JPH0473879A - Manufacture of gas-filled discharge tube - Google Patents
Manufacture of gas-filled discharge tubeInfo
- Publication number
- JPH0473879A JPH0473879A JP18389390A JP18389390A JPH0473879A JP H0473879 A JPH0473879 A JP H0473879A JP 18389390 A JP18389390 A JP 18389390A JP 18389390 A JP18389390 A JP 18389390A JP H0473879 A JPH0473879 A JP H0473879A
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- gas
- electrodes
- discharge tube
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 46
- 239000011521 glass Substances 0.000 abstract description 12
- 239000011247 coating layer Substances 0.000 abstract description 8
- 238000001182 laser chemical vapour deposition Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 26
- 239000000919 ceramic Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052773 Promethium Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VQMWBBYLQSCNPO-UHFFFAOYSA-N promethium atom Chemical compound [Pm] VQMWBBYLQSCNPO-UHFFFAOYSA-N 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、異常サージから電子機器類を保護するため
のガス入放電管の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a gas-filled discharge tube for protecting electronic equipment from abnormal surges.
[従来の技術]
第5図は、従来のガス入放電管の一例を示す断面図であ
る。[Prior Art] FIG. 5 is a sectional view showing an example of a conventional gas-filled discharge tube.
ガス入放電管は、全体として相形で、セラミックスなど
の中空円筒からなる絶縁管101の管端接合面102.
103にそれぞれろう材104.105を介して電極1
06.107で封着し、内部にアルゴン(A r )な
どの不活性ガスを封止し、対向する放電面10B、10
9間の放電ギャップ110で放電を得る構造である。1
11.112は電極106.107の鍔部、113.1
14は電極106.107のテーパ一部、115.11
6は絶縁管101の管端接合面102.103に設けら
れるメタライズ層である。そして、絶縁管101の内壁
117にトリガ手段として導電条片118が設けられて
いる。The gas-filled discharge tube has a similar shape as a whole, with an insulating tube 101 made of a hollow cylinder made of ceramic or the like, and a tube end joint surface 102.
Electrode 1 is connected to 103 through brazing filler metals 104 and 105, respectively.
06.107, an inert gas such as argon (A r ) is sealed inside, and the opposing discharge surfaces 10B, 10
This is a structure in which a discharge is obtained in a discharge gap 110 between 9 and 9. 1
11.112 is the flange of the electrode 106.107, 113.1
14 is a part of the taper of electrode 106.107, 115.11
Reference numeral 6 denotes a metallized layer provided on the tube end joint surfaces 102 and 103 of the insulating tube 101. A conductive strip 118 is provided on the inner wall 117 of the insulating tube 101 as a trigger means.
導電条片118は、現在のところ炭素条片が実用化され
ている。炭素条片はいずれかの一方の電極、例えば電極
106が位置する管端接合面102を基端縁とするとと
もに、他方の電極107の放電面109に近接する壁面
を先端縁として軸線方向にわたって罫書されている。図
示しないが、先端縁を他方の電極107の鍔部112の
手前まで延設したものや、両管端接合面102.103
から両端縁を離間したものも実施されている。As the conductive strip 118, a carbon strip is currently in practical use. The carbon strip has a proximal edge at the tube end joint surface 102 where one of the electrodes, for example, the electrode 106, is located, and a distal edge at the wall surface adjacent to the discharge surface 109 of the other electrode 107. has been done. Although not shown, there are cases where the tip edge extends to the front of the flange 112 of the other electrode 107, and where the two tube end joining surfaces 102 and 103
A structure in which both edges are separated from each other has also been implemented.
また、このようなガス入放電管の製造方法は、−個ずつ
ばらばらになった絶縁管101のそれぞれに対して、内
壁117に導電条片118を形成し、管端接合面102
.103にろう材104.105を介して電極106.
107で封着するものであった。In addition, in this method of manufacturing a gas-filled discharge tube, a conductive strip 118 is formed on the inner wall 117 of each insulated tube 101 separated one by one, and a conductive strip 118 is formed on the inner wall 117,
.. The electrode 106.103 is connected to the electrode 106.103 through the brazing material 104.105.
107 to seal it.
(発明が解決しようとする課題〕
ところで、このような従来のガス入放電管の製造方法で
は、多数の絶縁管101がその軸線方向に一本に連設さ
れたものに、−度に導電条片118や電極106を形成
することは不可能であった。(Problems to be Solved by the Invention) By the way, in such a conventional method for manufacturing a gas-filled discharge tube, a conductive strip is inserted into a tube in which a large number of insulating tubes 101 are arranged in series in the axial direction. It was not possible to form the strip 118 or the electrode 106.
それは、絶縁管101が長くなれば、その内壁117に
導電条片118を形成することはますます困難になり、
電極106.107が形成される管端接合面102.1
03は一個ずつばらばらにしなければ現れないためであ
る。The longer the insulating tube 101 becomes, the more difficult it becomes to form the conductive strips 118 on its inner wall 117.
Tube end joining surface 102.1 on which electrodes 106.107 are formed
This is because 03 does not appear unless it is separated one by one.
したがって、従来のガス入放電管の製造方法では、この
ような問題のために製造工程の簡略化に限界があった。Therefore, in the conventional method of manufacturing a gas-filled discharge tube, there is a limit to the simplification of the manufacturing process due to such problems.
そこで、この発明の目的は、上記問題を解決して製造工
程を簡略化したガス入放電管の製造方法を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a gas-filled discharge tube that solves the above problems and simplifies the manufacturing process.
この発明に係るガス入放電管の製造方法は、絶縁基板と
、この絶縁基板の端部にそれぞれ離間して設けられた電
極と、これらの電極間に設けられたトリガ手段と、この
トリガ手段と上記電極とを放電用のガスを封入して気密
封止する絶縁ケースとを備えたガス入放電管において、
多数の上記絶縁基板が平面的に形成された母基板に上記
iii極と上記トリガ手段との少なくとも一方を形成し
た後、上記母基板を分割して上記絶縁基板を取り出すこ
とを特徴とするものである。The method for manufacturing a gas-filled discharge tube according to the present invention includes an insulating substrate, electrodes provided at separate ends of the insulating substrate, trigger means provided between these electrodes, and the trigger means. A gas-filled discharge tube comprising the electrode and an insulating case hermetically sealed with gas for discharge,
The method is characterized in that, after forming at least one of the third pole and the trigger means on a mother board on which a large number of the insulating substrates are formed in a planar manner, the mother board is divided and the insulating substrates are taken out. be.
この発明に係るガス入放電管の製造方法では、多数の絶
縁基板が一枚の母基板に形成され、これらの絶縁基板に
電極やトリガ手段を一度に形成す〔実施例]
第1図はこの発明に係るガス入放電管の製造方法の一実
施例を示す平面図、第2図及び第3図は第1図に示す方
法により製造されるガス入放電管を示し、第2図は第3
図における■−汀線縦断面図、第3図は平面図である。In the method for manufacturing a gas-filled discharge tube according to the present invention, a large number of insulating substrates are formed on one mother substrate, and electrodes and trigger means are formed on these insulating substrates at the same time. 2 and 3 are plan views showing an embodiment of the method for manufacturing a gas-filled discharge tube according to the invention, and FIG. 2 shows a gas-filled discharge tube manufactured by the method shown in FIG.
3 is a plan view.
まず、第1図に示す方法により製造されるガス入放電管
について第2図及び第3図に基づき説明する。First, a gas-filled discharge tube manufactured by the method shown in FIG. 1 will be explained based on FIGS. 2 and 3.
ガス入放電管は、絶縁基板1oと、絶縁基板の端部12
.14にそれぞれ離間して設けられたトリガ放電用の′
t8ii16.18及び主放電用の電極30.32と、
電極16.18間の絶縁基板10上に設けられたトリガ
手段としての導電条片22.24と、導電条片22.2
4と電極16.18.30.32とを放電用のガスを封
入して気密封止する絶縁ケース26とを備え、トリガ放
電用の電極16.18及び導電条片22.24が絶縁基
板10の一面48に、主放電用の電極3o、32が絶縁
基板10の他面50に配設されている。そして、導電条
片22.24間にはギャップ20が形成されている。The gas-filled discharge tube includes an insulating substrate 1o and an end portion 12 of the insulating substrate.
.. 14 for trigger discharge provided separately from each other.
t8ii16.18 and main discharge electrode 30.32,
A conductive strip 22.24 as a trigger means provided on the insulating substrate 10 between the electrodes 16.18 and a conductive strip 22.2
4 and the electrodes 16, 18, 30, 32, and an insulating case 26 that hermetically seals the electrodes 16, 18, 30, 32 with a gas for discharge, and the electrodes 16. Electrodes 3o and 32 for main discharge are arranged on one surface 48 of the insulating substrate 10, and the other surface 50 of the insulating substrate 10. A gap 20 is formed between the conductive strips 22 and 24.
また、絶縁基板10上にガラスコーティング層28を形
成することができる。Further, a glass coating layer 28 can be formed on the insulating substrate 10.
次に第1図乃至第3図に基づきこの発明に係るガス入放
電管の製造方法の一実施例を工程順に説明する。Next, an embodiment of the method for manufacturing a gas-filled discharge tube according to the present invention will be explained in order of steps with reference to FIGS. 1 to 3.
第1図の(イ)では、三枚の絶縁基板10が一枚の母基
板58に形成されている。絶縁基板10は、電気的絶縁
性を有するセラミンクス、合成樹脂等からなる。この実
施例では、絶縁1110として酸化アルミニウムを主成
分とするセラミ・ンクスを用いている。また、各絶縁基
板10の境界には、分割溝59.59がレーザ光によっ
て形成されている。なお、分割溝59.59は、この工
程に限らず他のどの工程で形成してもよい。そして、絶
縁基板10の一面48にガラスの微粉末を含むペースト
を塗布し焼成してガラスコーティング層28を形成する
。In FIG. 1A, three insulating substrates 10 are formed on one mother substrate 58. In FIG. The insulating substrate 10 is made of electrically insulating ceramic, synthetic resin, or the like. In this embodiment, as the insulator 1110, ceramic inx whose main component is aluminum oxide is used. Furthermore, dividing grooves 59 and 59 are formed at the boundaries of each insulating substrate 10 using laser light. Note that the dividing grooves 59 and 59 may be formed not only in this process but also in any other process. Then, a paste containing fine glass powder is applied to one surface 48 of the insulating substrate 10 and fired to form the glass coating layer 28.
第1図の(ロ)では、絶縁基板10の端部12.14の
ガラスコーティング層28上にCuを含むペーストを塗
布し焼成して放電用の電極16.18が形成される。そ
して、レーザCVD (Chemical Vapo
r Depositi。In FIG. 1B, a paste containing Cu is applied onto the glass coating layer 28 on the end portion 12.14 of the insulating substrate 10 and fired to form the discharge electrode 16.18. Then, laser CVD (Chemical Vapo
r Deposit.
n)によって、電極16.18の一部を種として、ガラ
スコーティング層28上に幅、厚みともに約3μmの導
電条片22.24を形成する。n), a conductive strip 22.24 having a width and thickness of approximately 3 μm is formed on the glass coating layer 28 using a portion of the electrode 16.18 as a seed.
第1図の(ハ)では、電極16.18に端子38.40
がそれぞれはんだ34.36によって接続される。また
、電極16と電極30とは接触片54a、54bによっ
て、電極18と電極32とは接触片56a、56bによ
ってそれぞれ導通されている。In (c) of Fig. 1, the terminal 38.40 is connected to the electrode 16.18.
are connected by solders 34 and 36, respectively. Further, the electrode 16 and the electrode 30 are electrically connected through contact pieces 54a and 54b, and the electrode 18 and the electrode 32 are electrically connected through contact pieces 56a and 56b, respectively.
第1図の(ニ)では、母基板58を分割溝59.59に
沿って各絶縁基板10に分割する。このとき、端子38
.40も各絶縁基板10毎に切り離す。In (d) of FIG. 1, the mother substrate 58 is divided into the respective insulating substrates 10 along the dividing grooves 59 and 59. At this time, terminal 38
.. 40 is also cut out for each insulating substrate 10.
最後に、セラミンクスなどからなる絶縁ケース26の上
部材42と下部材44との間に、Ar等の放電用ガスを
封入するとともに端子38.40を外部へ出した状態で
絶縁基板10全体を入れる。Finally, a discharge gas such as Ar is sealed between the upper member 42 and the lower member 44 of the insulating case 26 made of ceramics, etc., and the entire insulating substrate 10 is placed with the terminals 38 and 40 exposed outside. .
そして、低融点ガラスなどからなる封着層46を溶融し
て絶縁基板10全体を絶縁ケース26で気密封止する。Then, the entire insulating substrate 10 is hermetically sealed with the insulating case 26 by melting the sealing layer 46 made of low melting point glass or the like.
なお、絶縁ケース26の内壁57には、プロメチウム(
Pt)やニッケル(Ni)などの放射性同位体を付着さ
せてもよい。Note that the inner wall 57 of the insulating case 26 is coated with promethium (
A radioactive isotope such as Pt) or nickel (Ni) may also be deposited.
また、導電条片22.24間のギャップ20の長さAと
主放電用の電極30.32間の距離Bとは、A<Bとな
るように設定されている。そして、トリガ放電によって
イオン化したガスが玉数電用の電極30.32側へ拡散
しやすいように、絶縁基板10と絶縁ケース26とに間
隙52が設けられている。Further, the length A of the gap 20 between the conductive strips 22.24 and the distance B between the main discharge electrodes 30.32 are set so that A<B. A gap 52 is provided between the insulating substrate 10 and the insulating case 26 so that the gas ionized by the trigger discharge can easily diffuse toward the electrodes 30 and 32 for the multi-electrode.
さらに、電極30.32は、特性の不安定な沿面放電を
避けて気中放電とするために、絶縁基板10及び絶縁ケ
ース26から離間して設けている。Furthermore, the electrodes 30 and 32 are provided apart from the insulating substrate 10 and the insulating case 26 in order to avoid creeping discharge with unstable characteristics and to create an air discharge.
次に、導電条片22.24をレーザCVDで形成する方
法について第4図に基づき説明する。第4図は第1図に
示す製造方法において導電条片22.24をレーザCV
Dで形成する方法を示す概略図である。Next, a method for forming the conductive strips 22, 24 by laser CVD will be described with reference to FIG. FIG. 4 shows conductive strips 22 and 24 formed by laser CV in the manufacturing method shown in FIG.
FIG.
チャンバ60内には、母基板58から分割される以前の
絶縁基板IOが載置されるとともにArとW(Co)a
との混合ガス62が流れる。光源64にはYAGレーザ
の第2高調波の波長532nmを用いる。このレーザー
光66を光学系68で収束して、チャンバ60のガラス
窓70を通して絶縁基板10に垂直に照射する。すると
、絶縁基板10では、レーザー光66が照射された部分
の温度が上昇してその周囲のW(Co)、が熱分解され
てタングステンが堆積する。そして、絶縁基板10を移
動させれば、レーザー光66が照射された部分にタング
ステンからなる導電条片22.24が形成される。この
方法によれば、極めて精度よく導電条片22.24を形
成できる。特に、絶縁基板10上にガラスコーティング
層28を形成して絶縁基板10上を平坦化すれば、幅は
1ミクロン単位、厚みは0.1ミクロン単位で導電条片
22.24を描くことができる。Inside the chamber 60, an insulating substrate IO before being divided from the mother substrate 58 is placed, and Ar and W(Co)a
A mixed gas 62 flows. The light source 64 uses a YAG laser with a second harmonic wavelength of 532 nm. This laser beam 66 is focused by an optical system 68 and is irradiated perpendicularly onto the insulating substrate 10 through the glass window 70 of the chamber 60 . Then, in the insulating substrate 10, the temperature of the portion irradiated with the laser beam 66 increases, W (Co) around the portion is thermally decomposed, and tungsten is deposited. Then, when the insulating substrate 10 is moved, conductive strips 22 and 24 made of tungsten are formed in the portions irradiated with the laser beam 66. According to this method, the conductive strips 22, 24 can be formed with extremely high precision. In particular, if the glass coating layer 28 is formed on the insulating substrate 10 and the insulating substrate 10 is flattened, the conductive strips 22 and 24 can be drawn with a width of 1 micron and a thickness of 0.1 micron. .
また、導電条片22.24は鉛筆等による罫書によって
形成してもよい。どのような方法によっても、導電条片
22.24は、多数の絶縁基板10が形成された母基板
5日に一度に連続して形成でき、極めて能率よく形成で
きる。Further, the conductive strips 22, 24 may be formed by marking with a pencil or the like. Regardless of the method used, the conductive strips 22, 24 can be continuously formed on the mother substrate 5 days on which a large number of insulating substrates 10 are formed, and can be formed very efficiently.
なお、トリガ手段として導電条片22.24について説
明したが、絶縁基板10の一面48の大部分にカーボン
コーティングなどの導電皮膜を形成し、画電極16.1
8の略中央の導電皮膜にスリット状のギャップを形成す
ることによりトリガ手段を設けてもよい。Although the conductive strips 22.24 have been described as trigger means, a conductive film such as carbon coating is formed on most of the surface 48 of the insulating substrate 10, and the picture electrodes 16.1
Trigger means may be provided by forming a slit-like gap in the conductive film approximately in the center of 8.
また、上記実施例では二極のガス入放電管を示したが、
三極以上のガス入放電管に対しても同様に実施できる。In addition, although the above embodiment shows a two-pole gas-filled discharge tube,
The same method can be applied to gas-filled discharge tubes having three or more electrodes.
[発明の効果]
この発明に係るガス入放電管の製造方法によれば、多数
の絶縁基板が一枚の母基板に形成され、これらの絶縁基
板に電極やトリガ手段を一度に形成することにより、−
個ずつ電極やトリガ手段を形成する方法に比べて工程を
簡略化できる。[Effects of the Invention] According to the method for manufacturing a gas-filled discharge tube according to the present invention, a large number of insulating substrates are formed on one mother substrate, and electrodes and trigger means are formed on these insulating substrates at the same time. ,−
The process can be simplified compared to a method of forming electrodes and trigger means one by one.
第1図はこの発明に係るガス入放電管の製造方法の一実
施例を示す平面図、第2図及び第3図は第1図に示す方
法により製造されるガス入放電管を示し、第2図は第3
図における■−■線縦線面断面図3図は平面図、第4図
は第1図に示す製造方法において導電条片をレーザCV
Dで形成する方法を示す概略図、第5図は従来のガス入
放電管の一例を示す断面図である。
10・・・絶縁基板
12.14・・・絶縁基板の端部
16.18・・・トリガ放電用の電極
22.24・・・導電条片(トリガ手段)26・・・絶
縁ケース
30.32・・・主放電用の電極
58・・・母基板
特許出願人・・・株式会社 白山製作所代 理 人・・
・弁理士 吉1)万券
第1図
58母基板
ノ
22.24FIG. 1 is a plan view showing an embodiment of the method for manufacturing a gas-filled discharge tube according to the present invention, and FIGS. 2 and 3 show a gas-filled discharge tube manufactured by the method shown in FIG. Figure 2 is the third
Figure 3 is a plan view, and Figure 4 is a cross-sectional view of the vertical line taken along the line ■-■ in the figure.
FIG. 5 is a sectional view showing an example of a conventional gas-filled discharge tube. 10... Insulating substrate 12.14... End portion of insulating substrate 16.18... Electrode for trigger discharge 22.24... Conductive strip (trigger means) 26... Insulating case 30.32 ...Electrode 58 for main discharge...Mother board patent applicant...Hakusan Seisakusho Co., Ltd. Agent...
・Patent Attorney Yoshi 1) Thousand tickets Figure 1 58 Mother board No. 22.24
Claims (1)
けられた電極と、これらの電極間に設けられたトリガ手
段と、このトリガ手段と上記電極とを放電用のガスを封
入して気密封止する絶縁ケースとを備えたガス入放電管
において、 多数の上記絶縁基板が平面的に形成された母基板に上記
電極と上記トリガ手段との少なくとも一方を形成した後
、上記母基板を分割して上記絶縁基板を取り出すことを
特徴とするガス入放電管の製造方法。[Claims] An insulating substrate, electrodes provided spaced apart from each other at the ends of the insulating substrate, a trigger means provided between these electrodes, and a trigger means for discharging the trigger means and the electrodes. In a gas-filled discharge tube equipped with an insulating case that encloses gas and hermetically seals the tube, after forming at least one of the electrode and the trigger means on a mother board in which a large number of the insulating substrates are formed in a planar manner. . A method for manufacturing a gas-filled discharge tube, comprising dividing the mother substrate and taking out the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18389390A JPH0473879A (en) | 1990-07-13 | 1990-07-13 | Manufacture of gas-filled discharge tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18389390A JPH0473879A (en) | 1990-07-13 | 1990-07-13 | Manufacture of gas-filled discharge tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0473879A true JPH0473879A (en) | 1992-03-09 |
Family
ID=16143659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18389390A Pending JPH0473879A (en) | 1990-07-13 | 1990-07-13 | Manufacture of gas-filled discharge tube |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0473879A (en) |
-
1990
- 1990-07-13 JP JP18389390A patent/JPH0473879A/en active Pending
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