JPH04730A - Wire bonding device - Google Patents

Abstract

PURPOSE:To detect a loop shape automatically and to acquire a necessary loop shape by providing a detection device of a wire loop shape and by changing movement locus of a bonding tool and a wire clamper. CONSTITUTION:A wire loop is formed of a bonding head. Here, an amount of vertical movement of a bonding tool 7 and an arm 8 is controlled changeably by a controller 5. Then, the shape of a formed wire 10 is photographed by a camera 17 and a height (h) from a surface of a semiconductor element 15 to a highest point of the wire 10 is detected by a specified image. The detected amount (h) is judged by the controller 5; when it is lower than a reference loop height (ho), a vertical movement amount of the bonding tool 7 and the arm 8 is increased; when it is higher, the vertical movement amount is reduced close to a reference loop height. Furthermore, a movement speed of vertical direction, and movement direction, movement amount and movement speed of an XY table can be also controlled by detecting other features of a wire loop shape.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding device used in a semiconductor assembly process.

[Conventional technology]

Figure 6 shows a configuration diagram of a conventional wire bonding device. In the figure, (1) is a bonding head, (2) is an inloader, (3) is a feeder, (4) is an outloader, and (5) is a controller. Figure 7 shows the structure of the bonding head in Figure 6, and in the figure (6) is
Y table, (7) is the bonding tool, (8) is the arm that fixes the bonding tool (I), (9) is the wire clamper, QQ is the wire, αυ is the wire tension, @ is the wire supply part, (g) is a vertical drive unit for the arm (8) and wire clamper (9), and q is a torch.

Next, the operation will be explained. Wire 0 (j is from the wire supply section (2) to the wire clamper (
9) to the bonding tool (7). The wire tensioner (6) raises the wire αO upward. The torch α value melts the wire 01 with a spark or the like and forms a ball at the tip of the bonding tool (7). Wire clamper (9) and bonding tool (
The arm (8) with 7) is moved up and down synchronously or independently by a vertical drive unit (to).
Draw a trajectory as shown in the -47893- publication,
Form a wire loop. Here, the movement trajectory of the bonding tool (7) and arm (8) is determined by the controller (5).
It has been set in advance.

[Problem to be solved by the invention]

Since the conventional wire bonding device is configured as described above, the trajectory of the tip of the bonding tool (7) (broken in the figure) is as shown in Fig. 3(a) to (C). Since the shape of the wire Q□ does not match, the operator visually inspects the wire shape and changes the movement trajectory of the bonding tool and arm according to the setting value of the controller.
There was a problem in that it was necessary to obtain the required loop shape.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wire bonding device that automatically detects a loop shape and is capable of obtaining a necessary loop shape.

[Means to solve the problem]

The wire bonding apparatus according to the present invention is equipped with a wire loop shape detection device to change the movement locus of the bonding tool and the wire clamper, and when the height of the loop is low, the bonding tool and the wire clamper are moved higher. , when the loop height is high, the bonding tool and wire clamper are moved lower.

[Effect]

The wire bonding apparatus according to the present invention detects the loop shape using the wire loop shape detection device, and allows the movement trajectory of the bonding tool and the wire clamper to vary.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure shows a configuration diagram of a wire bonding apparatus that is an embodiment of the present invention. In the figure, (1) is a bonding head, (2) is an inloader, (3) is a feeder, and (4) is a bonding head.
is an outloader, 5 is a controller, and σ is a wire shape detection device. FIG. 2 shows an embodiment of the wire shape detection device in FIG.
Photograph the wire shape. The bonding head (1) has the structure shown in FIG. 7, like the conventional one.

Next, the operation will be explained. The wire loop is formed by the bonding head shown in FIG. 7 as shown in Japanese Patent Publication No. 1-47893, as in the conventional method. Here, bonding tool (7), arm (8)
) can be variably controlled by the controller (5).

Next, the formed wire QC shape is photographed using the camera α force as shown in FIG. 2, and from the image shown in FIG. The height (h) is detected. This detected amount (11) is judged by the controller (5) as shown in the flowchart of Fig. 5, and when it is lower than the standard loop height (hO), the bonding tool (7 ), increase the amount of vertical movement of arm (8),
When flat (reduce the amount of vertical movement of the workpiece and bring it closer to the standard loop height.

In addition, in the embodiment described above, a case was explained in which the vertical movement amount of the bonding tool and arm is controlled from the height of the wire loop, but another feature of the wire loop shape is detected to control the vertical movement speed, It is also possible to control the moving direction, moving amount, and moving speed of the XY table.

It is also possible to detect the shape of each wire and control each wire.

〔Effect of the invention〕

As described above, according to the present invention, the movement trajectory of the bonding tool and arm is controlled based on the amount detected by the wire loop shape detection device, so that the necessary loop shape is automatically determined without operator control. There is an effect that can be obtained.

[Brief Description of the Drawings] Fig. 1 is a configuration diagram showing a wire bonding device according to an embodiment of the present invention, Fig. 2 is a perspective view showing an embodiment of the wire shape detection device of Fig. 1, and Fig. 3 (a) to (C) are explanatory diagrams showing the movement locus of the bonding tool and each shape of the wire loop, Figure 4 is a photographic image taken by the camera in Figure 2, and Figure 5 is the wire bonding apparatus in Figure 1. Flowchart of FIG. 6 is a configuration diagram of a conventional wire bonding device,
FIG. 7 is a side view showing the structure of the bonding head of FIG. 6. In the figure, (1) is a bonding head, (2Ht inloader), (3) is a feeder, (4) is an outloader,
(5) is the controller, αQ is the wire, α slope is the lead frame, (to) is the semiconductor element, α (2) is the wire shape detection device, and α force is the camera. In the figures, the same symbols are the same. or a corresponding portion. Agent Masuo Oiwa Figure 3 (b) (C) Figure 1 Figure 6 Figure 4 Figure 5

Claims (1)

[Claims] In a wire bonding device in which the amount of movement of a bonding tool and a wire clamper can be variably controlled in the vertical direction, a shape detection device of a formed wire loop is provided, and the movement locus of the bonding tool and wire clamper can be variably controlled based on the detected amount. A wire bonding device featuring: