JPH04780U - - Google Patents
Info
- Publication number
- JPH04780U JPH04780U JP4031090U JP4031090U JPH04780U JP H04780 U JPH04780 U JP H04780U JP 4031090 U JP4031090 U JP 4031090U JP 4031090 U JP4031090 U JP 4031090U JP H04780 U JPH04780 U JP H04780U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- integrated circuit
- hybrid integrated
- rigid member
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図はこの考案の一実施例による混成集積回
路装置を示す斜視図、第２図はこの考案の一実施
例を示す断面図、第３図はこの考案の一実施例の
部分詳細図、第４図は従来の混成集積回路装置を
示す斜視図、第５図は従来の混成集積回路装置を
示す一断面図である。図において１……誘電体基
板、２……筺体、３……結合材、４……剛性部材
、５……他の電気部品、６……カバー、７……振
動環境下で誘電体基板が受ける変形方向、８……
剛性部材の足である。なお、図中、同一符号は同
一又は相当部分を示す。
FIG. 1 is a perspective view showing a hybrid integrated circuit device according to an embodiment of this invention, FIG. 2 is a sectional view showing an embodiment of this invention, and FIG. 3 is a partial detailed view of an embodiment of this invention. FIG. 4 is a perspective view of a conventional hybrid integrated circuit device, and FIG. 5 is a sectional view of the conventional hybrid integrated circuit device. In the figure, 1...dielectric substrate, 2...casing, 3...bonding material, 4...rigid member, 5...other electrical components, 6...cover, 7...dielectric substrate under vibration environment. Direction of deformation received, 8...
These are the legs of the rigid member. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
れた混成集積回路と、上記混成集積回路を実装す
る筺体と、上記誘電体基板と上記筺体の間に具備
する剛性部材と、上記誘電体基板と上記剛性部材
を結合する結合材と、上記剛性部材と上記筺体を
結合する結合材とを備えた混成集積回路装置。 (2) 上記剛性部材を上記誘電体基板に対応した
寸法とし、上記誘電体基板に与えられる変形に対
応した断面形状としたことを特徴とする実用新案
登録請求の範囲第(1)項記載の混成集積回路装置
。[Claims for Utility Model Registration] (1) A dielectric substrate, a hybrid integrated circuit formed on the dielectric substrate, a casing in which the hybrid integrated circuit is mounted, and a space between the dielectric substrate and the casing. A hybrid integrated circuit device comprising: a rigid member; a bonding material that couples the dielectric substrate and the rigid member; and a bonding material that couples the rigid member and the casing. (2) The above-mentioned rigid member has dimensions corresponding to the above-mentioned dielectric substrate, and a cross-sectional shape corresponding to the deformation given to the above-mentioned dielectric substrate. Hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031090U JPH04780U (en) | 1990-04-16 | 1990-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031090U JPH04780U (en) | 1990-04-16 | 1990-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04780U true JPH04780U (en) | 1992-01-07 |
Family
ID=31549990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4031090U Pending JPH04780U (en) | 1990-04-16 | 1990-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04780U (en) |
-
1990
- 1990-04-16 JP JP4031090U patent/JPH04780U/ja active Pending