JPH04792A - Supplying method for bus connection type power source for electronic apparatus - Google Patents

Abstract

PURPOSE:To freely regulate a primary side supplying current amount to a back panel unit in response to a variation in a load and to obtain an electronic circuit package placing region to a maximum limit by directly distributing power to the packages placed on a mother board through a wiring pattern on the board through both-end contact type terminal connector for mounting a primary power source on the rear surface of the board. CONSTITUTION:In the case that a package 8 is additionally provided on a back panel 1, if the wiring width of a power supply wiring pattern 5 is narrow and sufficient current capacity cannot be obtained for the load of the package 8, power supply wiring pattern 5a and connectors 7a, 7b, 7c are composed of a bus network, and a power supply cable 3c is directly engaged with the connector 7b. If the cable 3c is used for transmitting a signal, the pattern 5 is energized by a connector 10 through a wiring pattern 11. Accordingly, it is not necessary to provide a power receiving exclusive use connector 4, and the number of electronic circuit packages 6 to be placed on the panel 1 can be increased.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a power supply method for electronic devices, and in particular to a bus-connected type of electronic device that realizes a power supply wiring method that can flexibly deal with excess or deficiency in power supply capacity. Regarding power supply method.

[Conventional technology]

In the conventional power supply method, when increasing the current capacity, as described in Japanese Patent Application Laid-Open No. 182897/1982, the power supply is wired directly from the power supply device using a cable using a bus bar or the like provided separately from the wiring board. was. Another method is
As described in Japanese Patent No. 9-151496, a method has been adopted in which the allowable current capacity of the back panel of the circuit unit is increased in advance to cope with the increase in current capacity.

[Problem to be solved by the invention]

The above-mentioned conventional technology is used to convert the voltage of the DC-DC converter etc. when the current capacity of the wiring pattern on the motherboard (hereinafter referred to as back panel) is small in the primary power input of the voltage conversion circuit such as the DC-DC converter. No consideration has been given to how to increase the supply current of the primary power supply to the electronic circuit package that carries the circuit, and in such a case, it is necessary to change the design of the bank panel, and therefore the existing back panel unit However, there was a problem in that the amount of current could not be freely adjusted. Furthermore, since a mounting area for the primary power receiving connector on the back panel is required, there is a problem in that there is a limit to the number of electronic circuit packages that can be accommodated in the back panel.

The purpose of the present invention is to create a power supply configuration that can freely adjust the amount of primary side supply current to the back panel unit according to load fluctuations, and to secure the maximum area for mounting an electronic circuit package on the back panel. An object of the present invention is to provide a bus-connected power supply method for an electronic device.

[Means to solve the problem]

In order to achieve the above object, a bus-connected power supply method for an electronic device according to the present invention converts the primary power supply wiring pattern on the back panel of the device unit of the electronic device into a DC-D
Connect to each electronic circuit package connector that has a power conversion circuit such as a C converter, and connect a power supply cable to the other end of the terminal to which the electronic circuit package is connected using a double-end contact type connector to this connector, In addition, primary power is supplied from the front connector of this electronic circuit package and connected to the primary power supply wiring pattern on the back panel. The configuration is such that it can be realized using both the supply wiring pattern and the power supply cables on the front and back sides.

[Effect]

Power is supplied to the above-mentioned electronic devices from an external power supply device via cables, bus bars, etc., but since the power supply voltage used within the electronic circuit is generally lower than the primary power supply voltage supplied from the outside, the DC-DC converter This voltage conversion circuit is used to step down the voltage on the secondary side, and this voltage conversion is centrally processed by the power supply unit in the electronic device, and the low voltage of the secondary side output is sent to each bank panel unit. There are two methods: one is to provide a voltage converter circuit separately in the electronic circuit package of the back panel unit, and the other is to provide a voltage converter circuit separately in the electronic circuit package of the back panel unit. It is thought that the current capacity increases due to an increase in the number of connection cables and the width of the wiring pattern on the back panel.The latter supply method is basically the same as the former for increasing the current capacity, but the power supply wiring inside the back panel In order to give priority to the low voltage on the secondary side used in the electronic circuit, the primary side power supply supplied from an external power supply is subject to wiring restrictions and may not be able to secure sufficient current capacity.

What is the bus-connected power supply method for the above electronic devices?

The latter method of power supply has the voltage conversion circuit inside the electronic circuit package of the back panel unit, and the power supply on the primary side can be increased or decreased at the same time using both the wiring pattern and the cable. The wiring pattern of the primary power supply supplied from the power supply to the back panel is connected to each electronic circuit package connector that has a power conversion circuit inside the back panel, but the wiring on the primary side has wiring area restrictions as described above. If the number of electronic circuit packages mounted on the back panel increases or the load on the electronic circuit packages themselves increases,
The power capacity of the next-side power supply wiring pattern may be insufficient than the amount of current required by the package load side. Therefore, in order to cope with the above-mentioned insufficient current capacity, it is necessary to realize a power supply using a cable that is used in conjunction with the wiring pattern. Connect the cable directly to the connector on the bank panel side of the electronic circuit package so that the connection position is not affected by a wiring pattern with insufficient current capacity. The package and power supply cable should be connectable at the same time, and if the back panel connector is already in use, the primary power will be supplied from the front connector of the electronic circuit package and connected to the back panel wiring pattern through the connector. By connecting, a network configuration is realized by cable connection between the primary power supplies using the primary power supply pattern wired on the back panel as a bus bar.

According to the above power supply method, power is supplied using the wiring pattern on the back panel if it satisfies the required current of the load, and if the wiring capacity on the back panel is insufficient, it is supplied from the external power source to the connector. Since this is done through a direct cable connection, it is possible to provide a flexible power supply that corresponds to the amount of current required by the load. In addition, because the excess current supplied to the back panel can be supplied to other back panels that lack the current supply through cable connection, the supplied power can be effectively distributed within the electronic device. The degree of freedom can be improved.

Furthermore, since power is directly supplied to the front and back connectors of the electronic circuit package, there is no need to provide a dedicated power reception connector on the back panel, so the mounting area for the electronic circuit package on the back panel can be expanded. In addition, even when the connector on the back of the back panel is used for a signal cable or the like, power can be supplied from the connector on the front side of the electronic circuit package, which further improves the degree of freedom in device configuration.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a schematic connection structure diagram of a power supply mechanism of a device unit in an electronic device, showing an embodiment of the bus-connected power supply method for an electronic device according to the present invention.

FIG. 2 is a power supply connection circuit diagram of a power supply mechanism within the electronic device, also illustrating the connection state shown in FIG. 1.

In FIGS. 1 and 2, 1. la and lb are the back panel, 2 is the power supply device, 3 (38 to 3e) is the primary power supply cable, 4.4a, 4b are the power supply connectors, 5, 5a,
5b is a primary side power supply wiring pattern, 6 (6a to 6f) is an electronic circuit package with a voltage conversion circuit, 7, 7a to 7c
Reference numeral 8 (8a to 8i) indicates a contact-type connector at both ends, 8 (8a to 8i) indicates an electronic circuit package, 9 (9a, 9b) indicates a secondary power supply wiring pattern, 10 indicates a front side connector, and 11 indicates an electronic circuit package wiring pattern. Note that in FIGS. 1 and 2, the subscripts a to 11 are not shown in strict correspondence.

1 and 2, a connector 4 for primary power supply, an electronic circuit package 6, and a contact type connector 7 at both ends are connected from an external power supply device to the back panel 1 of the device unit in the electronic device shown in FIG. A power supply cable 3 is connected thereto. The primary power source from the outside of the electronic device shown in FIG. 2 is supplied from the power supply device 2 to the back panel 1 shown in FIG. The front side connector 1o of the electronic circuit package 6 is connected to the wiring pattern 5 on the back panel 1 through the wiring pattern 11. A power supply connector 4 is provided on the back panel 1.

The primary power supplied from the power supply device 2 is connected to the electronic circuit package 6 through the power supply wiring pattern 5 on the back panel 1 via the power supply connector 4, and the electronic circuit package 6
The internal voltage conversion circuit converts the voltage into a low secondary voltage. If the primary power supply is performed via a connector on the front or back surface of the electronic circuit package 6, the primary power supply dedicated connector 4 on the back panel 1 may not be mounted. The connector 7 connected to the electronic circuit package 6 uses a terminal with both ends contacting, such as a press-in contact, and connects the connection net connected by the primary power supply wiring pattern 5 as a bus bar to the connector 7 on the bus bar. The configuration is such that the power supply cable 3 can be fitted freely.

Here, for example, when the electronic circuit pancase 8 shown in FIG. is converted into a secondary power supply and supplied to the electronic circuit package 8 through the secondary power supply wiring pattern 9. However, if the wiring width of the power supply wiring pattern 5 is narrow, there is a limit to the current supply ability, and all In some cases, sufficient current capacity cannot be secured for the load of the electronic circuit package 8. This is because the power supply wiring inside the bank panel 1 prioritizes the low-voltage secondary power supply required to operate the electronic circuit package 6.8 housed in the bank panel 1. Generally, the wiring area of the side power supply wiring pattern 5 can be quite limited. In this power supply method, for example, the power supply wiring pattern 5a and the electronic circuit package connectors 7a and 7b are provided.

7c is constituted by a busbar net, so that when the current capacity of the power supply wiring pattern 5a is insufficient, the power supply cable 3C can be directly fitted to the electronic circuit pancage connector 7b.

When the power supply cable 3c is used for signal transmission, power is supplied to the power supply wiring pattern 5 on the back panel 1 via the wiring pattern 1 by the front connector 10 of the electronic circuit package 6a shown in FIG. I can do it. In addition, since power can be directly supplied to the front and back connectors of the electronic circuit package 6, there is no need to provide a dedicated power reception connector 4 on the back panel l, which reduces the number of electronic circuit packages 6 mounted on the bank panel 1. can be increased. Furthermore, if there is sufficient power capacity in the other bank panel 1b in FIG. 2, it is connected to the electronic circuit pancage connector 7C using the power supply cable 3d in the same manner as described above to equalize the power distribution within the electronic device. becomes possible.

[Effects of the Invention] According to the present invention, when the load on the electronic circuit package on the back panel of an electronic device increases, it is possible to reduce the number of connectors that directly supply power to the back panel or change the wiring pattern of the back panel. Even if the current capacity of the power supply is insufficient due to narrow width, etc., there is no need to change the wiring pattern on the back panel to increase the current capacity, and multiple power supply cables can be connected directly to the electronic circuit package connector. Current capacity can be secured. In addition, if there is sufficient power capacity on other back panels, it is possible to equalize the power distribution within the electronic device by connecting it to the electronic circuit package connector with a power supply cable in the same way as above. Power can be used effectively. Furthermore, since power is supplied directly to the connectors on the front and back sides of the electronic circuit package, there is no need to provide a special connector for receiving power on the back panel, so the mounting area for the electronic circuit package on the bank panel can be expanded, and the mounting area of the electronic circuit package can be expanded. This has effects such as improved packaging density.

[Brief explanation of drawings]

FIG. 1 is a schematic connection structure diagram showing an embodiment of the bus-connected power supply method for an electronic device according to the present invention, and FIG. 2 is a power supply connection circuit diagram of FIG. 1. 1, la, lb...back panel, 2...power supply device 3 (
38~3e)...Primary side power supply cable, 4゜4a, 4
b - Power supply connector, 5, 5 a, 5 b - Primary side power supply wiring pattern, 6 (6a to 6f)...Electronic circuit package with voltage conversion circuit, 7, 7a to 7c...
Double-end contact type connector, 8 (88 to 8i) -Forged child circuit package, 9 (9a, 9b)...Secondary side power supply wiring pattern, 10...Front side connector, 11...Electronic circuit package wiring pattern . !・-/(・Nofuha'nel 10- Previous 11 arrivals 47 pieces

Claims (1)

[Claims] 1. An electronic device that has the function of converting the primary power supply supplied from outside the device unit into a secondary voltage used by the electronic circuit inside the device unit is installed in a device unit that houses a group of wiring boards equipped with electronic circuits in a motherboard. In an electronic device equipped with a circuit package, primary power is supplied directly to the electronic circuit package via a double-end contact type terminal connector attached to the back of the motherboard, and primary power is supplied directly to the electronic circuit package from the front of the electronic circuit package mounted on the motherboard. The primary power is supplied through the side connector, and the primary power supplied from the both-end contact type terminal connector on the back of the motherboard and the front side connector of the electronic circuit package is supplied to each electronic device mounted on the motherboard via the wiring pattern on the motherboard. A bus-connected power supply method for an electronic device characterized by distributing power to a circuit package.