JPH0477927B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improvement of a coordinate position detecting section of an electromagnetic induction digitizer.

[Prior Art] There are various types of digitizers for detecting the position of a point in a two-dimensional plane and outputting the coordinate position to a computer, such as a piezoelectric method, a capacitive coupling method, a magnetostrictive method, and an electromagnetic induction method. However, electromagnetic induction is currently the most commonly used method.

In the electromagnetic induction method, a magnetic field is generated in an input coil (cursor, slice pen), an induced current is generated in a detection line of a coordinate position detection section, and this change is detected to determine the position.

As a conventional coordinate position detection section, one in which an X-Y axis orthogonal coordinate circuit is formed by etching using both sides of a double-sided copper-clad glass epoxy laminated board is generally known.

Furthermore, Japanese Patent Application Laid-Open No. 59-225490 discloses that by etching a metal foil formed on each surface of a translucent insulating plastic film, a plurality of lines parallel to each surface are etched. It is described that conductors are formed so that linear conductors are perpendicular to each other on the front and back surfaces to form an X-Y axis orthogonal coordinate circuit.

[Problems to be Solved by the Invention] In all of the above-mentioned conventional techniques, an etching method is used to form the X-Y axis orthogonal coordinate circuit, and this method has many restrictions on manufacturing, so it is difficult to increase the size. This is difficult, and furthermore, there is a problem in that the regulations regarding the handling and management of the processing liquid result in an increase in costs. Particularly in recent years, with the spread of digitizers, there has been an increasing demand for larger sizes.
Up to AO size (840 x 1188mm).

The present invention has been made based on the above, and an object of the present invention is to provide a digitizer whose coordinate position detecting section can be enlarged, and which is easy to manufacture and inexpensive.

[Means for Solving the Problems] The digitizer of the present invention has a plurality of metal wires arranged in parallel at predetermined intervals using a plastic film coated with a hot melt adhesive on one side, and the adhesive is applied from above and below. The X-axis substrate and the Y-axis substrate are made by sandwiching the two sides facing each other and heating and pressurizing them to form a single body. Plastic protection plates are provided on both sides of the overlapping substrates so that the metal wires of each substrate are perpendicular to each other. The present invention is characterized by having a coordinate position detecting section formed by integrating these elements.

[Function] The substrate constituting the digitizer of the present invention is made up of a plurality of metal wires arranged in parallel, sandwiched from above and below by plastic films, and fixed in an array, and can be increased in size depending on the size of the plastic film. Moreover, since it is manufactured by arranging and fixing metal wires between plastic films, it is easy and inexpensive to manufacture.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view of an embodiment of the position detection section, FIG. 2 is a cross-sectional view taken along line A-A' in FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B' in FIG. FIG. 4 is an exploded explanatory diagram.

Reference numerals 1 and 2 denote metal wires, and by regularly arranging these metal wires in a grid pattern so as to electrically insulate them at predetermined intervals, an X-Y axis orthogonal circuit is formed.

Reference numeral 6 denotes a Y-axis substrate, which is constructed by sandwiching a plurality of metal wires 1 arranged in parallel at predetermined intervals between plastic films 3 and 4, and integrating them with a hot melt adhesive 5. . Similarly, for the X-axis substrate 10, a metal wire 2 is sandwiched between plastic films 7 and 8, and a hot melt adhesive 9 is applied.
It is constructed by integrating it via.

The Y-axis substrate 6 and the X-axis substrate 10 are made of plastic film that has been coated with a hot melt adhesive on one side in advance, and a metal wire is placed between the surfaces with the adhesive facing each other, and heated by a roll or press. It is manufactured by pressurizing and integrating, and can easily be manufactured in large sizes such as 1500 x 2000 mm, and even larger sizes are possible.

Reference numerals 11 and 12 designate protection plates made of plastic, and the Y-axis substrate 6 and the X-axis substrate 10 are overlapped between them so that the metal wires 1 and 2 are perpendicular to each other, and the position detection section is constructed by integrating them. Ru.

Reference numeral 13 denotes an ultrasonic welding section, whereby the protection plate 11, the Y-axis substrate 6, the X-axis substrate 10, and the protection plate 12 are stacked and integrated.

In this way, by integrating the Y-axis substrate 6 and the X-axis substrate 10 with the protection plates 11 and 12, it is possible to obtain a digitizer with sufficient mechanical strength.

In the present invention, the plastic film 3,
4, 7, 8 and the transparent protective plates 11, 12 are made of polyethylene, polypropylene, polyvinyl chloride resin, or polyester. Further, the metal wire is preferably a tin-plated annealed copper wire or a copper-plated annealed copper wire, but is not particularly limited.

[Effects of the Invention] As explained above, the digitizer of the present invention forms an X-Y axis orthogonal circuit by overlapping a plurality of substrates in which a plurality of metal wires arranged in parallel are arranged and fixed by sandwiching them between plastic films. This device has a coordinate position detecting section formed by the following method, can be made large-sized, and is easy and inexpensive to manufacture.

[Brief explanation of the drawing]

The attached drawings are explanatory diagrams of one embodiment of the present invention, in which FIG. 1 is a perspective view of the position detection section, FIG. 2 is a sectional view taken along line A-A' in FIG. 1, and FIG. B in Figure 1
-B' line sectional view, FIG. 4 is an exploded explanatory view. 1, 2: Metal wire, 3, 4, 7, 8: Plastic film, 5, 9: Adhesive, 6: Y-axis substrate, 1
0: X-axis board, 11, 12: plastic protection plate, 13: welded part.

Claims (1)

[Claims] 1. A plurality of metal wires arranged in parallel at a predetermined interval are held together by heating and pressurizing them by sandwiching them with the adhesive-bearing surfaces facing each other from above and below using a plastic film coated with a hot melt adhesive on one side. The present invention has a coordinate position detection unit that uses two substrates as an X-axis substrate and a Y-axis substrate, and integrates these by providing plastic protection plates on both sides of the two substrates stacked so that the metal wires of each substrate are perpendicular to each other. Digitizer features.