JPH0478460B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for attaching a thin film and an apparatus for applying the same, and in particular to a laminate consisting of a photosensitive resin layer and a transparent resin film on a printed wiring board. The present invention relates to a method of thermocompression laminating films (thin films) and an apparatus for carrying out the method.

[Prior art]

There is a known device that successively attaches a laminate film to each printed wiring board that is carried on a roller conveyor or the like while cutting the film in accordance with the length of the board. As this cutting device, a moving cutter is generally used, which is a cutter having a rotating disc blade that moves back and forth across the laminated film.

[Problem to be solved by the invention]

However, with the conventional moving cutter,
In order for the laterally moving rotary disc blade cutter to correctly orthogonally cut the moving laminate film, the reciprocating movement of the moving cutter must be extremely rapid. In other words, the width of the laminated film is generally about 600 mm, so the rotating disc blade cutter has a width of about 700 mm.
need to be moved.

In the case of the conventional moving cutter, there is a limit to its moving speed, and therefore, there is a limit to the flow speed of the laminated film. Moreover, rapid starting and stopping of the rotary disc blade cutter causes a severe impact on the guide member of the cutter, posing a problem in that maintenance of the device requires a large amount of cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a film sticking method and an apparatus for quickly cutting a wide thin film using a rotary cutter and sticking the cut film thereon.

Another object of the present invention is to provide a rotary cutter for cutting film that can prevent impact on the guide member of the cutter.

Another object of the present invention is to provide a thin film sticking device with a simple structure.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a thin film application method in which a thin film corresponding to the length of the substrate is applied to a thin film application surface of a substrate using a pressure roller. the step of adsorbing the tip end side, and the step of bringing the thin film supplying member close to the thin film attachment surface side of the tip end portion of the substrate transported to the thin film attachment position in the conveying direction to supply a continuous thin film on the tip end side in the supply direction; a step of holding the tip side of the thin film in the feeding direction at the thin film sticking position; a step of separating the thin film supplying member from the thin film sticking surface side of the substrate; and a step of holding the thin film feeding member at the thin film sticking position. A pressure roller is brought close to the tip side of the thin film in the feeding direction, and the rotation of the pressure roller automatically supplies the thin film while stretching the thin film of the substrate from the tip of the substrate toward the rear end of the substrate in the conveying direction. A thin film is pasted on the surface for a predetermined distance, and at that point, the pressure roller and the substrate are quickly moved a certain distance in the substrate transport direction while pasting the thin film on the substrate, and then a certain distance in the opposite direction to the substrate transport direction. a step of moving the thin film to slacken the supplied thin film; a step of cutting the rear end side of the continuous thin film in the feeding direction corresponding to the length of the substrate in the conveying direction; and a step of cutting the rear end side of the continuous thin film in the feeding direction, The present invention is characterized by comprising the step of applying the end side to the thin film application surface at the rear end of the substrate in the conveyance direction using the pressure roller.

Further, the step of cutting the thin film may be performed using a rotary cutter.

Further, in a thin film attaching device that applies a thin film corresponding to the length of the substrate to a thin film attaching surface of a substrate using a pressure roller, the substrate is transported to a thin film attaching position and is evacuated from this thin film attaching position. A transport mechanism is provided, a thin film supplying member is provided that adsorbs the leading end side of the continuous thin film in the feeding direction and supplies the leading end side of the thin film in the feeding direction to the thin film application position, and near the thin film application position, The thin film supplying member has a holding surface that makes surface contact with the tip side in the feeding direction of the thin film supplied to the thin film application position, and is connected to a reduced pressure system that adsorbs the tip side of the thin film in the feeding direction to this holding surface. A thin film tip holding member having a thin film suction hole is provided, a fixed blade of a rotary cutter is provided on the thin film tip holding member, and a means for moving the thin film tip holding member back and forth toward the thin film from the rear of the thin film is provided. A rotary blade of the rotary cutter is provided in the apparatus main body so as to be movable back and forth toward the thin film from the front of the thin film, and the rotary blade of the rotary cutter is provided in the main body of the apparatus so as to be movable back and forth toward the thin film, and the rotary blade of the rotary cutter is provided in the main body of the apparatus so as to be movable back and forth toward the thin film. The present invention is characterized in that a pressure roller is provided that applies the substrate from the front end side to the rear end side from the thin film sticking surface at the leading end to the thin film sticking surface at the rear end in the conveying direction of the substrate.

Further, the pressure roller is configured to bring the pressure roller close to the tip side in the supply direction of the thin film held at the thin film application position, and convey the substrate while automatically supplying the thin film by rotation of the pressure roller. A thin film is pasted a predetermined distance on the thin film adhesion surface of the substrate from the leading end to the rear end of the direction, and at that point, the pressure roller and the substrate are moved a certain distance in the substrate transport direction while pasting the thin film on the substrate. It is characterized in that it is provided so as to be movable so that the supply thin film is then moved by a certain distance in the direction opposite to the substrate transport direction to slacken the supplied thin film.

Further, the rotary blade is rotatably supported at both ends on a sliding table that is movable back and forth from the front toward the thin film on a receiving plate connected to the base, and the sliding table is rotatable. It is characterized by being configured to be fixed at a predetermined position with respect to the support plate and to be able to move forward away from the thin film.

[Effect]

According to the above-mentioned means, the leading end side of the continuous thin film in the feeding direction is attracted to the thin film supplying member, and the thin film supplying member is attached to both sides of the leading end in the transporting direction of the substrate transported to the thin film pasting position. Supplying the leading end side of the continuous thin film in the feeding direction in close proximity, holding the leading end side of the thin film in the feeding direction at the thin film sticking position, and separating the thin film supplying member from the thin film sticking surface side of the substrate. , a pressure roller is brought close to the tip side in the supply direction of the thin film held at the thin film application position, and the thin film is automatically supplied by rotation of the pressure roller, and the thin film is moved from the tip to the rear in the conveyance direction of the substrate. A thin film is applied a predetermined distance to the thin film adhering surface of the substrate toward the end, and at that point, the pressure roller and the substrate are moved together with the substrate by a certain distance in the substrate transport direction while adhering the thin film to the substrate, and then the substrate is transported. The supplied thin film is moved a certain distance in the opposite direction to the supplied thin film, and the rear end side of the continuous thin film in the supplied direction is cut to correspond to the length of the substrate in the conveying direction, and the cut thin film is Since the rear end side in the feeding direction is pasted to the thin film pasting surface at the rear end of the substrate in the conveying direction by the pressure roller, a wide film can be quickly and reliably cut and pasted onto the substrate with a simple configuration. I can do it.

In addition, by providing a rotary cutter consisting of a rotating blade and a fixed blade installed at a position that traverses the film, the continuous film can be cut between the rotating blade and the fixed blade by simply rotating the rotating blade forward and backward momentarily. , wide film can be cut quickly and reliably.

Further, by providing the member that pivotally supports the rotary blade so as to be movable forward, it is possible to easily insert the continuous film before starting the operation, thereby improving work efficiency.

Further, the rotary blade is rotatably supported at both ends on a sliding table that can move back and forth toward the film on a receiving plate connected to the base, and the sliding table is rotatable on a receiving plate. The fixed blade is fixed at a predetermined position and movable forward away from the film, and the fixed blade is installed on the thin film tip holding member that moves back and forth toward the film, so it can quickly cut the film. In addition, it is possible to prevent impact on the guide member of the cutter.

Hereinafter, one embodiment of the present invention will be specifically described using the drawings.

In addition, in all the figures for explaining the examples,
Components having the same function are given the same reference numerals, and repeated explanations thereof will be omitted.

[Embodiments of the invention]

FIG. 1 shows a schematic configuration of an embodiment in which the present invention is applied to a film pasting device that heat-presses and laminates a laminate film consisting of a photosensitive resin layer and a transparent resin film on the front and back surfaces of a printed wiring board. show.

As shown in FIG. 1, the film sticking device of this embodiment continuously feeds a laminate film 1 consisting of a three-layer structure of a translucent resin film, a photosensitive resin layer, and a translucent resin film to a supply roller 2. It is wrapped around the target. The laminate film 1 of the supply roller 2 is separated into a transparent resin film (protective film) 1 by the film separation roller 3.
A. Laminate film 1 consisting of a photosensitive resin layer and a transparent resin film with one side (adhesive side) exposed
It is separated into each of B.

One of the separated translucent resin films 1A is configured to be wound up by a winding roller 4. The supply roller 2 and the take-up roller 4 are respectively provided above and below the substrate conveyance path.

The other separated laminate film 1
The leading end side of film B in the supply direction is supplied to a main vacuum plate (film supply member) 6 through a tension roller 5, as shown in FIG.

The main vacuum plate 6 is shown in Fig. 1 and Fig. 2.
As shown in Figure 1 (an enlarged view of the main part of Figure 1) and Figure 3 (a cross-sectional view taken along line A-A in Figure 2), the film approaches the film attachment position and moves away from it (in the direction of arrow A). is configured to move). In other words, the main vacuum plate 6 includes a support member 9 that is slidably attached to a guide rail 8 provided on the device body (the housing of the film sticking device) 7, and a support that is integrated with the support member 9. It is provided on the plate 9A. The main vacuum plates 6 are provided above and below the substrate conveyance path, respectively, and have a rack-and-pinion mechanism, that is, the main vacuum plates 6 have a rack 7A and a pinion 7B that fits into the rack 7A, and both are close to each other. or are configured to separate. 7F is a long hole. The drive source includes, for example, an air cylinder. The main vacuum plate 6
The movement is performed by a drive source 7C provided in the device body 7 and a rack-and-pinion mechanism connected thereto.
That is, a pinion 7D connected to the shaft of the drive source 7C, a rack 7E provided on the main body 7, and a rack 7E (third
(Figure). In this way, the main vacuum plate 6 is configured to be able to move independently in the direction of arrow A.

The tip end 6D of the main vacuum plate 6 on the side where the film is applied has a film suction surface formed in an arc shape, and a plurality of film suction holes are arranged, so that the film can be laminated against the elasticity of the laminated film 1B. The distal end side of the body film 1B in the supply direction can be held by suction on an arcuate surface. Tip 6
The leading end of the laminate film 1B held by suction D is supplied to a film attachment position by movement of the main vacuum plate 6 in the direction of arrow A.

A thin film tip holding member 10 is provided between the main vacuum plate 6 and the film attachment position in the vicinity of the supply path of the laminated film 1B. The thin film tip holding members 10 are provided above and below the substrate transport path, respectively, as described above.

This thin film tip holding member 10 is shown in FIG.
As shown in the cross-sectional view taken along the line B-B in the figure, the cutting position of the laminate film 1B is maintained, and the next stage of the laminate film 1B newly formed after cutting is
The distal end side of the main vacuum plate 6 in the supply direction can be held by suction on the distal end portion 6D of the main vacuum plate 6. In other words, the thin film leading end holding member 10 is configured to be able to move toward and away from the supply path of the laminate film 1B (moves in the direction of arrow C). In FIG. 4, 10B is a suction pipe. This thin film tip holding member 10 is a driving source 10A.
It is provided in the main body 7 of the device with a . The drive source 10A is composed of, for example, an air cylinder.

Further, the thin film leading end holding member 10 is configured to hold the rear end side of the laminate film 1B in the feeding direction when cutting the laminate film 1B at the cutting position. As shown in FIG. 5, a fixed blade 17 of a rotary cutter 13 is provided. That is, the rotary cutter 13 is moved back and forth together with the thin film tip holding member 10 from the rear of the laminate film 1B toward the laminate film 1B.

Further, the rotary blade 1 of the rotary cutter 13
6 is provided in the apparatus main body 7 so as to be movable back and forth from the front of the laminate film 1B toward the laminate film 1B.

The thermocompression roller 11 is constantly rotated so as to suppress temperature unevenness on its surface, and is configured to be movable between a retracted position shown by a solid line in FIG. 1 and a film application position shown by a dotted line. ing.

Further, the thermocompression roller 11 is placed close to the tip side in the supply direction of the laminated film 1B held at the thin film application position, and the thermocompression roller 1
1 automatically rotates the laminate film 1B.
The laminate film 1B is applied by a predetermined distance to the thin film adhering surface of the printed wiring board 14 from the leading end to the rear end in the conveying direction of the printed wiring board 14 while supplying the thermocompression roller 11. Board 1
The laminate film 1 is supplied by moving the laminate film 1B by a certain distance in the substrate transport direction while attaching the laminate film 1B to the substrate 14 by a certain distance, and then by a certain distance in the opposite direction to the substrate transport direction.
The vacuum bar 12, which is provided so as to slacken the laminate film 1B, attracts and holds the rear end side of the laminate film 1B in the feeding direction, which is to be laminated by thermocompression bonding with the thermocompression roller 11.
It is constructed to provide appropriate tension to prevent wrinkles and the like. The vacuum bar 12 is configured to rotate around the thermocompression roller 11. The thermocompression roller 11 and the vacuum bar 12 are respectively provided above and below the substrate conveyance path.

The printed wiring board 14 is transported to the board transport path by a board transport mechanism built in or attached to the film pasting device. In other words, the board transport mechanism transports the printed wiring board 14 to the film attachment position, heat-compresses and laminates the laminate film 1B onto the printed wiring board 14, and then transports the printed wiring board 14 from the film application position to the next exposure apparatus (evacuation). ). The substrate transport mechanism mainly includes a driving roller 15A and a driven roller 15B.

In the present invention, the rotary cutter 13 is particularly used as a cutting device for cutting the continuously supplied laminate film 1B into a predetermined length.

This rotary cutter 13 is composed of a set of a rotary blade 16 and a fixed blade 17, which are made to a required length across the laminated film 1B as described above.
As shown in FIGS. 5 to 9, the rotary blade 16 is originally located diagonally on the upper surface of the strip plate and has a blade edge 18.
, and is laminated between a disk 19 provided at both ends and a fixed blade 17 that is rotated forward and backward by a predetermined angle about the center of the disk 19 as an axis, and is supported in contact with the circumferential surface of the disk 19. The body film 1B is cut across the body film 1B. The fixed blade 17 is provided on the thin film tip holding member 10 with a sheet-like elastic body (for example, hard rubber) interposed therebetween, and together with the thin film tip holding member 10, the fixed blade 17 is arranged in the direction of the arrow in FIGS. 1 and 8. As shown in C, it is arranged to be close to and away from the supply path of the laminate film 1B.

Cut this rotary cutter 13 part into the fifth
6, 7, and FIG. 8, which shows an exploded view of the lower rotary cutter 13.

The rotary blade 16 is supported pivotally across both side plates 21 of a sliding table 20 which is provided so as to be movable back and forth with respect to the pasting device, and has a crank portion 22 provided at the shaft end of the air cylinder attached to the side plates 21. 23, and is rotated forward and backward by a predetermined angle. This sliding table 20 has an L-shaped mounting member 24 attached to the base frame of the pasting device.
The step part 21A of both side plates 21 is engaged with the support plate 26 which is protruded from the left and right parts of the rear side of the horizontal rod 25 which is fixed horizontally through the support plate 26. However, it can be slid freely by pulling up the locking knob 27 provided on the top surface against the spring provided inside. In addition, 28 is a stopper with an adjustment screw attached to the lower surface of the sliding table 20, and when the sliding table 20 is pushed toward the fixed blade, the tip of the adjusting screw is attached to the projection 29 on the upper surface of the support plate 26. The rotary blade 16 is in contact with the fixed blade 17 so that the rotary blade 16 is always held at a predetermined position.
Reference numerals 30 and 31 are air blowing tubes which are held at both ends by the side plates 21, and have air blowing holes arranged in a row on the circumferential surface, and the blown air heats the laminated film 1B when necessary. Pressure roller 11
and is pressed toward the tip of the main vacuum plate 6. It should be noted that the thin film tip holding member 10 in this embodiment is provided with a suction hole, so that the laminate film 1B is suctioned and fixed when the laminate film 1B is cut.

Next, the cutting operation of the laminate film 1B in the film (thin film) sticking device of this embodiment will be briefly explained.

First, the leading end side of the stacked film 1B separated by the film separating roller 3 by hand in the feeding direction is connected between the front side of the fixed blade 17 of the thin film leading end holding member 10 and the rear part of the rotary blade 16 of the sliding table 20. At the same time, the leading end side of the laminated film 1B is pressed against the thin film leading end holding member 10 through the air blowing pipes 30 and 31, and then each part is operated to perform continuous operation like the conventional device. .

In this case, as described above, the laminated film 1B is cut by rotating the rotary blade 16 and instantly cutting the laminated film 1B between the fixed blade 17 and the rotary blade 16. At this time,
Since the blade edge 18 of the rotary blade 16 is slightly oblique to the axis, cutting resistance is reduced and cutting can be performed reliably and quickly. Furthermore, even if the blade edge 18 of the rotary blade 16 is slightly oblique to the axis, the laminated film 1
Since it is cut when B is temporarily slack, there is no risk that the laminate film 1B will be cut diagonally. Furthermore, in order to position the leading end of the laminated film 1B before starting, the slide table 20 can be easily pulled out forward via the locking knob 27, and after being pulled out, it is sufficient to simply push it back.

Next, the pasting process (thermocompression bonding lamination) using the above-mentioned thin film pasting device will be briefly explained using Figures 10 to 16 (schematic diagrams showing the main parts of each pasting operation process). do.

First, as shown in FIG. 10, the leading end side of the laminate film 1B separated by the thin film separating roller 3 in the feeding direction is manually connected to the thin film suction surface 10D of the thin film leading end holding member 10 and the rotary cutter. 13.

Next, the thin film suction surface 1 of the thin film tip holding member 10
At 0D, the leading end side of the laminate film 1B in the feeding direction is held by suction. Thereafter, the thin film tip holding member 10 is moved in the direction of arrow C by the drive source 7F shown in FIG. The distal end side in the supply direction is moved and held by suction on the distal end portion 6D of the main vacuum plate 6.

Note that when continuous operation is performed, the leading end side of the stacked body 1B cut by the rotary cutter 13 in the supply direction is attracted and held by the leading end portion 6D of the main vacuum plate 6.

Next, the driving roller 15 is moved by the substrate transport mechanism.
A and the driven roller 15B make the substrate transport path.
The leading end of the printed wiring board 14 in the transport direction is stopped at the thin film application position. This stopping is performed by detecting the leading end of the printed wiring board 14 in the transport direction using a sensor, and stopping the driving roller 15A of the board transport mechanism based on this detection signal. The printed wiring board 14 transported by the board transport mechanism passes between the thin film tip holding members 10 arranged above and below the substrate transport path.

Next, as shown in FIG. 12, the main vacuum plate is moved (in the direction of arrow A) toward the front end surface (thin film attachment surface) in the transport direction of the printed wiring board 14 that has stopped at the thin film attachment position. 6 and its tip 6D are brought close to each other, and the tip side of the laminate 1B in the feeding direction is supplied to the thin film application position.

Next, as shown in FIG. 13, the suction holding of the laminated film 1B on the main vacuum plate 6 and its tip 6D is released, and the main vacuum plate 6 and its tip 6D are moved to the film attachment position. Then, the tip portion 6D is brought into contact with the film sticking surface of the tip portion of the printed wiring board 14 in the conveying direction.

Next, as shown in FIG. 14, the main vacuum plate 6 and its tip 6D are moved away from the film application position. The main vacuum plate 6 and its tip 6D are moved away from the position shown in FIG. 10 to the supply roller 2 side. Based on this operation, the thermocompression roller 11 starts moving from the retracted position to the film application position.

Next, when the thermocompression roller 11 moves to the film sticking position, it comes into contact with the most extreme side of the laminate film 1B in the feeding direction with an appropriate pressing force. Then, the printed wiring board 14 is transported in the direction of arrow E by the board transport mechanism by the rotation of the thermocompression roller 11, and thermocompression lamination is started.

Next, as shown in FIG. 15, printing is carried out from the front end to the back end of the printed wiring board 14 in the conveying direction while automatically feeding the laminate film 1B by the rotation of the thermocompression roller 11. The laminate film 1B is attached to the film attachment surface of the wiring board 14 by a predetermined distance, and at that point, the pressure roller 11 is applied to the printed wiring board 14 by a fixed distance while applying the laminate film 1B to the printed wiring board 14. (Move to position A indicated by the dotted line in FIG. 15) together with the printed wiring board 14.

The thermocompression roller 10 and the printed wiring board 14 are attached to the printed wiring board 14, and the laminate film 1 is attached to the printed wiring board 14.
While the laminated film 1B is being moved in the substrate conveying direction while being applied, the laminate film 1B is pulled out from the supply roller 2 by the moving operation.

When a sensor installed in the conveyance path detects that the rear end of the laminated film 1B has reached a predetermined position in the substrate conveyance device, based on the detection signal, (a) the thin film tip holding member 10 body film 1
B, the main vacuum plate 6 and the thin film tip holding member 10 attract and hold the laminate film 1B. In this case, the thin film tip holding member 10
The length of the laminate film 1B between the tip of the fixed blade 17 provided on the substrate and the film pressing point of the thermocompression roller 11 is made to be substantially equal to the length of the remaining portion of the film on the substrate surface. It is set. (b) The thermocompression roller 10 and the printed wiring board 14 are moved by a certain distance in the direction opposite to the board conveyance direction in synchronization with the suction and holding by the thin film tip holding member 10 of the suction laminate film 1B. . The position after the movement is completed is position B shown by the solid line in FIG. Due to the suction and holding by the thin film leading end holding member 10 and the movement, the supplied laminate film 1B between the thin film leading end holding member 10 and the thermocompression roller 11 becomes slack. In order to direct this slack direction toward the substrate transport direction, air is injected in the direction of arrow F shown in FIG. 16.

Next, as shown in FIG. 16, while the laminated film 1B is slack, the rotary cutter 13
Cut the laminate film 1B. By this cutting, the rear end side of the continuous laminate film 1B in the feeding direction corresponds to the length of the printed wiring board 14 in the feeding direction. Immediately before cutting, the suction of the main vacuum plate 6 and the thin film tip holding member 10 is released.

Next, the rear end side of the cut laminate film 1B in the feeding direction is attached to the film attachment surface of the printed wiring board 14 at the rear end in the conveying direction using the thermocompression roller 11. In other words, the laminate film 1
The leading end side of B in the supply direction is successively thermocompression laminated from the leading end to the rear end of the printed wiring board 14 in the transport direction by rotation of the thermocompression roller 11 and transport of the printed wiring board 14. The laminate film 1B has a main vacuum plate 6
Since the suction operation of is stopped, the thermocompression roller 1
1 and conveyance of the printed wiring board 14, the printed wiring board 14 is automatically supplied to the thin film application position one after another. The vacuum plate 12 performs a suction operation, and applies appropriate tension to the laminated film 1B before thermocompression lamination to prevent wrinkles from forming on the laminated film 1B.

Next, the cut rear end side of the laminated film 1B in the feeding direction is thermocompression laminated to the film attachment surface of the rear end of the printed wiring board 14 in the conveyance direction, and the thermocompression lamination is completed. The vacuum plate 12 is rotated to retract the thin film tip holding member 10. Alternatively, the vacuum plate 12 may be rotated and the thermocompression roller 11 may be moved slightly to the extent that it does not get in the way. The suction operation is performed until just before the thermocompression bonding lamination is completed, giving appropriate tension to the laminate 1B and preventing the occurrence of wrinkles and the like. The printed wiring board 14 on which the thermocompression lamination has been completed is transported to the next stage exposure device by a board transport mechanism.

In this way, the leading end side of the continuous laminate film 1B in the feeding direction is attracted to the vacuum plate (thin film supplying member) 12, and the leading end side of the printed wiring board 14 in the transporting direction is transported to the film attachment position. The vacuum plate 12 is brought close to the thin film application surface side, and the leading end side of the continuous laminate film 1B in the feeding direction is supplied, and the leading end side of the laminate film 1B in the feeding direction is held at the film pasting position. Then, the vacuum plate 12 is separated from the printed wiring board 14, and the thermocompression roller 11 is brought close to the tip side in the feeding direction of the laminate film 1B held at the film sticking position,
The thermocompression bonding roller 11 is rotated to automatically supply the laminated film 1B onto the film-attached surface of the printed wiring board 14 from the leading end to the rear end in the conveying direction of the printed wiring board 14. The laminate film 1B is attached for a short distance, and at that point, the thermocompression roller 11 is applied to the printed wiring board 14 by a certain distance in the conveying direction of the printed wiring board 14.
4, and then moved by a certain distance in the direction opposite to the board conveyance direction to slacken the supply laminate film 1B, and the rear end side of the continuous laminate film 1B in the supply direction is attached to the printed wiring board 14. The printed wiring board 14 is cut to correspond to the length in the transport direction, and the rear end side of the cut printed wiring board 14 in the feeding direction is stretched with the pressure roller 11 to form a film on the rear end of the printed wiring board 14 in the transport direction. Since it is attached to the attached surface, the wide laminate film 1B can be quickly and reliably cut and attached to the printed wiring board 14 with a simple configuration.

Furthermore, by providing a rotary cutter 13 consisting of a rotary blade 16 and a fixed blade 17 provided at a position across the laminated film 1B, the rotary blade 16 and the fixed blade 17 can be separated by simply rotating the rotary blade 16 for a moment. Since the laminate film 1B is sandwiched, a wide laminate film 1B can be cut quickly and reliably.

Moreover, since the member 21 that pivotally supports the rotary blade 16 is provided so as to be movable forward, it is possible to easily insert the continuous film before starting the operation, thereby improving work efficiency.

Further, the rotary blade 16 is rotatably supported at both ends on a sliding table 20 which is movable back and forth toward the laminated film 1B on a support plate 26 connected to a base 25, and The sliding table 20 is fixed at a predetermined position with respect to the support plate 26 and is movable forward away from the laminated film 1B.
7 is provided on the thin film tip holding member 10 that moves back and forth from the rear of the laminate film 1B toward the laminate film 1B.
can be cut quickly, and impact on the guide member of the rotary cutter 13 can be prevented.

Although the present invention has been specifically described above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof.

〔Effect of the invention〕

As described above, according to the present invention, a wide thin film can be quickly and reliably cut and attached to a substrate with a simple configuration.

Furthermore, the continuous film can be cut between the rotary blade and the fixed blade by simply rotating the rotary blade for a moment, so that a wide film can be cut quickly and reliably and affixed to the substrate.

Further, since it is possible to easily insert the continuous film before starting the operation, work efficiency can be improved.

Further, the rotary blade is provided so as to rotate at a constant angle with both ends pivoted on a sliding table that can move back and forth toward the film on a support plate connected to the base, and the sliding table is It is configured to be fixed at a predetermined position on the support plate and movable forward away from the film, and the fixed blade is provided on a cutting holding member that moves back and forth from the rear of the film toward the film, so it can cut continuous film. It is possible to cut quickly and to prevent impact on the guide member of the cutter.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of the entire device according to an embodiment of the present invention, FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is a cross section taken along line A-A in FIG. 2. Figure 4 is a cross-sectional view taken along line B-B in Figure 2, Figure 5,
Figures 6 and 7 are a side view, top view, and front view of the rotary cutter portion in Figure 1, and Figure 8 is a
9 is a perspective view of the rotary blade shown in FIGS. 5, 6, and 7, and FIGS. It is a figure for explaining the lamination operation of an example. In the figure, 1B...Laminated film, 6... Main barqueum plate, 10... Thin film tip holding member, 11... Thermocompression roller, 13... Rotary cutter, 14... Printed wiring board, 1
6... Rotating blade, 17... Fixed blade, 20... Sliding base, 22... Crank part, 26... Support plate, 2
7...Latching knob.

Claims (1)

[Claims] 1. In a thin film pasting method in which a thin film corresponding to the length of the substrate is pasted on a thin film pasting surface of a substrate using a pressure roller, the leading end side of a continuous thin film in the supply direction is adsorbed by a thin film supplying member. a step of bringing the thin film supplying member close to the thin film sticking surface side of the leading end in the transport direction of the substrate transported to the thin film pasting position to supply a continuous thin film on the leading end side in the feeding direction; holding the tip side of the thin film in the supply direction at the thin film sticking position; separating the thin film supplying member from the thin film sticking surface side of the substrate; A pressure roller is brought close to the front end side in the supply direction, and the thin film is automatically supplied by the rotation of the pressure roller, and a predetermined amount is applied to the thin film application surface of the substrate from the front end to the rear end in the transport direction of the substrate. Paste the thin film for a certain distance, and at that point, while pasting the thin film on the substrate, move it a certain distance in the direction of substrate transport.
moving the pressure roller and the substrate, and then moving a certain distance in the opposite direction to the substrate conveyance direction to slacken the supplied thin film; the step of cutting the cut thin film according to the length; and the step of sticking the cut thin film at the rear end in the feeding direction to the thin film sticking surface at the rear end of the substrate in the conveying direction using the pressure roller. A thin film attachment method characterized by: 2. Claim 1, wherein the substrate is an insulating substrate having a conductive layer laminated on a surface to which a thin film is attached, and the thin film is a laminate formed of a photosensitive resin layer and a translucent resin film. Thin film attachment method described in . 3. The thin film attaching method according to claim 1 or 2, wherein the thin film is attached to two opposing thin film attaching surfaces of the substrate substantially simultaneously. 4. Each of the thin film pasting methods according to claim 1, wherein the step of cutting the thin film uses a rotary cutter. 5. In a thin film adhering device that applies a thin film corresponding to the length of the substrate to the thin film adhering surface of a substrate using a pressure roller, a substrate conveyance device that transports the substrate to a thin film adhering position and retreats from this thin film adhering position. A mechanism is installed to attract the leading end of the continuous thin film in the feeding direction.
A thin film supplying member is provided for supplying the tip side of the thin film in the supplying direction to the thin film application position, and a thin film supplying member is provided near the thin film application position in the supplying direction of the thin film supplied to the thin film application position by the thin film supplying member. A thin film tip holding member having a holding surface in surface contact with the tip side and having a thin film adsorption hole connected to a reduced pressure system that adsorbs the tip side in the feeding direction of the thin film to the holding surface, and holding the thin film tip end. The member is provided with a fixed blade of a rotary cutter, and the device main body is provided with means for moving the thin film tip holding member back and forth from the rear of the thin film toward the thin film,
A rotary blade of the rotary cutter is provided in the main body of the apparatus so as to be movable back and forth from the front of the thin film toward the thin film, and the rotary blade of the rotary cutter is provided in the main body of the apparatus so as to be movable back and forth toward the thin film, and the rotary blade of the rotary cutter is provided in the main body of the apparatus so as to be movable back and forth from the front of the thin film toward the thin film. A thin film pasting device comprising a pressure roller for pasting an end side of the substrate from a thin film pasting surface at a leading end to a thin film pasting surface at a rear end of the substrate in the transport direction. 6. The pressure roller is arranged so that the pressure roller is brought close to the tip side in the supply direction of the thin film held at the thin film application position, and the rotation of the pressure roller automatically supplies the thin film while moving the substrate in the transport direction. affixing a thin film a predetermined distance to the thin film adhering surface of the substrate from the leading end toward the rear end, at that point, moving the pressure roller and the substrate a certain distance in the substrate transport direction while adhering the thin film to the substrate; 6. The thin film pasting device according to claim 5, wherein the thin film pasting device is movably provided so as to thereafter move the supplied thin film by a certain distance in a direction opposite to the substrate conveyance direction to slacken the supplied thin film. 7. The rotary blade is rotatably supported at both ends on a sliding table that is movable back and forth from the front toward the thin film on a receiving plate connected to the base, and the sliding table is rotatably supported on a supporting plate. 7. The thin film sticking device according to claim 5, wherein the thin film sticking device is configured to be fixed at a predetermined position with respect to the plate and to be movable forward away from the thin film.