JPH0472657U - - Google Patents
Info
- Publication number
- JPH0472657U JPH0472657U JP1990114688U JP11468890U JPH0472657U JP H0472657 U JPH0472657 U JP H0472657U JP 1990114688 U JP1990114688 U JP 1990114688U JP 11468890 U JP11468890 U JP 11468890U JP H0472657 U JPH0472657 U JP H0472657U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- boss
- light
- main body
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る発光ダイオードの一実施
例を示す概略図、第２図は本考案に係る発光ダイ
オードの一実施例の実装状態であり、Ａは実装高
さを高く設定した状態を示す概略図、Ｂは実装高
さを低く設定した状態を示す概略図、第３図は従
来の発光ダイオードの実装状態を示す概略図であ
る。
１１……発光ダイオード、１２……リードフレ
ーム、１３……ＬＥＤチツプ、１４……樹脂モー
ルド、１５……プリント基板、１６……発光ダイ
オード本体、１７……高さ調整用ボス、１７ｃ…
…第１の段部、１７ｂ……第２の段部、１８ｃ，
１８ｂ……貫通孔、φＣ……高さ調整用ボスの先
端部から第１の段部までの外径、φＢ……第１の
段部から第２の段部までの外径、φＡ……第２の
段部から発光ダイオード本体までの外径、φＣ′
，φＢ′……貫通孔の孔径、ｃ，ｂ……実装高さ
。
Fig. 1 is a schematic diagram showing an embodiment of the light emitting diode according to the present invention, Fig. 2 is a mounted state of the embodiment of the light emitting diode according to the present invention, and A shows the state in which the mounting height is set high. B is a schematic diagram showing a state in which the mounting height is set low, and FIG. 3 is a schematic diagram showing a state in which a conventional light emitting diode is mounted. 11... Light emitting diode, 12... Lead frame, 13... LED chip, 14... Resin mold, 15... Printed circuit board, 16... Light emitting diode main body, 17... Boss for height adjustment, 17c...
...First step, 17b...Second step, 18c,
18b...Through hole, φC...Outer diameter from the tip of the height adjustment boss to the first step, φB...Outer diameter from the first step to the second step, φA... Outer diameter from the second step to the main body of the light emitting diode, φC'
, φB'...diameter of the through hole, c, b...mounting height.
Claims (1)
向かつて外形が段階的に縮幅する形状に形成され
た高さ調整用ボスを設けたことを特徴とする、発
光ダイオード。 A light-emitting diode characterized in that a height-adjusting boss is provided at the bottom of the light-emitting diode main body, the boss having a shape whose outer shape gradually narrows toward the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114688U JPH0472657U (en) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114688U JPH0472657U (en) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472657U true JPH0472657U (en) | 1992-06-26 |
Family
ID=31862395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990114688U Pending JPH0472657U (en) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472657U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010422A (en) * | 2006-06-26 | 2008-01-17 | Osram Sylvania Inc | Light-emitting diode with direct-view lens |
| JP2021166223A (en) * | 2020-04-06 | 2021-10-14 | 三菱電機株式会社 | A method for manufacturing a semiconductor device, a circuit board equipped with a semiconductor device, a power conversion device, and a circuit board equipped with a semiconductor device. |
-
1990
- 1990-11-02 JP JP1990114688U patent/JPH0472657U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010422A (en) * | 2006-06-26 | 2008-01-17 | Osram Sylvania Inc | Light-emitting diode with direct-view lens |
| EP1873566B1 (en) * | 2006-06-26 | 2017-11-22 | OSRAM GmbH | Light emitting diode with light guide assembly |
| JP2021166223A (en) * | 2020-04-06 | 2021-10-14 | 三菱電機株式会社 | A method for manufacturing a semiconductor device, a circuit board equipped with a semiconductor device, a power conversion device, and a circuit board equipped with a semiconductor device. |