JPH0480097U - - Google Patents

Info

Publication number
JPH0480097U
JPH0480097U JP12596590U JP12596590U JPH0480097U JP H0480097 U JPH0480097 U JP H0480097U JP 12596590 U JP12596590 U JP 12596590U JP 12596590 U JP12596590 U JP 12596590U JP H0480097 U JPH0480097 U JP H0480097U
Authority
JP
Japan
Prior art keywords
circuit board
case
groove
sides
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12596590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12596590U priority Critical patent/JPH0480097U/ja
Publication of JPH0480097U publication Critical patent/JPH0480097U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る回路基板のシールドケー
ス構造の一実施例を示す斜視図、第2図は回路基
板を示す分解斜視図、第3図は本考案に係る回路
基板の第2実施例を示す分解斜視図、第4図及び
第5図は従来のハイブリツドICとシールドケー
スを示す分解斜視図である。 1……ハイブリツドIC、2……基板、3……
部品、4……入出力端子、5……金属ケース、2
1……取付部、22……切欠部、23……半田付
ランド(半田付部)、51……上面、52……底
面、53……側面部、54……溝。
Fig. 1 is a perspective view showing one embodiment of the shield case structure of the circuit board according to the present invention, Fig. 2 is an exploded perspective view showing the circuit board, and Fig. 3 is a second embodiment of the circuit board according to the present invention. FIGS. 4 and 5 are exploded perspective views showing a conventional hybrid IC and a shield case. 1...Hybrid IC, 2...Substrate, 3...
Parts, 4...Input/output terminal, 5...Metal case, 2
DESCRIPTION OF SYMBOLS 1... Mounting part, 22... Notch part, 23... Soldering land (soldering part), 51... Top surface, 52... Bottom surface, 53... Side part, 54... Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 左右両端部に半田付部が形成された熱伝導性を
有する回路基板を収納するシールドケースにおい
て、少なくとも表裏面と両側面を有する金属板か
ら構成され、かつ、両側面に上記回路基板の両端
部が挿入される溝部が形成されて成り、前記回路
基板が前記ケースの溝部に嵌入された状態で該ケ
ースが前記回路基板の半田付部に半田付けされる
ことにより該回路基板が収納されるようにしたこ
とを特徴とする回路基板のシールドケース構造。
A shield case for housing a thermally conductive circuit board with soldered parts formed on both left and right ends, which is constructed of a metal plate having at least a front and back surface and both sides, and has both ends of the circuit board on both sides. A groove is formed into which the circuit board is inserted, and the circuit board is housed by fitting the circuit board into the groove of the case and soldering the case to the soldering part of the circuit board. A circuit board shield case structure characterized by:
JP12596590U 1990-11-27 1990-11-27 Pending JPH0480097U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12596590U JPH0480097U (en) 1990-11-27 1990-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12596590U JPH0480097U (en) 1990-11-27 1990-11-27

Publications (1)

Publication Number Publication Date
JPH0480097U true JPH0480097U (en) 1992-07-13

Family

ID=31873543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12596590U Pending JPH0480097U (en) 1990-11-27 1990-11-27

Country Status (1)

Country Link
JP (1) JPH0480097U (en)

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