JPS6426856U - - Google Patents
Info
- Publication number
- JPS6426856U JPS6426856U JP1987121894U JP12189487U JPS6426856U JP S6426856 U JPS6426856 U JP S6426856U JP 1987121894 U JP1987121894 U JP 1987121894U JP 12189487 U JP12189487 U JP 12189487U JP S6426856 U JPS6426856 U JP S6426856U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead
- die part
- recess provided
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す平面図、第
２図はその―線における断面図、第３図はこ
の発明で半導体素子を接合した状態を示す平面図
、第４図はその―線における断面図、第５図
は同様に―線における断面図、第６図は従来
の例を示す平面図、第７図はその―線におけ
る断面図、第８図は従来例において半導体素子を
接合した状態を示す平面図、第９図はその―
線における断面図である。図中、１はリードフレ
ーム、２はダイパツトリード、３は宙吊りリード
、４は位置決め用穴、５はインナリード、６は位
置決め用凸部である。なお、各図中同一符合は同
一または相当部分を示す。
FIG. 1 is a plan view showing an embodiment of this invention, FIG. 2 is a cross-sectional view along the line ``-'', FIG. 3 is a plan view showing a state in which semiconductor elements are bonded according to the invention, and FIG. 5 is a sectional view taken along the line, FIG. 6 is a plan view showing a conventional example, FIG. 7 is a sectional view taken along the line ``-'', and FIG. 8 is a sectional view taken along the line ``-'' in the conventional example. A plan view showing the joined state, Figure 9 is the -
FIG. In the figure, 1 is a lead frame, 2 is a die part lead, 3 is a suspended lead, 4 is a hole for positioning, 5 is an inner lead, and 6 is a convex part for positioning. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ダイパツトリードと、外部インナリードと、前記
半導体素子の表面に形成された電極部と、外部イ
ンナリードを接続する導体と、これらを保護する
封止材とで構成された半導体装置において、前記
半導体素子の裏面に凹部を設けるとともに、この
凹部にはめ合う凸部をダイパツトリード上に設け
たことを特徴とする半導体装置。 A semiconductor element, a die part lead for bonding and holding the semiconductor element, an external inner lead, an electrode portion formed on the surface of the semiconductor element, a conductor for connecting the external inner lead, and a sealing material for protecting these. 1. A semiconductor device comprising: a recess provided on the back surface of the semiconductor element; and a protrusion fitted into the recess provided on the die part lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121894U JPS6426856U (en) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121894U JPS6426856U (en) | 1987-08-06 | 1987-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426856U true JPS6426856U (en) | 1989-02-15 |
Family
ID=31369322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987121894U Pending JPS6426856U (en) | 1987-08-06 | 1987-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426856U (en) |
-
1987
- 1987-08-06 JP JP1987121894U patent/JPS6426856U/ja active Pending