the vertical direction by a cam mechanism 10. Therefore, the fresh etching liquid 15 always comes into contact with the processing surface S of the workpiece 1, and this etching liquid 15 comes into contact with the workpiece 1 in the form of a "slowly flowing fluid". This phenomenon in which the etching liquid 15 permeates into the interior of the workpiece 1 is naturally alleviated.

The configuration of the cam mechanism 10 will be described below with reference to FIG.

This cam mechanism 10 is equipped with a cam 12 having one end fixed to a rotating shaft 61 of a motor 60 and a screw hole 12a formed in the other end, and a shaft insertion hole 7a in one end. At the same time, a connecting plate 7 having a connecting bottle insertion hole 7b at the other end, a threaded portion 11c formed to correspond to the screw hole 12a, and a loosely fitted state in the shaft portion insertion hole 7a. A crank bin 11 constituted by a shaft portion 11b and a head portion 11a, and a shaft portion 4a that loosely fits into the connecting bottle insertion hole 7b.

A connecting pin 4 is provided with a threaded portion 4b formed to correspond to a threaded hole 5a provided at the end of the elevating member 5. This cam mechanism 10 connects a connecting plate 7 and a cam 12 by a crank pin 11, and a connecting pin 4
By connecting the connecting plate 7 and the elevating member 5, it operates as a cam mechanism.

In this cam mechanism 10, by rotating the cam 12 in the direction of the arrow R or the direction of the arrow R'', the elevating member 5 performs reciprocating motion in the direction of the arrow UD, thereby raising and lowering the workpiece 1.

Next, the operation of this etching apparatus will be explained using FIG.

This etching apparatus has a spray pipe 16 equipped with a liquid injection hole 17 arranged so as to be immersed in the etching liquid Is and facing the processing surface S of the workpiece 1.
During the etching process, the workpiece 1 is configured to reciprocate in the direction of arrow Ll-D. This etching device creates a flow of the etching liquid 15 in a direction perpendicular to the processing surface S of the workpiece 1 by means of a spray pipe I6 disposed so as to be immersed in the etching liquid 15, and the workpiece is processed by the flow of the etching liquid 15. Since the structure is such that the surface S is etched and the position of the workpiece 1 is constantly changed with respect to the flow of the etching liquid 15, there is no risk that the etching liquid 15 will concentrate in a certain area. Therefore, in the case of this etching apparatus, the etching liquid 15 comes into uniform contact with the entire processing surface S of the workpiece, so that the side etching phenomenon α is less likely to occur.

〔Effect of the invention〕

As is clear from the above description, in the etching apparatus according to the present invention, the side etching phenomenon is less likely to occur because the etching solution does not concentrate in the area where the etching solution is formed. Therefore, when etching is performed using this etching apparatus, a pattern of extremely high quality can be obtained.

[Brief explanation of drawings]

FIG. 1 is a schematic side sectional view of essential parts showing an embodiment of the present invention, FIG. 2 is a schematic perspective view showing an example of the configuration of a cam mechanism used in the present invention, and FIG. 3 is an etching apparatus according to the present invention. 4(a), 4) and 4(C) are a schematic perspective view for explaining the operation of the conventional etching apparatus, and a schematic side sectional view, a schematic side view, and a schematic side view showing an example of the configuration of a conventional etching apparatus and the etching results. FIG. In the figure, 1 is a workpiece, 3 is a resist, 4 is a connecting bottle, 5 is a lifting member, 6 is a hook part, 7 is a connecting plate, 8 is a support member, 9 is a fixing screw, IO is a cam mechanism, 11 is a crank pin , 12 is a cam, 15 is an etching liquid, 16 is a spray pipe, 17 is a liquid injection hole, 20 and 20A are processing tanks, 25 is a hanging member, 50 is a pump, 51 is a suction pipe, 52 is a delivery pipe, 55 is a Liquid circulation section, 60 is a motor, 61 is a rotating shaft, 70 is an apparatus frame, S is a processing surface, the present invention^-! - Example concavity 11I Campo, groove angle -1 to f! Ien No. 21! I α represents a side etching phenomenon, β represents a surface etching phenomenon, and the following are respectively shown. 44 FjJ4 ts, t 3 I-i'r>7° arrangement f /1tj) 4 'F tI 'l flJ No. 31

Claims (1)

[Claims] A processing tank (20) in which a spray pipe (16) for spraying an etching solution (15) in a horizontal direction is immersed in the etching solution (15), and a processing surface (S). ) to the liquid injection hole (1) of the spray pipe (16).
An etching apparatus comprising: a cam mechanism (10) for vertically moving a workpiece (1) placed to face the etching liquid (15) in the etching solution (15).