JPH0477134U - - Google Patents

Info

Publication number
JPH0477134U
JPH0477134U JP1990119742U JP11974290U JPH0477134U JP H0477134 U JPH0477134 U JP H0477134U JP 1990119742 U JP1990119742 U JP 1990119742U JP 11974290 U JP11974290 U JP 11974290U JP H0477134 U JPH0477134 U JP H0477134U
Authority
JP
Japan
Prior art keywords
chip
circuit board
flexible circuit
bonded
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990119742U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119742U priority Critical patent/JPH0477134U/ja
Publication of JPH0477134U publication Critical patent/JPH0477134U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Description

【図面の簡単な説明】
第１図１ 本発明の実施例におけ回路の接続方
法の第一の工程の分断面図、第１図２ 本発明の
実施例におけ回路の接続方法の第二の工程の分断
面図、第１図３ 本発明の他の実施例における第
二の工程の部分断面図、第２図１ 従来の実施例
における回路の接続方法の第一の工程の分断面図
、第２図２ 従来の実施例における回路の接続方
方法の第二の工程の分断面図、第２図３ 従来の
実施例における回路の接続方法の第３の工程の部
分断面図。 １，２１……ＩＣチツプ、２，２２……液晶パ
ネル、３，２３……電極パターン、４，２４……
フレキシブル回路基板、５，２５……ＩＣチツプ
を駆動する入力信号を供給する電極パターン、９
，２９……異方導電性接着剤層、７，２７……銅
箔パターン、８，２８……カバーレイ、６，２６
……接着剤層、１０……本発明における圧着ツー
ル、３０……従来における圧着ツールＡ、１１…
…テフロンシート、３１……従来における圧着ツ
ールＢ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣチツプ上に形成された接続電極と、上下２
    枚のガラスあるいは樹脂等よりなる基板の間に液
    晶層を挟持してなる液晶パネルの基板上に形成さ
    れた上記ＩＣチツプの接続電極と相対峙して形成
    された接続用回路が、絶縁性接着剤あるいは異方
    導電性接着剤あるいは導電ペースト等により接合
    された液晶パネルにおいて、上記ＩＣチツプを駆
    動する入力信号を供給する回路部品は、ポリイミ
    ドあるいはポリエステルあるいはポリエチレンテ
    レフタレート等のフレキシブル回路基板よりなり
    、上記フレキシブル回路基板のガラス基板上への
    接合部と上記ＩＣチツプのガラス基板上への接合
    を、上記フレキシブル回路基板とＩＣチツプの厚
    みの差分だけ、あるいは上記フレキシブル回路基
    板やＩＣチツプをガラス基板に接合するときにツ
    ールの下に敷くテフロン、Ｓｉゴムシート等の厚
    さを上記フレキシブル回路基板やＩＣチツプの厚
    みに加えた差分だけ段差をつけたツールにて一括
    して上記フレキシブル回路基板とＩＣチツプを圧
    着接合することを特徴とする回路の接合方法。
JP1990119742U 1990-11-15 1990-11-15 Pending JPH0477134U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119742U JPH0477134U (ja) 1990-11-15 1990-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119742U JPH0477134U (ja) 1990-11-15 1990-11-15

Publications (1)

Publication Number Publication Date
JPH0477134U true JPH0477134U (ja) 1992-07-06

Family

ID=31867679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119742U Pending JPH0477134U (ja) 1990-11-15 1990-11-15

Country Status (1)

Country Link
JP (1) JPH0477134U (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303130A (ja) * 2005-04-20 2006-11-02 Sharp Corp 駆動回路基板と表示パネルの接続方法
JP2006339613A (ja) * 2005-06-06 2006-12-14 Alps Electric Co Ltd 配線接続構造および液晶表示装置
WO2008102476A1 (ja) * 2007-02-22 2008-08-28 Sharp Kabushiki Kaisha 電子回路装置、その製造方法及び表示装置
JP2008205068A (ja) * 2007-02-19 2008-09-04 Matsushita Electric Ind Co Ltd 加圧ヘッドおよび部品圧着装置
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
JP2013048300A (ja) * 2012-12-03 2013-03-07 Dexerials Corp 熱圧着装置及び電気部品の実装方法
KR101271939B1 (ko) * 2006-02-01 2013-06-07 데쿠세리아루즈 가부시키가이샤 전기 부품의 실장 방법
JP2016072410A (ja) * 2014-09-30 2016-05-09 株式会社フジクラ プリント配線板

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
JP2006303130A (ja) * 2005-04-20 2006-11-02 Sharp Corp 駆動回路基板と表示パネルの接続方法
JP2006339613A (ja) * 2005-06-06 2006-12-14 Alps Electric Co Ltd 配線接続構造および液晶表示装置
KR101271939B1 (ko) * 2006-02-01 2013-06-07 데쿠세리아루즈 가부시키가이샤 전기 부품의 실장 방법
JP2008205068A (ja) * 2007-02-19 2008-09-04 Matsushita Electric Ind Co Ltd 加圧ヘッドおよび部品圧着装置
WO2008102476A1 (ja) * 2007-02-22 2008-08-28 Sharp Kabushiki Kaisha 電子回路装置、その製造方法及び表示装置
JP2013048300A (ja) * 2012-12-03 2013-03-07 Dexerials Corp 熱圧着装置及び電気部品の実装方法
JP2016072410A (ja) * 2014-09-30 2016-05-09 株式会社フジクラ プリント配線板
US10123411B2 (en) 2014-09-30 2018-11-06 Fujikura Ltd. Printed wiring board

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