JPH04738U - - Google Patents
Info
- Publication number
- JPH04738U JPH04738U JP4096390U JP4096390U JPH04738U JP H04738 U JPH04738 U JP H04738U JP 4096390 U JP4096390 U JP 4096390U JP 4096390 U JP4096390 U JP 4096390U JP H04738 U JPH04738 U JP H04738U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer carrier
- spraying
- carrier
- rotates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005507 spraying Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Description
第１図は、本考案の残渣除去製の主要部構成図
、第２図は、残渣が付着したウエハの模式図、第
３図は、ウエハキヤリアの平面図、第４図は、ウ
エハキヤリアの部分断面斜視図である。
１……Ｎ２ガス噴射ノズル、２……エタノール
噴射ノズル、３……ガラスベルジヤー、４……ウ
エハキヤリア、５……ホツトプレート、６……Ｇ
ａＡｌＡｓエピタキシヤルウエハ、６ａ……ウエ
ハ表面に付着したＧａ、６ｂ……ウエハ表面端部
に付着したＧａ、８……ウエハキヤリアの打抜き
穴、９……空間。
Figure 1 is a configuration diagram of the main parts of the residue removal device of the present invention, Figure 2 is a schematic diagram of a wafer with residue attached, Figure 3 is a plan view of the wafer carrier, and Figure 4 is a diagram of the wafer carrier. FIG. 3 is a partially sectional perspective view. 1...N 2 gas injection nozzle, 2...ethanol injection nozzle, 3...glass bell gear, 4...wafer carrier, 5...hot plate, 6...G
aAlAs epitaxial wafer, 6a...Ga attached to the wafer surface, 6b...Ga attached to the edge of the wafer surface, 8...Punched hole in the wafer carrier, 9...Space.
Claims (1)
エハおよびウエハキヤリアを所定の雰囲気に保持
する手段と、ウエハキヤリアに載置されたウエハ
面上に向つて溶剤を噴射する手段及び不活性ガス
を噴射する手段とを備えたことを特徴とするウエ
ハ面上の残渣除去装置。 A wafer carrier that rotates with a wafer placed thereon, a means for holding the wafer and the wafer carrier in a predetermined atmosphere, a means for spraying a solvent onto the surface of the wafer placed on the wafer carrier, and a means for spraying an inert gas. A device for removing residue on a wafer surface, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096390U JPH04738U (en) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096390U JPH04738U (en) | 1990-04-17 | 1990-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04738U true JPH04738U (en) | 1992-01-07 |
Family
ID=31551219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4096390U Pending JPH04738U (en) | 1990-04-17 | 1990-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04738U (en) |
-
1990
- 1990-04-17 JP JP4096390U patent/JPH04738U/ja active Pending
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