JPH04744U - - Google Patents
Info
- Publication number
- JPH04744U JPH04744U JP1990038982U JP3898290U JPH04744U JP H04744 U JPH04744 U JP H04744U JP 1990038982 U JP1990038982 U JP 1990038982U JP 3898290 U JP3898290 U JP 3898290U JP H04744 U JPH04744 U JP H04744U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- upper mold
- fluid
- elastic body
- relief
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図〜第３図はこの考案の一実施例を示し、
第１図はリード成形装置によりフオーミングした
状態を示す断面図、第２図はテープキヤリアパツ
ケージをセツトした状態を示す断面図、第３図は
フオーミングする直前の状態を示す断面図、第４
図は従来のリード成形装置によりフオーミングし
た状態を示す図である。
８……フインガリード、９……絶縁性フイルム
（基板）、１０……下型、１１……上型、１２…
…逃げ部、１３……上型本体、１４……弾性体、
１５……流体。
Figures 1 to 3 show an embodiment of this invention,
Fig. 1 is a sectional view showing the state formed by the lead forming device, Fig. 2 is a sectional view showing the state where the tape carrier package is set, Fig. 3 is a sectional view showing the state immediately before forming, and Fig. 4 is a sectional view showing the state immediately before forming.
The figure shows a state in which the lead is formed by a conventional lead forming apparatus. 8... Finger lead, 9... Insulating film (substrate), 10... Lower mold, 11... Upper mold, 12...
... relief part, 13 ... upper mold body, 14 ... elastic body,
15...Fluid.
Claims (1)
ード成形装置であつて、 基板載置面にリードの突出した部分と対応する
箇所に逃げ部が設けられた下型と、 収縮変形可能な弾性体と、この弾性体に接合さ
れた上型本体により、内部に流体を密封した構造
に形成された上型と、 を備え、流体を加圧することにより、前記上型の
弾性体を、前記下型の逃げ部対応部分で膨出させ
て、リードをフオーミングすることを特徴とする
リード成形装置。[Scope of Claim for Utility Model Registration] A lead forming device for forming leads protruding from a board, comprising: a lower mold having a relief part at a location corresponding to the protruding part of the lead on the board mounting surface; and an upper mold formed in a structure in which a fluid is sealed inside by an upper mold body joined to the elastic body, and by pressurizing the fluid, the elastic body of the upper mold is . A lead forming apparatus, characterized in that the lead is formed by bulging at a portion corresponding to the relief portion of the lower die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038982U JPH04744U (en) | 1990-04-13 | 1990-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038982U JPH04744U (en) | 1990-04-13 | 1990-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04744U true JPH04744U (en) | 1992-01-07 |
Family
ID=31547474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990038982U Pending JPH04744U (en) | 1990-04-13 | 1990-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04744U (en) |
-
1990
- 1990-04-13 JP JP1990038982U patent/JPH04744U/ja active Pending
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