JPH0480041U - - Google Patents
Info
- Publication number
- JPH0480041U JPH0480041U JP12469590U JP12469590U JPH0480041U JP H0480041 U JPH0480041 U JP H0480041U JP 12469590 U JP12469590 U JP 12469590U JP 12469590 U JP12469590 U JP 12469590U JP H0480041 U JPH0480041 U JP H0480041U
- Authority
- JP
- Japan
- Prior art keywords
- exhaust duct
- insulating cover
- heat insulating
- heat
- hot plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は、本考案に係る基板加熱装置の一実施例
を示し、第１図は加熱ユニツトの一部切欠き縦断
正面図、第２図は第１図におけるＸ−Ｘ線断面図
、第３図は加熱ユニツトの基板給排口側から見た
一部切欠き側面図、第４図は基板支持ピン上昇時
の基板昇降機構を示す側面図、第５図は基板支持
ピン下降時の基板昇降機構を示す側面図、第６図
は装置全体の正面図、第７図は装置全体の基板給
排口側から見た側面図である。
１……ホツトプレート、２……断熱カバー、４
……外壁体、１０……基板昇降機構、１５……プ
ロセス排気用ダクト、１６……熱給排用ダクト。
The drawings show an embodiment of the substrate heating device according to the present invention, in which FIG. 1 is a partially cutaway longitudinal sectional front view of the heating unit, FIG. 2 is a sectional view taken along line X-X in FIG. 1, and FIG. 4 is a side view showing the substrate lifting mechanism when the substrate support pin is raised, and 5 is a side view showing the substrate lifting mechanism when the substrate support pin is lowered. FIG. 6 is a front view of the entire device, and FIG. 7 is a side view of the entire device as seen from the board supply/discharge port side. 1...Hot plate, 2...Insulation cover, 4
... Outer wall body, 10 ... Substrate lifting mechanism, 15 ... Process exhaust duct, 16 ... Heat supply and exhaust duct.
Claims (1)
断熱カバーで囲い、この断熱カバーを外壁体で外
囲し、前記断熱カバーと外壁体との間の空間を吸
引排気する熱排気用ダクトを設けるとともに、前
記ホツトプレートの側辺に沿つてプロセス排気用
ダクトを設け、前記熱排気用ダクトとプロセス排
気用ダクトを共通の吸引排気手段に連通接続し、
かつ、前記プロセス排気用ダクトに流量調節手段
を備えたことを特徴とする基板加熱装置。 The periphery and bottom of the hot plate for substrate heating are surrounded by a heat insulating cover, the heat insulating cover is surrounded by an outer wall, and a heat exhaust duct is provided to suck and exhaust the space between the heat insulating cover and the outer wall. , a process exhaust duct is provided along the side of the hot plate, and the heat exhaust duct and the process exhaust duct are communicatively connected to a common suction/exhaust means;
A substrate heating apparatus characterized in that the process exhaust duct is equipped with a flow rate adjusting means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12469590U JP2517721Y2 (en) | 1990-11-26 | 1990-11-26 | Substrate heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12469590U JP2517721Y2 (en) | 1990-11-26 | 1990-11-26 | Substrate heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0480041U true JPH0480041U (en) | 1992-07-13 |
| JP2517721Y2 JP2517721Y2 (en) | 1996-11-20 |
Family
ID=31872331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12469590U Expired - Fee Related JP2517721Y2 (en) | 1990-11-26 | 1990-11-26 | Substrate heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2517721Y2 (en) |
-
1990
- 1990-11-26 JP JP12469590U patent/JP2517721Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2517721Y2 (en) | 1996-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |