JPH04751U - - Google Patents
Info
- Publication number
- JPH04751U JPH04751U JP4038190U JP4038190U JPH04751U JP H04751 U JPH04751 U JP H04751U JP 4038190 U JP4038190 U JP 4038190U JP 4038190 U JP4038190 U JP 4038190U JP H04751 U JPH04751 U JP H04751U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- elements
- accommodating
- recesses
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011295 pitch Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 1
Description
第１図ａは本考案の実施例１を示す平面図、第
１図ｂは第１図ａの−線断面図、第２図ａは
本考案の実施例２を示す平面図、第２図ｂは第２
図ａの−線断面図、第３図ａは従来例を示す
断面図、第３図ｂは同平面図である。
１……接着剤塗布済みのカバーテープ、２……
半導体素子収納用エンボステープ、２ａ……無底
の素子収納用凹部、３……半導体素子、４……切
断分離用ミシン目、５……熱圧着式カバーテープ
。
FIG. 1a is a plan view showing the first embodiment of the present invention, FIG. b is the second
FIG. 3A is a cross-sectional view taken along the line ``-'' in FIG. 3A, FIG. 3A is a sectional view showing a conventional example, and FIG. 3B is a plan view thereof. 1...Cover tape with adhesive applied, 2...
Embossed tape for housing semiconductor elements, 2a... Bottomless recess for housing elements, 3... Semiconductor elements, 4... Perforations for cutting and separation, 5... Thermocompression bonding type cover tape.
Claims (1)
２のカバーテープとを有する半導体素子収納用テ
ーピングテープであつて、 前記素子収納用エンボステープは、無底の素子
収納用凹部を長さ方向に一定ピツチ毎に備えてお
り、 前記第１のカバーテープは、前記素子収納用凹
部の底部を封止するものであり、 前記第２のカバーテープは、前記素子収納用凹
部の上部開口を封止するものであることを特徴と
する半導体素子収納用テーピングテープ。 (2) 前記第１のカバーテープは、接着剤を塗布
したものであり、その接着剤塗布面を前記素子収
納用凹部の底部側に向けて前記素子収納用エンボ
ステープに貼着されたものであることを特徴とす
る請求項第(1)項に記載の半導体素子収納用テー
ピングテープ。[Claims for Utility Model Registration] (1) A taping tape for accommodating semiconductor elements, comprising an embossed tape for accommodating elements, and first and second cover tapes, wherein the embossed tape for accommodating elements is a bottomless tape. Recesses for accommodating elements are provided at regular pitches in the length direction, the first cover tape seals the bottom of the recesses for accommodating elements, and the second cover tape seals the bottom of the recesses for accommodating the elements. A taping tape for storing semiconductor elements, characterized in that it seals an upper opening of a recess for storing. (2) The first cover tape is coated with an adhesive, and is attached to the element housing embossed tape with the adhesive coated surface facing the bottom side of the element housing recess. The taping tape for storing semiconductor elements according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4038190U JPH04751U (en) | 1990-04-16 | 1990-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4038190U JPH04751U (en) | 1990-04-16 | 1990-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04751U true JPH04751U (en) | 1992-01-07 |
Family
ID=31550123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4038190U Pending JPH04751U (en) | 1990-04-16 | 1990-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04751U (en) |
-
1990
- 1990-04-16 JP JP4038190U patent/JPH04751U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04751U (en) | ||
| JPS60103855U (en) | solar cell module | |
| JPS5820598U (en) | Packaging materials for semiconductor devices | |
| JPS61126283U (en) | ||
| JPS60139750U (en) | blister packaging | |
| JPS623455U (en) | ||
| JPH0335066U (en) | ||
| JPH01167052U (en) | ||
| JPH0270450U (en) | ||
| JPS6439268U (en) | ||
| JPS63120880U (en) | ||
| JPS5952697U (en) | packaging tape | |
| JPS6323258U (en) | ||
| JPS6426856U (en) | ||
| JPH0290266U (en) | ||
| JPH0263368U (en) | ||
| JPS6184956U (en) | ||
| JPH02142536U (en) | ||
| JPH0310532U (en) | ||
| JPH03117692U (en) | ||
| JPS62137251U (en) | ||
| JPH0470738U (en) | ||
| JPS60101462U (en) | Container with lid | |
| JPH01128568U (en) | ||
| JPH042029U (en) |