JPH0473942A - Semiconductor device measurement method and device - Google Patents

Abstract

PURPOSE:To obtain the measuring technology which can test the electric characteristics under the state of a semiconductor pellet by performing cleaning by aging under the state of the semiconductor pellet with respect to the semicon ductor pellet wherein clectronic circuits are built in. CONSTITUTION:Cleaning by aging is performed under the state of semiconductor pellet with respect to the semiconductor pellet 1 wherein electronic circuits are built in. The semiconductor pellet 1 wherein the electronic circuits are built in is held so that the pellet can be freely attached and removed, Each lead 23 is brought into contact with a respective electrode pad group 2 of the semiconductor pellet 1 held in this way. The semiconductor pellet 1 is mounted on a testing substrate so that the pellet can be freely attached and removed. The lead group 23 is connected to the electric wirings of the testing substrate. Thus, a measuring apparatus 9 is obtained. For example, the measuring appara tus 9 has a holding jig 10, a lead jig 20, a pushing jig 30 and a socket 40 as shown in the figure.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a technology for measuring semiconductor devices, and in particular, a technology for measuring electrical characteristics of semiconductor pellets themselves. Concerning what is effective for use in screening.

[Conventional technology]

In the manufacturing process of semiconductor devices, when screening by aging is performed before shipping, after the so-called post-process in the manufacturing process of semiconductor devices is completed, the semiconductor is Device is mounted on the socket The semiconductor device is mounted on the aging board through the socket, and is connected to the electrical wiring of the aging board. Then, the semiconductor device and the tester are electrically connected via the socket and the aging board, and screening by aging is performed.

Examples of sockets used in such semiconductor device measurement methods include Japanese Utility Model Application Publications No. 123674/1982 and No. 69837/1989.

By the way, when a product is shipped in the form of a semiconductor pellet, it cannot be installed in a socket as it is, so for example, a package is formed on the semiconductor pellet extracted from each loft, and the packaged state is Screening by aging is carried out by attaching it to the socket.

[Problems to be Solved by the Invention] However, in such a case, unnecessary packages are manufactured, which leads to a decline in productivity.

An object of the present invention is to provide a measurement technique that allows electrical property tests to be performed on semiconductor pellets.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Representative inventions disclosed in this application will be summarized as follows.

That is, a semiconductor pellet in which an electronic circuit is built is held in a detachable manner, each lead is brought into contact with each of the electrode pad groups of the held semiconductor pellet, and the semiconductor pellet is detachably attached to a testing board. It is characterized in that it is configured to be attached to the test board and to connect the lead group to the electrical wiring of the testing board.

[Effect]

According to the above-described means, since the semiconductor pellet can be mounted on the testing board as it is without forming a package, a desired electrical property test can be performed on the semiconductor pellet. Therefore, when shipped from the factory as a product in the form of semiconductor pellets,
Since the aging screening can be carried out in the semiconductor pellet state, the quality assurance of the product can be sufficiently increased and a decrease in productivity can be avoided.

〔Example〕

FIG. 1 is an exploded perspective view showing a semiconductor device measuring device according to an embodiment of the present invention, and FIG. 2 and subsequent figures are front sectional views and vertical sectional views showing the order of assembly thereof.

In this example, the semiconductor device measuring apparatus according to the present invention can perform aging screening on a semiconductor pellet (hereinafter referred to as "vellet") in which a semiconductor integrated circuit is built in the pellet state. It is configured so that it can be done.

The pellet 1 as the object to be measured is formed into a small, approximately square plate with a semiconductor integrated circuit (not shown) built into it in the so-called pre-process of the semiconductor device manufacturing process, and its -main surface ( A plurality of electrode pads 2 are formed on the upper surface (hereinafter referred to as the upper surface) and are arranged around the periphery thereof. By electrically connecting an extraction terminal to this electrode pad 2, the semiconductor integrated circuit built into the pellet 1 can be electrically extracted to the outside.

This semiconductor pellet measuring device 9 includes a holding jig 10,
It includes a lead jig 20, a holding jig 30, and a socket 40. The holding jig 10 includes an outer frame 11,
The outer frame 11 is made of an insulating material such as resin and is integrally molded into a square frame shape. A holding member 14 formed in the shape of a square flat plate is concentrically arranged in the center of the outer frame 11, and fixedly held by four hanging members 12 integrally protruding from four corners. It is suspended.

Therefore, there are four hanging members 1 on the outside of the holding member 14.
A through space 13 is formed between the two. A holding recess 15 is formed in the upper surface of the holding member 14 in the shape of a square hole with a constant depth. There is.

Further, a positioning convex portion 16 is provided on the upper surface of the outer frame 11 so as to protrude so as to fit into a positioning hole of a sliding jig 20, which will be described later.

The lead jig 20 includes a sheet 21 made of an insulating material such as resin and formed into a square thin sheet shape, and the outer diameter of the sheet 21 is the same as that of the holding jig 10.
It is formed to have the same size as the outer diameter of the outer frame 11 when opened.

Square window holes 22 are concentrically arranged in the center of the sheet 21, and the window holes 22 are slightly larger than the planar shape of the pellet 1. A plurality of beams 23 are formed on the lower surface of the sheet 21 and are insulated from each other and arranged radially.

The inner tip of each lead 23 (hereinafter referred to as the inner part)
24 protrude inside the window hole 22, and are arranged in an annular row along the periphery of the window hole 22 with an air gap between them. On the other hand, the outer ends of each lead 23 (hereinafter referred to as
It is called the outer part. ) 25 are each integrally formed in the shape of a square pad, and are arranged in a line on the substantially square outline and are arranged to face each of the contact pins of a socket 40, which will be described later. In addition, a plurality of square positioning holes 26 are formed in the pair of end sides of the sheet 21 and are arranged at equal intervals along the end sides, and some of the positioning holes 26 are provided with the holding holes 26 . By fitting the positioning convex portions 16 of the jig 10 into the respective positions, the positioning of the lead jig 20 and the holding jig 10 is ensured.

The lead jig 20 configured as above is TAB
The carrier tape used for (tape auto-made bonding) can be reused.

The holding jig 30 is made of resin or the like! It is equipped with a pressing plate 31 formed into a square plate shape using edge material, and this pressing plate 31 is attached to the outer frame 1 of the holding jig 10.
It is formed to have a size substantially equal to the outer diameter of 1. A plurality of inner part pressers 32 are disposed in the center of the press plate 31 and project vertically downward, corresponding to each inner part 24 of the lead jig 20. There are a plurality of outer part pressers 33 on the outside of the
They are disposed so as to correspond to each outer portion 25 of the lead jig 20 and protrude vertically downward. Furthermore, a plurality of positioning recesses 34 are provided on the lower surface of the holding plate 31.
The concave portion 34 is recessed in the peripheral portion, and is configured to fit into the positioning convex portion 16 of the holding jig 10 with the positioning hole 26 of the lead jig 20 interposed therebetween.

By fitting the positioning protrusion 16, the positioning hole 26, and the positioning recess 34, the holding jig 10, the lead jig 20
, and the positioning of the holding jig 30 is ensured.

The socket 40 includes a main body 41 and a top cover 42 which are integrally molded using an insulating material such as resin, and the top cover 42 is attached to the main body 41 so as to be openable and closable. The main body 41 is formed by integrally standing a side wall 44 on the outer periphery of a base 43 formed in the shape of a square flat plate.
5 is formed. The accommodating portion 45 is formed into a square hole shape with a constant depth and is large enough to fit the holding jig 10, and is in contact with the outer frame 11 of the holding jig 10. It is configured to ensure positioning. A plurality of contact pins 46 are disposed on the base 43 so as to correspond to each outer part 25 of the lead jig 20, and are inserted and fixed in the vertical direction, and each contact pin 46 is fixed in its housing part. 45 so as to come into contact with each outer part 25 at the upper end. Further, the lower end portions of the contact bins 46 protruding outside the housing portion 45 are arranged regularly so that they can be inserted into the contact holes 52 of the aging board 50 as a testing board.

The lid body 42 is formed into a square plate having a size equal to the planar shape of the main body 41 and a constant thickness.The lid body 42 is formed into a square plate having a size equal to the planar shape of the main body 41 and has a constant thickness. It is attached to the main body 41 so that it can be opened and closed by being supported. A hook 48 is arranged at the center of the end opposite to the hinge 47 on the lid body 42 and protrudes toward the main body 41 side. It is designed to maintain a closed state.

Next, a method for measuring a semiconductor device, which is an embodiment of the present invention, will be described using the bellet measuring device 9 having the above configuration.

When the pellet 1 is shipped from a factory as a product in this state, screening by aging is performed while the pellet is still in the state before shipping.

As shown in FIG. 2, the pellet 1 as the object to be measured is subjected to aging screening.
Two groups of electrode pads are arranged and fitted into the holding recess 15 of the holding jig 10 in an upwardly facing manner.

Subsequently, as shown in FIG. 3, the lead jig 20 is placed on the holding jig 10, and as shown in FIG. 4, a holding jig is placed on the lead jig 20. covered. At this time, the positioning convex portion 16 of the holding jig 10 is connected to the positioning hole 26 of the lead jig 20 and the holding jig 30.
By being fitted into the positioning recesses 34 of the
The positioning of the holding jig 10, the lead jig 20, and the holding jig 30 is ensured.

Next, as shown in FIG.
The socket 40 is fitted into the accommodating portion 45 of the main body 41 with the holding jig 30 side facing upward. In this fitted state, the outer periphery of the outer frame 11 of the holding jig 10 is positioned on the inner periphery of the accommodating portion 45 of the socket 10, so that the holding jig 10 is properly set in the socket 40.

Subsequently, the lid body 42 is placed over the main body 41, and the hook 48
locked by

In this state, the inner part 24 of each lead 23 of the lead jig 20 is pressed against each electrode pad 2 of the pellet 1 held by the holding jig 10 by the inner part presser 32 of the holding jig 30. They are each pressed against the socket 40 via the reaction force.

In addition, the outer portion 25 of each lead 23 of the lead jig 20 is attached to each contact pin 46 of the socket 40 held by the holding jig IO, and the outer portion presser 3 of the presser jig 30 is
3 are pressed into contact with each other.

A plurality of sockets 40 in which the bellets 1 are set in this way are prepared, and as shown in FIG.
Each is mounted on an aging board 50 as a testing board. At this time, the contact pins 46 of the socket 40 are inserted into the contact holes 52 formed in the base 51 of the aging board 50, and are mechanically and electrically connected.

After this, the aging board 5 on which 40 groups of sockets are mounted
One or more sheets of 0 are carried into a constant temperature bath (not shown) or the like, and an electrical property test is conducted and screened in an environment where the temperature and atmosphere are controlled.

This electrical characteristic test is performed using a tester (not shown) and the integrated circuit of Pele 7) 1 and the force (contact hole 52 of aging board 50, contact pin 46 of socket 40, outer part 25 of lead 23 in lead jig 20, lead 23,
By electrically connecting via the inner portion 24 of the lead 23 and the electrode pad 2 of the pellet 1, predetermined test signals are exchanged and executed.

After the prescribed aging screening is completed,
The aging substrate 50 is carried out from a constant temperature bath or the like.

Next, each socket 4O is removed from the aging board 50. Subsequently, the lid 42 of each socket 40 is opened,
The holding jig 30, the lead jig 20, and the holding jig 10 are taken out in sequence. Then, the tested pellets 1 are removed from the holding jig 10 and are sorted into good and defective products.

According to the embodiment described above, the following effects can be obtained.

(1) A semiconductor pellet with an electronic circuit built in is held in a detachable manner, each lead is contacted with each electrode pad group of the held semiconductor pellet, and the semiconductor pellet is attached and detached from a testing board. By configuring the semiconductor pellet to be attached freely and to connect the lead group to the electrical wiring of the testing board, the semiconductor pellet can be attached to the testing board as it is without forming a package. , desired electrical property tests can be conducted in the state of semiconductor pellets. Therefore, when a product is shipped from a factory in the form of semiconductor pellets, screening by aging can be carried out in the form of semiconductor pellets, so that the quality assurance of the product can be sufficiently increased.

(2) Sorting at a predetermined temperature in the semiconductor pellet state, and
By performing aging, short-term evaluation of loft yield, etc. can be performed, and costs can be reduced.

(3) By standardizing the dicing of semiconductor wafers into semiconductor pellets and the electrode pads of semiconductor pellets,
Semiconductor measurement equipment can be shared.

(4) By making the holding jig that holds the semiconductor pellet separate from the socket, you can simply modify the holding jig.
Since various general-purpose sockets can be used as appropriate, cost increases can be suppressed.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the lead jig, the holding jig, and the lid of the socket may be integrated, or the holding jig and the socket body may be integrated.

Furthermore, the order of assembling the bellet, holding jig, lead jig, holding jig, and socket is not limited to the above embodiment; for example, after fitting the holding jig into the socket, A tool and a holding jig may be incorporated.

The above explanation has mainly been about the case where the invention made by the present inventor is applied to the field of application which is the background of the invention, which is the measurement technology for semiconductor pellets shipped from a factory. The present invention can also be applied to measurement techniques for semiconductor pellets at the time of receiving them, and measurement techniques for semiconductor pellets at a stage before post-processing in the manufacturing process of semiconductor devices.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

A semiconductor pellet with an electronic circuit built in is held in a detachable manner, each lead is brought into contact with each of the electrode pad groups of the held semiconductor pellet, and the semiconductor pellet is detachably attached to a testing board. By configuring the lead group to be connected to the electrical wiring of the testing board, the semiconductor pellet can be attached to the semiconductor pellet as it is without forming a package.
Since it can be mounted on a testing board, desired electrical property tests can be performed in the form of semiconductor pellets. Therefore, when a product is shipped from a factory in the form of semiconductor pellets, screening by aging can be carried out in the form of semiconductor pellets, so that the quality assurance of the product can be sufficiently increased.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing a semiconductor device measuring device which is an embodiment of the present invention. Fig. 2 and subsequent figures show the order of its assembly. Fig. 2 shows the assembly of the pellet into the holding jig. A partially cutaway front view, Figure 3 is a partially cutaway front view showing the assembly of the gluing jig to the holding jig, and Figure 4 is a partially cutaway front view showing the assembly of the holding jig and the holding jig to the lead jig. 5 is a longitudinal sectional view showing the assembly of the holding jig, lead jig and holding jig into the socket, and FIG. 6 is a longitudinal sectional view showing the assembly of the socket onto the aging board. Figure. l...Bellet, 2...Electrode pad, 9...Bellet measuring device, 10...Holding jig, 11...Outer frame,
12... Hanging member, 13... Penetration space hole, 14...
- Holding member, 15... Holding recess, 16... Positioning protrusion, 20... Lead jig, 21... Sheet, 22
... window hole, 23 ... lead, 24 ... inner part,
25...Outer part, 26...Positioning hole, 30...
... Holding jig, 31... Holding plate, 32... Inner part holding, 33... Outer part holding, 34... Positioning recess, 40... Socket, 41... Main body, 4
2... Lid body, 43... Base, 44... Side wall, 4
5...Accommodation part, 46...Contact pin, 47...
- Hinge, 48... Hook, 50... Aging board, 51... Base, 52... Contact hole.

Claims (1)

[Claims] 1. For semiconductor pellets in which electronic circuits are built,
A method for measuring a semiconductor device, comprising performing aging screening in a semiconductor pellet state. 2. A semiconductor pellet with an electronic circuit built therein is held in a detachable manner, each lead is brought into contact with each of the electrode pad groups of the held semiconductor pellet, and the semiconductor pellet is detachably attached to a testing board. 1. A measuring device for a semiconductor device, characterized in that the device is configured to be attached to a semiconductor device and to connect the lead group to electrical wiring of a testing board. 3. A holding jig for removably holding a semiconductor pellet in which an electronic circuit is built; and a plurality of leads insulated from each other and wired in a radial pattern, which are removably attached to the holding jig; A lead jig in which each lead is brought into contact with each of the electrode pad groups of the semiconductor pellet held in the holding jig, and a holding jig in which the lead jig is attached is held, and each lead and the electrode pad are held in contact with each other. and a socket configured to maintain contact with the test board and to be detachably attached to the testing board and to connect the lead group to the electrical wiring of the testing board. Measuring equipment for semiconductor devices.