JPH0472642U - - Google Patents

Info

Publication number
JPH0472642U
JPH0472642U JP1990116610U JP11661090U JPH0472642U JP H0472642 U JPH0472642 U JP H0472642U JP 1990116610 U JP1990116610 U JP 1990116610U JP 11661090 U JP11661090 U JP 11661090U JP H0472642 U JPH0472642 U JP H0472642U
Authority
JP
Japan
Prior art keywords
heat dissipation
fin
base side
tower shape
fin structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116610U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116610U priority Critical patent/JPH0472642U/ja
Publication of JPH0472642U publication Critical patent/JPH0472642U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第1図は本考案の一実施例を適用した放熱フイ
ン付ICパツケージの斜視図、第2図は第1図の
−線に沿う概略拡大断面図、第3図は従来の
放熱フイン付ICパツケージの一例を示す斜視図
、第4図はICパツケージの熱抵抗を放熱フイン
の枚数との関係で示した図である。 11……ICパツケージ(発熱体)、17……
放熱フイン構体、19……基端側のフイン部、2
0……先端側のフイン部。

Claims (1)

  1. 【実用新案登録請求の範囲】 複数のフインを積み重ねた状態で設けて塔状に
    形成され、発熱体に基部側が取り付けられる放熱
    フイン構体において、 塔状の高さ方向で少なくとも2つ以上のフイン
    部に分割し、各フイン部をそれぞれ異なる材料で
    形成するとともに、 基部側よりも先端側に配置されたフイン部に行
    くに従つて熱伝導率の高い材料で形成したことを
    特徴とする放熱フイン構体。
JP1990116610U 1990-11-06 1990-11-06 Pending JPH0472642U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116610U JPH0472642U (ja) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116610U JPH0472642U (ja) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472642U true JPH0472642U (ja) 1992-06-26

Family

ID=31864446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116610U Pending JPH0472642U (ja) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472642U (ja)

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