JPH0474564A - Coating device - Google Patents

Abstract

PURPOSE:To make maintenance easy and a structure adaptable for changes in size of the object to be treated by attaching a plate for preventing a treating liq. from rebounding against the object detachably to an opening part of a cup-like container. CONSTITUTION:A rotary support 20 adapted to rotate with the object W to be retained thereon is provided in a cup-like container 1. A treating liq. is supplied from an opening part 7A of the cup-like container 1 above the rotary support 20 onto the surface of the object W on the rotary support and the object W is rotated by the rotary support 20, whereby the treating liq. is applied to the surface of the object W in a desired film thickness. An annularly-shaped rebound preventing plate 30 is attached detachably to the opening part 7A of the container 1 to prevent the treating liq. scattering from the object W from impinging against the wall of the container 1 and rebounding against the object W. As a result, the maintenance becomes easy and the rebound preventing plate can be replaced according to changes in size of the object.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a coating device.

[Conventional technology]

In a photolithography process in a semiconductor manufacturing process, a photoresist film is applied to an object to be processed, such as a semiconductor wafer, and then exposed to light to form a mask with a desired pattern, and then an etching process or the like is performed. The photoresist film must have a uniform thickness over the entire surface of the wafer, and a spin coating device is generally used. This spin coating device has a rotating mounting table in a processing chamber consisting of a cup-shaped container (hereinafter referred to as a spinner cup), and the wafer is fixed to this rotating mounting table by vacuum suction. A nozzle for supplying resist liquid is installed at the opening position of the spinner cup. Then, the photoresist solution is dripped from this nozzle onto the surface of the wafer that is suctioned and fixed on the rotating mounting table, and while the inside of the spinner cup is evacuated, the rotating mounting table is rotated to rotate the wafer. is spread over the entire surface of the wafer, and at the same time, unnecessary liquid is scattered out of the wafer, and by adjusting the rotation speed and rotation time, a photoresist film of a desired thickness is formed on the wafer surface. By the way, in this rotary coating device, when unnecessary resist liquid is scattered outside the wafer, the resist liquid hits the inner wall of the spinner cup and bounces off, and the splashed resist adheres to the wafer, forming a uniform resist on the wafer. It becomes impossible to apply the film. For this reason, in order to prevent these rebounding resist droplets from adhering to the wafer, a cylindrical partition plate has been fixedly provided inside the spinner cup (Japanese Patent Laid-Open No. 51-151
No. 738), attaching a register liquid splash prevention plate or a register liquid reflecting plate to the spinner cup (Japanese Patent Application Laid-Open No. 61-4
6028), and a ring-shaped shielding plate is provided slightly away from the wafer (Japanese Patent Publication No. 53-37701).
Measures such as these are being taken.

[Problem to be solved by the invention]

However, conventional cylindrical partition plates, splash prevention plates, etc. for preventing the resist liquid from splashing back and adhering to them are fixedly attached to the spinner cup and cannot be removed, making maintenance troublesome. Additionally, when the semiconductor wafer to be coated is changed, it is not possible to change the dimensions to match the wafer size, and there are drawbacks such as the need to prepare coating equipment that matches the wafer size. . In view of the above points, it is an object of the present invention to provide a coating device that is easy to maintain and is equipped with a means for preventing adhesion of resist rebound, which can be easily changed to an appropriate structure in response to changes in the size of the object to be processed. That is.

[Means to solve the problem]

In the present invention, a rotating mounting table that holds and rotates the object to be processed is provided in a cup-shaped container, and a processing liquid is applied onto the rotating mounting table from an opening of the cup-shaped container located above the rotating mounting table. In an apparatus for applying a processing liquid to a desired thickness on the surface of the object to be processed by rotating the object to be processed on a rotary mounting table, the processing liquid is sprayed from the object to be processed. The present invention is characterized in that an annular anti-splashing device is detachably attached to the opening of the cup-shaped container to prevent the processing liquid from hitting the wall of the cup-shaped container and rebounding to the object to be processed.

[Effect]

In this invention, since the annular rebound adhesion prevention device is removably fitted into the opening of the cup-shaped container,
It can be easily removed and repaired. Further, if the size of the object to be treated is changed, the annular rebound adhesion prevention device can also be changed to match the size.

【Example】

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings, taking the case of a resist coating apparatus as an example. FIG. 1 shows a longitudinal sectional view of the resist coating apparatus of this example, and the spinner cup 1 is made of, for example, SUS.
It has a cup-like shape. This spinner cup 1 has a groove 4 in which concentric vertical walls 2゜3 are continuous at the bottom, and a through hole 5 is provided in a part of the bottom of the groove 4 on the left side in the figure. Hole 5
is connected to the drain duct 6. A bending member 7 having an inclination of a predetermined angle, for example 30 degrees, with respect to the horizontal direction is attached to the upper end edge of the outer vertical wall 2, thereby forming an outer cup 8. This bending member 7 has an annular structure with an open lower A at its center. Further, an inner cup member 10 is attached to the inner vertical wall 3. The inner cup member 1° includes a portion 9 having an L-shaped cross section, an inclined portion 11 inclined at a predetermined angle, for example, 15° with respect to the horizontal direction, and a portion from the inclined portion 11 near a rotary mounting table 2°, which will be described later. A horizontal extension part 12 extends horizontally up to a point 1, and a vertical extension part 13 is vertically bent from the inclined part 11 into the groove part 4. Further, an exhaust duct 9A is attached to the bottom of the above-mentioned C-shaped portion 9, and an exhaust blower (not shown) is attached to the bottom.
The structure is such that forced exhaust is performed. Then, the rotary mounting table 20 is installed in the spinner cup 1 configured as described above. In this case, the rotating mounting table 20
is configured to rotate at high speed around a rotating shaft 21 by a rotating mechanism (not shown). Further, the rotary mounting table 20 is set such that its mounting surface is slightly higher than the horizontally extending portion 12 of the inner cup member 10. Therefore, as shown in the figure, when the wafer W is placed on the rotary mounting table 20, the back surface of the wafer W that protrudes outside the rotary mounting table 20 faces the inner cup portion +4' 10. There is. Then, the opening lower A of the bent piece 7 constituting the outer cup 8
An annular rebound adhesion prevention plate 30 is fitted onto the edge of the plate and is detachably attached. This annular rebound adhesion prevention plate 30 is made of Delrin, for example, and has an outer periphery with a diameter larger than the diameter of the opening lower A of the outer cup 8, and an outer circumference of the outer cup 8. It is composed of an annular portion 31 which is sandwiched between an inner periphery having a smaller diameter than the opening lower A of the spinner cup 1, and a protruding piece 32 that extends inward from the annular portion 31 into the spinner cup 1, as shown in FIG. The cross section is L-shaped. The protruding piece 32 is longer than the thickness of the bent piece 7 of the outer cup 8 and extends to a position slightly higher than the surface of the wafer W on the mounting table 20. In this case, the diameter of the outer circumferential side surface 32A of the protrusion piece 32 is selected to be approximately equal to the diameter of the open lower A, and in this example, the protrusion piece 32 becomes thinner toward its tip. As shown, the outer peripheral side surface 32A of the projection piece 32 is a tapered surface. This tapered surface allows the outer cup 8 and the prevention plate 30 to fit together without rubbing against each other when attaching the rebound adhesion prevention plate 30 to the open lower A section of the outer cup 8. Generation of garbage can be prevented. Then, the annular portion 31 and the bent piece 7 of the outer cup 8 are securely brought into contact and fixed by the weight of the prevention plate 30. Of course, sliding fitting, press fitting, screw fitting, clasp, etc.
It only needs to be detachable. FIG. 3 shows another example of the rebound adhesion prevention plate 30. In this example, the outer peripheral side surface 3 of the projection piece 32 of this prevention plate 30 is
2A has a shape that bulges outward as shown in the figure,
This bulging shape prevents the prevention plate 30 from coming off from the outer cup 8 with a weak force and is firmly fixed. Furthermore, above the opening lower A of the outer cup 8, a resist liquid supply nozzle 40 is installed. Next, the operation of this resist coating device will be explained. First, apply a predetermined amount of resist solution to the nozzle 40.
dripped on top. Next, while suctioning and exhausting from the exhaust port with an exhaust blower (not shown), the transfer mounting table 20
rotates, the wafer W rotates, and the resist is spread over the entire surface of the wafer W by centrifugal force. Then, unnecessary resist liquid is thrown away from the workpiece. The blown resist droplets are sucked downward by the exhaust air as shown in the figure, and also hit the inner wall surface of the spinner cup 1 and try to bounce back to the front side of the wafer W. This presence prevents the resist droplets from adhering to the surface of the wafer W. In addition, the wafer W is
It also prevents it from bouncing back to the back side. That is, the resist splashes blown off from the wafer W are transferred to the inner cup member 1.
However, the rebound hardly occurs on the wafer W side due to the slope 1]. When the above-described resist coating process is performed on a plurality of wafers, the rebound adhesion prevention plate 30 becomes dirty. At this time, since the rebound adhesion prevention plate 30 is removable, the prevention plate 30 can be removed from the spinner cup 1 and cleaned or replaced with a new prevention plate 30. In addition, when changing the wafer to which the resist is applied to a different size, the rebound of the corresponding size 1
It can be easily replaced with a 71 wear prevention plate. For example, if the wafer size is smaller, the rebound adhesion prevention plate 30 is replaced with one that has a thicker protrusion piece 32 portion and a center opening that is smaller in size depending on the wafer size. When the wafer size changes significantly, the dimensions of the cup etc. will change corresponding to the wafer size, but in that case, the size of the annular part 31 and the thickness of the protruding piece 32 as the rebound adhesion prevention plate 30 will remain the same. However, it is also possible to use a cup whose dimensions correspond to the wafer size. That is,
For example, the inner diameter d of the rebound adhesion prevention plate 30 is changed to 11.2 mm when the wafer size is 4 inches, 137 mm when the wafer size is 5 inches, and 1-62 mm when the wafer size is 6 inches. It is something to do. Note that although the above example is a case in which the present invention is applied to a resist coating apparatus for wafers, the present invention is applicable to all apparatuses that apply developing processing liquids and other processing liquids. It goes without saying that the object to be processed is not limited to wafers. daddy

【Effect of the invention】

As explained above, according to the present invention, the plate for preventing the processing liquid from rebounding onto the object to be processed is removably attached to the opening of the cup-shaped container, so that the plate for preventing the rebound and adhesion to the object can be replaced. By cleaning, unnecessary processing liquid that has splashed back can be disposed of, making maintenance easier, and the splash-back adhesion prevention plate can be replaced as the size of the object to be coated changes. can.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a resist coating apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are sectional views of an example of a rebound adhesion prevention plate. 1; Spinner cup 6; Drainage duct 7; Bending piece 8; Outer cup 9A, exhaust duct 10; Inner cup member 20; People Patent Attorney Masami Sato

Claims (1)

[Scope of Claims] A rotating mounting table that holds and rotates the object to be processed is provided in a cup-shaped container, and a processing liquid is applied to the rotating mounting table from an opening of the cup-shaped container located above the rotating mounting table. In an apparatus for applying a processing liquid to a desired thickness on the surface of the object to be processed by supplying the processing liquid to the surface of the object to be processed on a mounting table and rotating the object to be processed by a rotating mounting table, An annular anti-splashing device is detachably attached to the opening of the cup-shaped container to prevent the processing liquid from hitting the wall of the cup-shaped container and rebounding to the object to be processed.