JPH0474494A - Electronic equipment - Google Patents

Abstract

PURPOSE:To improve maintainability and cooling capacity by mounting a heat sink inside the wall of a structure in response to a curved shape, and using a thin film on the surface of the sink in contact with the back surface of an electronic module. CONSTITUTION:An electronic module 1 is held between a board 6 and a heat sink 2, necessity of individually securing the module 1 to the board 6 is eliminated, thereby easily detaching and attaching the module 1. The contact surface of the sink 2 with the module 1 is formed of a thin film 8, the film 8 is deformed, followed in contact in response to the disposition and shape of the module by pressure to be applied to refrigerant flowing in the sink 2 to reduce contact thermal resistance between the module l and the sink 2, thereby improving cooling performance.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is particularly applicable to electronic equipment in which a plurality of electronic modules that require cooling are mounted in combination on a wall surface of a structure having a free-form surface. This relates to improving the maintainability of the module and cooling capacity.

[Prior Art] Conventionally, this type of electronic equipment is configured as shown in FIG. In Fig. 4, (1) is an electronics module, (2) is a heat sink that has a flow path through which a refrigerant flows, and (3) is a heat sink that distributes and distributes refrigerant to (2).
Manifold for collection, (4), (
5) is a plate for positioning and supporting the electronics module (1), (6) is a board for transmitting and receiving electrical signals with the electronics module (1), and (7) is a plate for positioning and supporting the electronics module (1).
) and the board (6), (10) is a refrigerant tank, (11) is a refrigerant pump, (
12) is a heat exchanger for cooling the refrigerant heated by the heat generated by the electronics module (1).

In conventional electronic devices, these high-density electronics modules (1) are arranged in a plane on a structure, and a tank (1) is used to cool the internal electronic circuits.
10), by flowing the refrigerant sent from the refrigerant circulation system consisting of the pump (ii) and the heat exchanger (I2) to the heat sink (2) installed in the gap between the array of electronics modules (1), It cools down the temperature.

[Problems to be Solved by the Invention] In the above-mentioned electronic device, the heat sink (2) is configured between the electronics module [1], so when the board is formed into a curved shape.

Despite being implemented within a limited space.

Connect the heat sink (2) to the electronics module (
The gap shape between 11 and 9 must be adapted to the curved shape, and space is also required to fix the electronics module (1) to the board, which impairs the maintainability and mountability of the electronics module. There was a problem. In addition, recent technological innovations have made it possible to downsize the electronics module (1), making the conventional cooling method using a heat sink (2) between the electronics modules (1) no longer practical.

This invention was made in order to solve such problems, and the overall configuration of electronic equipment was revised, and a group of electronics modules (1) was mounted in the overall structure having a free-form surface. ) with the aim of improving maintainability and cooling capacity.

[Means for Solving the Problems] In the electronic device according to the present invention, the heat sink (2) is installed inside the wall surface of the structure in accordance with the curved shape.
A thin film (8) is used on the surface where 2) and the back surface of the electronics module (1) come into contact.

[Function] This invention allows the electronics module (1) to be individually mounted on the substrate (6) by sandwiching the electronics module (1) between the substrate (6) and the heat sink (2).
), which has the effect of making it easier to attach and detach the electronics module (1). Also, the electronics module (1) of the heat sink (2)
By configuring the contact surface with the thin film (8), the pressure applied to the refrigerant flowing inside the heat sink (2) causes
The thin film (8) deforms and follows the arrangement and shape of the electronics module (1) and comes into contact with it. This reduces the contact thermal resistance between the electronics module (1) and the heat sink (2), making it possible to improve the cooling performance of the electronics module (1).

[Embodiment] FIG. 1 is an overall configuration diagram showing an embodiment of the present invention, FIG. 2 is a configuration diagram of a heat sink (2), and FIG. 3 is a sectional view thereof. In the figure, (1) is an electronics module, (2) is a heat sink with a flow path for coolant to flow inside, (6) is a substrate formed into an arbitrary shape, and (7) is a combination of the substrate (6) and electronics module ( 1), (8) is the thin 11N between the electronics module (1) and the heat sink (2), (9) is the fastener that fixes the heat sink (2) and the board (6), (13) is a frame for fixing the thin film (8) to the heat sink (2).

In the electronic device configured as described above, as shown in Figure 3, the thin film (8) swells due to the pressure of the refrigerant flowing inside the heat sink (2), and the electronics module (
1), the contact thermal resistance can be reduced regardless of the shape of the substrate on which the module is placed.

[Effect of the invention] As explained above, the present invention can improve the conventional heat sink (
2) is installed on the back of the electronics module (1) and fixed to the board (6) to improve maintainability.
) and the heat sink (2) with a thin film (8), the required cooling performance can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of an electronic device showing an embodiment of the present invention;
FIG. 2 is a block diagram of a heat sink, FIG. 3 is a sectional view of FIG. 2, and FIG. 4 is a block diagram of the entire conventional electronic device. (1) is an electronics module, (
2) is a heat sink. (3) is the manifold, (4) and (5) are the plates. (6) is the board, (7) is the connector, (8) is the thin film, (9
) is the stopper, (10) is the tank, (11) is the pump, (12) is the heat exchanger, and (13) is the frame. Note that the same or corresponding parts in FIG. 9 are designated by the same reference numerals.

Claims (1)

[Claims] In an electronic device in which a plurality of electronics modules that require cooling are combined and these electronics modules are mounted on a wall surface of a structure having a free-form surface, a rectangular parallelepiped-shaped electronics module that sends and receives electrical signals, a heat sink having a predetermined size and a curved surface, which has a screw hole of a predetermined size, has a refrigerant flow path therein, fixes the electronics module by sandwiching the electronics module between the electronics module and the wall surface of the structure; - A connector that mates with the contacts of the module, a curved board part fixed on the free-form surface of the wall of the structure and on which a large number of the connectors are arranged, a manifold that distributes and supplies refrigerant to the heat sink and collects it, and the electronics. An electronic device comprising: a thin film having a predetermined size that constitutes a contact surface between a module and a refrigerant flowing inside the heat sink; and a cooling system capable of supplying and recovering the refrigerant flowing inside the heat sink.