JPH0480055U - - Google Patents

Info

Publication number
JPH0480055U
JPH0480055U JP12561690U JP12561690U JPH0480055U JP H0480055 U JPH0480055 U JP H0480055U JP 12561690 U JP12561690 U JP 12561690U JP 12561690 U JP12561690 U JP 12561690U JP H0480055 U JPH0480055 U JP H0480055U
Authority
JP
Japan
Prior art keywords
hic
sensor
semiconductor pressure
trimming
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12561690U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12561690U priority Critical patent/JPH0480055U/ja
Publication of JPH0480055U publication Critical patent/JPH0480055U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例である半導体圧力
センサのナンバー記入方法を示す正面図、第2図
は従来の半導体圧力センサのナンバー記入方法を
示す正面図である。 図において、1はセンサ部、2はナンバーシー
ル、3はHIC部、4はオーバーガラス、5はセ
ンサに対応させたナンバーを示す。なお、図中、
同一符号は同一、または相当部分を示す。
FIG. 1 is a front view showing a method of writing a number on a semiconductor pressure sensor which is an embodiment of this invention, and FIG. 2 is a front view showing a method of writing a number on a conventional semiconductor pressure sensor. In the figure, 1 indicates the sensor section, 2 indicates the number sticker, 3 indicates the HIC section, 4 indicates the overglass, and 5 indicates the number corresponding to the sensor. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] センサ部とHIC部からなる半導体圧力センサ
において、前記センサ部のナンバーに対応したナ
ンバーを前記HICの厚膜基板のオーバーガラス
部分にレーザートリマーのトリミングにより記入
することを特徴とする半導体圧力センサ。
A semiconductor pressure sensor comprising a sensor part and an HIC part, characterized in that a number corresponding to the number of the sensor part is written on an over glass part of a thick film substrate of the HIC by trimming with a laser trimmer.
JP12561690U 1990-11-27 1990-11-27 Pending JPH0480055U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12561690U JPH0480055U (en) 1990-11-27 1990-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12561690U JPH0480055U (en) 1990-11-27 1990-11-27

Publications (1)

Publication Number Publication Date
JPH0480055U true JPH0480055U (en) 1992-07-13

Family

ID=31873208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12561690U Pending JPH0480055U (en) 1990-11-27 1990-11-27

Country Status (1)

Country Link
JP (1) JPH0480055U (en)

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