JPH0480096U - - Google Patents

Description

[Brief explanation of the drawing]

Fig. 1 is a block diagram of an electronic device showing an embodiment of this invention, Fig. 2 is a block diagram of a heat sink group that is a feature of this invention, and Fig. 3 is a diagram of an electronic device surrounding an electronics module related to this invention. An exploded view, FIG. 4 is a configuration diagram of the conventional device, and FIG. 5 is an external view showing a method of fixing the electronics module of the conventional device. 1 is an electronics module, 2 is a heat sink, 3 is a manifold, 5 is a board, 7 is a connector, 14 is a tank, 15 is a pump, 16 is a heat exchanger, 17 is a seal, 18 is a hinge, 19 is a stopper, 20 is the wall of the structure. It should be noted that the same or corresponding parts in the drawings are designated by the same reference numerals.

Claims (1)

[Scope of utility model registration request] In an electronic device that is composed of a free-form structure wall made of electrically inductive composite material that combines multiple electronics modules that require cooling, a rectangular parallelepiped structure that has contacts that transmit and receive electronic signals is used. an electronics module; a plastic stopper having two concave grooves of a predetermined shape disposed on the opposite side of the electronics module from the contacts; and a stopper made of plastic having a flat surface facing the electronics module and containing a coolant inside. A rectangular parallelepiped heat sink that forms a flow path and has a cylindrical joint at the entrance and exit of the flow path, and multiple rows of these heat sinks are arranged in series, and a predetermined joint portion is provided at a position facing each heat sink row group. two manifolds each having a refrigerant flow path for supplying and recovering refrigerant in parallel to the heat sink array; and a rubber-like ring-shaped seal having a predetermined size inserted between the heat sink and the manifold and between each heat sink. , a connector configured in parallel with the heat sink group and having a concave groove corresponding to the heat sink and mating with the contact of the electronics module; and a U-shaped connector having a link mechanism on an opposing side surface of the connector. A pair of hinges provided at predetermined positions of the connector, a substrate portion of a predetermined thickness fixed on a free-form curved surface of a structure incorporating a plurality of the connectors, and a refrigerant capable of supplying and recovering refrigerant to the manifold. An electronic device that features a cooling system.