JPH0479352A - Semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor device.

In particular, it relates to a semiconductor device with countermeasures against electromagnetic noise.

[Prior Art] A semiconductor device, in particular, a semiconductor device that mounts a semiconductor element in a plastic semiconductor package, shields the semiconductor element from external electromagnetic wave noise, and can also shield tvL wave noise generated from the semiconductor element. , JP-A-64-2
It is disclosed in Publication No. 399. This semiconductor device is
As shown in the figure. This semiconductor device includes a metal layer 8 formed on the back side of the mounting surface of the semiconductor element 3, a cable plug 9 made of a conductive material mounted on the mounting surface of the semiconductor element 3, and a terminal pin 10 for external connection. These are electrically connected by solder 12 or the like, and these electrical connections block electromagnetic noise.

However, as the frequency and speed of semiconductor chips increase, on the one hand, the generation of electromagnetic wave noise from semiconductor elements is becoming more and more pronounced, and on the other hand, due to the miniaturization of semiconductor devices, it is possible to ignore the influence of electromagnetic wave noise from the outside world. Therefore, in addition to the above-mentioned disclosed technology,
Semiconductor devices made of semiconductor packages that can withstand electromagnetic noise have been expected.

[Problems to be Solved by the Invention] It is an object of the invention to provide a semiconductor package that is excellent in electromagnetic noise.

(Means for Solving the Problems) In order to solve the above problems, the present invention provides a pin grid array type semiconductor device formed from a printed wiring board, in which the entire printed wiring board except for the protruding portions of the terminal bins is It is covered with a metal body consisting of a metal layer placed on one surface of the printed wiring board and a cap that connects to this and covers the printed wiring board, and the cap extends to the edge of the printed wiring board. It is characterized in that it is connected to an inner layer conductor pattern of a printed wiring board.

〔Example] Hereinafter, the present invention will be explained based on drawings of embodiments.

FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention, and the outer shape of this device in a plan view (not shown) is square. The semiconductor device shown in FIG. 1 includes a semiconductor element 3 mounted in a recess 2 for mounting a semiconductor element formed approximately at the center of one surface of a rectangular printed wiring board 1, and a semiconductor element 3 made of ultra-thin wire such as gold wire. The wires 4 are connected to the ends of conductor circuits 5 arranged radially from the periphery of the recess 2, and the conductor circuits 5 are formed in a grid shape inside the outer periphery of the printed wiring board 1. A terminal pin 10 for external connection is inserted and soldered into this through hole 6, and the other surface is connected to a protruding terminal pin 10 and a through hole 6 into which this terminal pin is inserted. A metal layer 8 made of metal foil is disposed on the entire surface at an electrically insulating distance from the land 11 of the printed wiring board 1 and the semiconductor element 3. and this cap 9
is a semiconductor device in which the end face of the printed wiring board 1 is connected to an inner layer conductor pattern 7 having a magnetic wave shielding effect 11 extending to the end of the printed wiring board 1.

Note that an inner layer conductor pattern 7a that is not connected at the end surface of the printed wiring board 1 may be provided on the printed wiring board l.

The metal cap 9, which also serves as sealing protection for the semiconductor element 3, is mounted on the bottom surface of the printed wiring board 1 as a result of being mounted with the side wall of the cap 9 in close contact with the end surface of the printed wiring board 1. Since the metal layer 8 is bonded to the inner layer conductor pattern 7 extending to the end of the printed wiring board 1 and has an electromagnetic wave shielding effect at the end surface of the printed wiring board 1, the shielding effect against noise is further increased. be. The electrically connected cap, metal layer, and inner layer conductor pattern can be further connected to terminal pins to allow electromagnetic noise to escape to a motherboard on which such a semiconductor device is mounted.

Moisture-resistant hardened liquid resin such as epoxy resin, polyimide resin, or silicone resin is applied to the gap between the printed wiring board 1 and the printed wiring board 1 formed on the inner surface of the metal cap 9 mounted on the printed wiring board 1. The semiconductor element may be completely sealed and protected from the outside world by being filled with a sealing material having the following properties.

Next, regarding the materials used, the printed wiring board 1 that constitutes the semiconductor package of the semiconductor device in the first section uses an insulating material made of a prepreg resin obtained by impregnating a base material with a resin and drying it. be able to. Here, the resin for the printed wiring board 1 is preferably a resin that has excellent heat resistance and moisture resistance, and has high purity, especially low ionic impurities. Specifically, epoxy resin, polyimide resin, fluororesin, polyphenylene oxide resin, etc. are suitable. Note that as the base material constituting the printed wiring board 1, an inorganic material such as glass fiber is preferable to paper because it has superior heat resistance, moisture resistance, and the like. Alternatively, a printed wiring board obtained by molding a curable resin can also be used.

The conductor circuit 5 on the surface of the printed wiring board 1 on which the semiconductor elements are mounted, and the metal layer 8 on the opposite surface are appropriately selected from copper, brass, aluminum, iron, nickel, stainless steel foil, plate-like material, etc. Among them, copper foil is preferred because of its excellent conductivity. Further, in particular, the metal layer 8 may be a separately prepared plate-like material disposed on the printed wiring board l via an adhesive layer.

Further, the conductor circuit 5 on the surface of the printed wiring board 1 on the side where the semiconductor element is mounted, the conductive path in the through hole 6, and the metal layer 8 disposed on the opposite surface are formed as a normal circuit as part of the processing of the printed wiring board. It can be formed by an additive method, a subtractive method, or the like.

Note that the bonding between the metal layer 8, the inner layer conductor pattern 7, and the cap 9 is not limited to direct contact as described above, but may be bonded with a conductive adhesive, such as an epoxy resin containing silver powder or a polyimide resin. An indirect connection in which a conductive agent or the like is filled between the metal layer 8 and the cap 90 or between the inner layer conductor pattern 7 and the cap 9 to form a conductive path may be used, and as long as an electrical connection is formed, the main The problem of the invention is solved.

[Effect]

The semiconductor element mounted on the printed wiring board is surrounded by a metal layer made of metal and a camp, and is further enhanced by a type of capacitor composed of the metal layer, an insulating layer, which is the constituent material of the printed wiring board, and an inner layer conductor pattern. 1 has the effect of attenuating magnetic noise.

[Effects of the Invention] With the semiconductor device having the structure of the present invention, a semiconductor package with excellent electromagnetic noise can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. ...Printed wiring board...Recess for mounting semiconductor element...Semiconductor element...Wire...Conductor circuit...Through hole, 7a...Inner layer conductor pattern...Metal layer 9...・Camp 10...Terminal pin 11...Land 12...Solder Figure 1 Patent applicant Matsushita Electric Works Co., Ltd.

Claims (1)

[Claims] (1) In a pin grid array type semiconductor device formed from a printed wiring board, the entire printed wiring board, excluding the protruding portions of the terminal pins, is connected to a metal layer disposed on one surface of the printed wiring board. It is characterized in that it is covered with a metal body consisting of a cap that connects and covers the printed wiring board, and the cap is connected to the inner layer conductor pattern of the printed wiring board that extends to the end of the printed wiring board. Semiconductor equipment.