JPH0476051U - - Google Patents
Info
- Publication number
- JPH0476051U JPH0476051U JP11944890U JP11944890U JPH0476051U JP H0476051 U JPH0476051 U JP H0476051U JP 11944890 U JP11944890 U JP 11944890U JP 11944890 U JP11944890 U JP 11944890U JP H0476051 U JPH0476051 U JP H0476051U
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- leads
- cathode
- solder
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002659 electrodeposit Substances 0.000 claims 1
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例によるリードの半
田メツキ装置の構成を示す正断面図、第２図は同
実施例の下受台の構成を示す平面図、第３図は従
来の半田メツキ治具の構成を示す斜視図、第４図
は同半田メツキ治具を用いた半田メツキ方法を説
明するための図である。
５……本体部、６……リード、１１……陰極、
１２……下受台、１２ｂ……大径管路、１２ｃ…
…小径管路、１２ｄ……噴出管路、１３……陽極
、１９……容器、２０……タンク、２１……吸入
管路、２２……ポンプ、２３……排出管路、２５
……第１フイルタ、２６……第２フイルタ、Ａ…
…半田メツキ液。
Fig. 1 is a front cross-sectional view showing the structure of a lead soldering device according to an embodiment of this invention, Fig. 2 is a plan view showing the structure of the lower pedestal of the same embodiment, and Fig. 3 is a conventional solder plating device. FIG. 4, a perspective view showing the configuration of the jig, is a diagram for explaining a solder plating method using the same solder plating jig. 5... Main body, 6... Lead, 11... Cathode,
12... lower holder, 12b... large diameter pipe, 12c...
...Small diameter pipe line, 12d...Ejection pipe line, 13...Anode, 19...Container, 20...Tank, 21...Suction pipe line, 22...Pump, 23...Discharge pipe line, 25
...First filter, 26...Second filter, A...
...Solder plating liquid.
Claims (1)
リードに当接する陰極と、 前記リードに対して、前記陰極と反対側に配設
される陽極と、 を有し、半田メツキ液中において前記陽極と前記
陰極との間に電流を流すことにより、前記リード
に半田を電析させるリードの半田メツキ装置にお
いて、 前記半田メツキ液を圧送して、前記各リードに
向かう半田メツキ液の流動を生じさせると共に、
該流動する半田メツキ液を回収し、再循環させる
流動手段と、 前記流動手段の圧送側に介装され、圧送される
半田メツキ液を濾過する濾過手段と、 を備えたことを特徴とするリードの半田メツキ装
置。[Claims for Utility Model Registration] A semiconductor device comprising: a cathode that comes into contact with a plurality of leads disposed around the main body of the semiconductor device; and an anode disposed on the opposite side of the cathode with respect to the leads. and in a lead soldering device that electrodeposits solder on the leads by passing a current between the anode and the cathode in a solder plating solution, the solder plating solution is pumped and applied to each of the leads. While creating a flow of solder plating liquid towards the
A lead characterized by comprising: a flow means for collecting and recirculating the flowing solder plating liquid; and a filtration means interposed on the pressure feeding side of the flow means for filtering the solder plating liquid being pumped. solder plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (en) | 1990-11-16 | 1990-11-16 | Lead solder plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (en) | 1990-11-16 | 1990-11-16 | Lead solder plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476051U true JPH0476051U (en) | 1992-07-02 |
| JPH087642Y2 JPH087642Y2 (en) | 1996-03-04 |
Family
ID=31867405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119448U Expired - Fee Related JPH087642Y2 (en) | 1990-11-16 | 1990-11-16 | Lead solder plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087642Y2 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPS6067689A (en) * | 1983-09-22 | 1985-04-18 | Nec Corp | Method and apparatus for plating |
| JPS6092497A (en) * | 1983-10-27 | 1985-05-24 | Nec Corp | Plating device |
| JPS61253399A (en) * | 1985-05-07 | 1986-11-11 | Sumitomo Metal Ind Ltd | Device for cleaning up plating liquid |
| JPS6240391A (en) * | 1985-08-13 | 1987-02-21 | Matsushita Electric Ind Co Ltd | Electroforming equipment for information recording media |
| JPS62210688A (en) * | 1986-03-11 | 1987-09-16 | 日本碍子株式会社 | Method and apparatus for partial plating of ceramic package |
| JPS63243297A (en) * | 1987-03-31 | 1988-10-11 | Mitsubishi Metal Corp | Production of heat transfer tube |
| JPH02111898A (en) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | Producing device for semiconductor element |
-
1990
- 1990-11-16 JP JP1990119448U patent/JPH087642Y2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPS6067689A (en) * | 1983-09-22 | 1985-04-18 | Nec Corp | Method and apparatus for plating |
| JPS6092497A (en) * | 1983-10-27 | 1985-05-24 | Nec Corp | Plating device |
| JPS61253399A (en) * | 1985-05-07 | 1986-11-11 | Sumitomo Metal Ind Ltd | Device for cleaning up plating liquid |
| JPS6240391A (en) * | 1985-08-13 | 1987-02-21 | Matsushita Electric Ind Co Ltd | Electroforming equipment for information recording media |
| JPS62210688A (en) * | 1986-03-11 | 1987-09-16 | 日本碍子株式会社 | Method and apparatus for partial plating of ceramic package |
| JPS63243297A (en) * | 1987-03-31 | 1988-10-11 | Mitsubishi Metal Corp | Production of heat transfer tube |
| JPH02111898A (en) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | Producing device for semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087642Y2 (en) | 1996-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6214235B2 (en) | ||
| CN213555672U (en) | Enhancement mode liquid filter equipment | |
| JPS6394967U (en) | ||
| JP3286064B2 (en) | Wafer plating rack and plating method using the same | |
| CN209452087U (en) | A kind of sun-proof spray appliance of grape | |
| JPS62175075U (en) | ||
| CN214019546U (en) | High-efficient filter equipment of tin water moves back | |
| JPS648695U (en) | ||
| CN210135138U (en) | High-efficient hydraulic pressure filter core | |
| JPS58131958U (en) | Recovery tank device in high-speed continuous plating processing equipment | |
| JPS62157975U (en) | ||
| JPS58161627U (en) | Concentrated juice dilution device | |
| JPH0367073U (en) | ||
| JPS5886563U (en) | Magnetic powder liquid tank | |
| JPS588349Y2 (en) | sprayer | |
| JPH01174019U (en) | ||
| JPH0438325U (en) | ||
| JPS627328U (en) | ||
| JPS6026295U (en) | Shigo pump device | |
| JPS6351388B2 (en) | ||
| JPH01163027U (en) | ||
| JPS5848386U (en) | Electrolytic flotation separation equipment | |
| JPS60105883U (en) | pump equipment | |
| JPS63162539U (en) | ||
| JPH02149765U (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |