JPH0459993U

JPH0459993U -

Info

Publication number: JPH0459993U
Application number: JP10213690U
Authority: JP
Priority date: 1990-09-28
Filing date: 1990-09-28
Publication date: 1992-05-22

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例を示す電子機器の全
体構成図、第２図はヒートシンクの構成図、第３
図は第２図の断面図、第４図は従来の電子機器の
全体の構成図である。１……エレクトロニクス・モジユール、２はヒ
ートシンク、３はマニホールド、４，５はプレー
ト、６は基板、７はコネクタ、８はバツクプレー
ト、９は止め金具、１０はタンク、１１はポンプ
、１２は熱交換器、１３はＯリングである。なお
、図中同一あるいは相当部分には同一符号を付し
て示してある。 Figure 1 is an overall configuration diagram of an electronic device showing an embodiment of the present invention, Figure 2 is a configuration diagram of a heat sink, and Figure 3 is a diagram of the configuration of a heat sink.
The figure is a sectional view of FIG. 2, and FIG. 4 is a diagram showing the entire configuration of a conventional electronic device. 1...Electronics module, 2 is a heat sink, 3 is a manifold, 4 and 5 are plates, 6 is a board, 7 is a connector, 8 is a back plate, 9 is a stopper, 10 is a tank, 11 is a pump, 12 is a heat The exchanger 13 is an O-ring. It should be noted that the same or corresponding parts in the drawings are designated by the same reference numerals.

Claims

[Scope of utility model registration request]

In an electronic device in which a plurality of electronic modules that require cooling are combined and mounted on a wall surface of a structure having a free curve, a rectangular coolant flow path is formed inside the structure. a heat sink constituting the structure; a rectangular parallelepiped-shaped electronics module having a protrusion that engages with the contact surface with the structure and transmitting and receiving electrical signals; and an O-ring attached to the protrusion of the electronics module;
a back plate that presses the electronics module against the structure, a connector that mates with the contacts of the electronics module, and a curved board portion that is fixed on a free-curved wall surface of the structure and has a large number of the connectors arranged thereon; An electronic device comprising: a manifold that distributes and supplies refrigerant to the heat sink and collects the refrigerant; and a cooling system that can supply and recover the refrigerant flowing within the heat sink.