JPH0474429U - - Google Patents

Info

Publication number
JPH0474429U
JPH0474429U JP1990116819U JP11681990U JPH0474429U JP H0474429 U JPH0474429 U JP H0474429U JP 1990116819 U JP1990116819 U JP 1990116819U JP 11681990 U JP11681990 U JP 11681990U JP H0474429 U JPH0474429 U JP H0474429U
Authority
JP
Japan
Prior art keywords
wire
block
cylindrical hole
tension mechanism
tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116819U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116819U priority Critical patent/JPH0474429U/ja
Publication of JPH0474429U publication Critical patent/JPH0474429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例１の概略図、第２図は
実施例２の概略図、第３図は従来のワイヤテンシ
ヨン機構の概略図である。 １……ワイヤ、２……スプール、３……ワイヤ
ガイド、４……ボンデイングツール、５……ノズ
ル、６……円筒穴、７……空気穴、８……ブロツ
ク。 FIG. 1 is a schematic diagram of Embodiment 1 of the present invention, FIG. 2 is a schematic diagram of Embodiment 2, and FIG. 3 is a schematic diagram of a conventional wire tension mechanism. 1... Wire, 2... Spool, 3... Wire guide, 4... Bonding tool, 5... Nozzle, 6... Cylindrical hole, 7... Air hole, 8... Block.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンデイング装置におけるワイヤテンシ
ヨン機構において、ワイヤスプールからボンデイ
ングツールまでのワイヤ経路の途中に、ワイヤ軸
に沿つて同芯となる円筒穴を有するブロツクを位
置させ、このブロツクに複数の空気穴を配置して
円筒穴内に開口させ、ワイヤの繰り出し方向と逆
方向に気流を生ぜしめてワイヤにバツクテンシヨ
ンを与えることを特徴とするワイヤテンシヨン機
構。 In the wire tension mechanism of a wire bonding device, a block having a cylindrical hole concentric with the wire axis is located in the middle of the wire path from the wire spool to the bonding tool, and a plurality of air holes are arranged in this block. A wire tension mechanism is characterized in that the wire is opened in a cylindrical hole, and an air current is generated in a direction opposite to the direction in which the wire is fed out to give back tension to the wire.
JP1990116819U 1990-11-07 1990-11-07 Pending JPH0474429U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116819U JPH0474429U (en) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116819U JPH0474429U (en) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0474429U true JPH0474429U (en) 1992-06-30

Family

ID=31864659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116819U Pending JPH0474429U (en) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0474429U (en)

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