JPH0479042B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a composite magnetic head used in a magnetic recording/reproducing device.

A composite magnetic head shown in FIG. 6 has been proposed as a magnetic head for use in magnetic recording and reproducing devices such as VTRs (Japanese Utility Model Publication No. 174119/1983). This is because the abutting surfaces of the pair of magnetic head halves 2, 2 made of a high resistivity magnetic material such as ferrite are coated with a magnetic material having a higher saturation magnetic flux density than the magnetic material, such as sendust, permalloy, amorphous material, etc. Thin films 3, 3 made of magnetic material or the like are formed to increase the saturation magnetic flux density near the magnetic air space.

In conventional composite magnetic heads, even if the saturation magnetic flux density is increased by using a thin film such as sendust, the width T where the thin film 3 joins the joint surface of the magnetic head halves is the same as the target track width. Moreover, since the magnetic head half is made of ferrite material, there is a risk that magnetic saturation will occur at the joint surface.

Furthermore, conventional composite magnetic heads have had the following structural problems due to the manufacturing method. That is, in order to manufacture a composite type magnetic head, as shown in FIG. 2, a track width regulating groove 21 is formed in each of a pair of magnetic head block halves 11 and 12, and a groove 21 for regulating the track width is formed in the abutting portion of both block halves, for example. A thin film 3 of sendust is formed to a thickness of several micrometers by a known film forming technique such as vacuum evaporation or sputtering.

A non-magnetic layer 4 of SiO ₂ is further formed on the upper surface of the thin film 3.
was formed to a thickness of approximately 0.1 μm using the same film forming technique, and then the two block halves were butted together as shown in Fig. 3, the track width regulating groove 5 was filled with molten glass, and both block halves were then Unify. and,
By slicing this to an appropriate thickness as shown in FIG. 4, a magnetic head 1 having the above-mentioned non-magnetic layer 4 as a magnetic air space can be obtained.

However, in the film formation process of the above manufacturing method,
Since sendust is vacuum-deposited or sputtered through a mask having a slit-shaped opening at the abutting portion of both block halves, the state of adhesion of sendust particles may differ between near the edge of the opening of the mask and at the center of the opening. Alternatively, the sendust particles may also enter the back side of the mask, preventing a film of uniform thickness from being formed, and as shown in Figure 6, the sendust thin film 3 of the manufactured composite magnetic head has a thin film on both ends. Stroke shoulder part 3
1,31 occurs. In such magnetic heads, the track width W cannot be accurately defined, resulting in variations in recording and reproducing performance among products.

In addition, in order to solve the above problem, before creating track width regulating grooves in both block halves, films of sendust and SiO ₂ were formed on the entire bonding surface, and then these films and the ferrite wafer were simultaneously coated. It is also possible to adopt a method of forming the track width regulating groove 5 and the non-magnetic layer 4 by machining with a diamond blade or CBN blade, but with this method, the thin film of sendust may peel off during processing. It was hot. Of course, if the peeled part is large, it cannot be used as a product, but even if the peeling is slight, a chipped part 32 may occur as shown in FIG. Similarly, the actual track width W of the magnetic head is made uncertain.

〔the purpose〕

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a composite magnetic head in which peeling of a thin film is prevented when grooves, such as track width regulating grooves, are formed on a member forming a magnetic head half.

〔composition〕

In the manufacturing method of the present invention, the groove 5 reaching the member that becomes the magnetic head half 2 is formed by forming a band-shaped corrosion-resistant layer 6 having a predetermined width on the upper surface of the thin film 3 and covering the groove with the corrosion-resistant layer of the thin film. It is characterized in that the removed portion is removed by etching, and then the removed portion is mechanically grooved.

[Effect]

According to the above manufacturing method, no or less thin film 3 is removed by mechanical grooving, and peeling of the thin film 3 is prevented.

[Special effects]

According to the method of manufacturing a composite magnetic head according to the present invention, peeling of the thin film is prevented, manufacturing yield is improved, and the track width W can be accurately defined.

The present invention will be described in detail below based on the illustrated embodiments.

FIG. 1 is an enlarged plan view of the vicinity of the magnetic air space of a composite magnetic head according to the present invention, showing a pair of magnetic head halves 2, 2 made of ferrite material with track width regulating grooves 5 formed therein. Thin films 3 and 3 of Sendust (Fe-Al-Si alloy), which is a high saturation magnetic density material, are provided at the butt part of the
A non-magnetic layer 4 of SiO ₂ is provided to form a magnetic air space parallel to the abutting portion. Further, the track width regulating groove 5 is filled with glass. The above Sendust thin film 3 and non-magnetic layer 4
is formed by etching as described later.

FIGS. 2 to 5 show steps for manufacturing a composite magnetic head according to the present invention.

Figure 2 shows the U-shaped groove 2 that serves as the track width regulating groove.
A pair of ferrite wafers 20, 2 with 1 opened
This figure shows a situation in which block halves 11 and 12 are formed by providing sendust thin films 3 and 3 at the abutting portions of the blocks. In addition, one ferrite wafer 2
0 is provided with a coil groove 13 that will later become a coil winding hole 8.

FIG. 5 shows a procedure for forming a thin film 3 of sendust on a ferrite wafer 20 by etching, which is a known technique. First, as shown in FIG.
The thickness is approximately 1 mm depending on a film forming method such as sputtering.
A band-shaped corrosion-resistant layer 6 having a width W ₀ defined by the track width W is repeatedly formed on the upper surface at a constant pitch. The strip-shaped corrosion-resistant layer 6 is formed by coating the surface of a thin Sendust film with a dichromate-based photosensitive liquid to a thickness of about 1 μm, and then drying it.
A photomask having a W ₀ slit-shaped opening is placed thereon, and an exposure process of irradiating ultraviolet rays is performed, followed by a development process of removing the portion not covered by the original plate using a developer.

Next, as shown in FIG. 5b, the sendust thin film 3
The portions not covered by the corrosion-resistant layer 6 are dissolved with an etching solution. In this example, 30% was used as the etching solution.
of nitric acid solution was used at 25°C. At this time, corrosion progresses not only in the depth direction but also in the lateral direction, that is, below the corrosion-resistant layer 6, resulting in so-called side etching, but the side etching amount R is reproducible if the sendust thin film 3 has a thickness of 10 μm or less. It has been confirmed that it is good. Therefore, it is possible to predict the amount of side etching in advance and determine the width _W0 of the corrosion-resistant layer 6 that will provide the desired track width W. For example, if the thickness of the sendust thin film 3 is 10 .mu.m and etching is performed for 6 minutes and 30 seconds using the above etching solution, the side etching amount will be about 8 .mu.m. In the case of this embodiment, the track width W needs to be 24±2 μm, and for this purpose, the width W ₀ of the corrosion-resistant layer 6 may be set to 40 μm.

In this embodiment, this side etching is utilized to give the sendust thin film 3 a desired cross-sectional shape. That is, the side etching progresses faster in the portion of the sendust film near the corrosion-resistant layer 6, and as a result, as shown in the figure, the width T of the bonding surface of the formed thin film 3 with the ferrite wafer 20 becomes larger than the width W of the upper surface. Further, the side surface 30 of the thin film 3 forms approximately 90 degrees with respect to the top surface.

After the etching is completed, as shown in FIG. 5c, a U-shaped groove 21 is formed in the ferrite wafer 20 to serve as a track width regulating groove using a diamond blade. In this case, it is necessary to bring the blade as close as possible to the sendust thin film 3 without contacting it, but compared to the case where the sendust thin film or ferrite wafer is formed only by machining, rough machining is possible. A thin SiO ₂ film is further formed on the upper surface of the sendust thin film 3 by the same film forming technique as described above to form a nonmagnetic layer 4 for defining the gap. The non-magnetic layer 4 is formed on the entire surface of the sendust thin film 3 in the step shown in FIG. Alternatively, the nonmagnetic layer may be formed into a predetermined shape by dry etching.

Two block halves 1 formed as above
1 and 12 are brought into contact with each other with a non-magnetic layer 4 as shown in FIG.
A magnetic headblock 10 having a magnetic air space made of a non-magnetic layer 4, a track width regulating groove 5 and a coil winding hole 8 is completed. By slicing this to an appropriate thickness, a plurality of composite magnetic heads 1 shown in FIG. 4 can be obtained.

As shown in FIG. 1, the sendust thin film 3 of the magnetic head 1 manufactured in this manner has a highly flat upper surface whose width closely matches the track width W, and an upper surface extending approximately perpendicularly from the upper surface. side surface 30;
It has a joint surface with the magnetic head half having a width larger than the upper surface, and there are no rounded shoulders due to non-uniform film formation or chips due to machining.

In the above-mentioned embodiment, all of the sendust thin film is formed by etching, but only the upper shoulder part of the thin film is formed by etching, and the remaining lower layer is machined together with the U-shaped groove. They may be molded at the same time, and it has been experimentally confirmed that if the thickness of the lower layer is approximately 1 μm, peeling due to machining will hardly occur.

Furthermore, although the sendust thin film is formed by chemical etching in this example, it is of course possible to use other well-known etching methods.
For example, ion beam etching may be used.

Furthermore, the same effects as in this embodiment can be obtained by using permalloy or amorphous magnetic material other than sendust as the material of the thin film with high saturation magnetic flux density.

In manufacturing the magnetic head according to the present invention, a thin film with a high saturation magnetic flux density can be simultaneously formed on the entire surface of the abutting portion of the ferrite wafer, and the U-shaped groove can be processed with relatively rough precision.
Higher productivity can be obtained compared to conventional manufacturing methods.

[Brief explanation of the drawing]

FIG. 1 is an enlarged partial plan view of a composite magnetic head according to the present invention, FIG. 2 is a perspective view of a pair of block halves, FIG. 3 is a perspective view of a magnetic head block, and FIG. 4 is a perspective view of a pair of block halves.
The figure is a perspective view of the completed magnetic head, Figure 5a,
b and c are explanatory diagrams showing a method of forming a thin film by etching, and FIG. 6 is an enlarged partial plan view of a conventional composite magnetic head. 2...Magnetic head half, 3...Sendust thin film,
4...Nonmagnetic layer, 5...Track width regulating groove, 20
...Ferrite wafer (member that becomes half of the magnetic head), 21...U-shaped groove, W...track width.

Claims (1)

[Scope of Claims] 1. A thin film of a magnetic material having a saturation magnetic flux density higher than that of the magnetic material is provided on at least one of a pair of magnetic head halves made of a high resistivity magnetic material. After forming the thin film, a groove of a predetermined width reaching the member is formed in the thin film, and then the thin film remaining on the member that will become the one half of the magnetic head and the member that will become the other half of the magnetic head are magnetically bonded. In a method for manufacturing a composite magnetic head in which the heads are bonded through a cavity, the grooves are formed by forming a band-shaped corrosion-resistant layer having a predetermined width on the upper surface of the thin film, and then forming a band-shaped corrosion-resistant layer on the top surface of the thin film in a portion of the thin film that is not covered with the corrosion-resistant layer. 1. A method for manufacturing a composite magnetic head, characterized in that the step of manufacturing a composite magnetic head is carried out by removing the removed portion by etching and then mechanically forming a groove in the removed portion. 2. Claim 1, wherein the etching is performed by ion beam etching.
A method for manufacturing a composite magnetic head as described in .