JPH0480062U - - Google Patents

Description

[Brief explanation of drawings]

Figure 1 is a configuration diagram of the frame connection jig including the positioning jig of this invention, Figure 2 is a diagram of the state in which the frame is stacked on the frame connection jig of Figure 1 and spot welded,
Figure 3 is a plan view showing the metal frame of the TR on which the transistor chip is assembled and sealed with resin;
This figure is a plan view of the frame in which the portion that becomes TR is cut out from the frame of FIG. 3. In the figure, 1 is a metal frame of TR, 10 is a frame obtained by cutting out TR, 1a and 10a are upper frames, 1b and 10b are lower frames, 1c and 10c are intermediate frames,
1d and 10d are round pitch holes, 1e and 10e are square pitch holes, 2 is a part forming the TR, 2a to 2
c is the external lead electrode 1, 2, 3, 2b is the sealing resin part, 3 is the power supply box of the resistance spot welding machine, 4a, 4b
is the wiring cable, 5 is the operation unit, 5a is the grip, 5b
is an electrode rod, 6 is a frame positioning jig of the present invention,
6a is a relief groove, 6b is a positioning pin for a round pitch hole, 6c is a positioning pin for a square pitch hole, and 7 is a spot welding trace. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Scope of utility model registration request] It has positioning pins that fit into the forming pitch holes of the metal frames used when connecting the metal frames of semiconductor devices obtained by punching and pressing or etching thin metal plates to each other by resistance spot welding after mounting a semiconductor chip and sealing with resin. 1. A frame positioning jig for a semiconductor device, which has a relief for a resin portion and also serves as an electrode of a welding machine.