JPH0480174U - - Google Patents
Info
- Publication number
- JPH0480174U JPH0480174U JP12403790U JP12403790U JPH0480174U JP H0480174 U JPH0480174 U JP H0480174U JP 12403790 U JP12403790 U JP 12403790U JP 12403790 U JP12403790 U JP 12403790U JP H0480174 U JPH0480174 U JP H0480174U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- optical sensor
- chip
- close
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Facsimile Heads (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は、この考案にかかる実施例の平面図。
第２図は、この考案にかかる実施例のＡ−Ａ断面
図。第３図は、従来技術の平面図。第４図は従来
技術Ｂ−Ｂ断面図である。
１……ガラスエポキシ樹脂基板、２……コネク
タ、３……センサチツプ、６……銅箔パターン、
８……厚膜印刷パターン、９……アルミナセラミ
クス基板、１０……フレキシブル基板、１１……
ガラスエポキシ樹脂板、１２……コンタクト部。
FIG. 1 is a plan view of an embodiment of this invention.
FIG. 2 is a sectional view taken along line AA of the embodiment according to this invention. FIG. 3 is a plan view of the prior art. FIG. 4 is a sectional view taken along line BB of the prior art. 1...Glass epoxy resin board, 2...Connector, 3...Sensor chip, 6...Copper foil pattern,
8... Thick film printing pattern, 9... Alumina ceramics substrate, 10... Flexible substrate, 11...
Glass epoxy resin plate, 12...Contact part.
Claims (1)
導体チツプを取り付ける基板、光センサ半導体チ
ツプと基板とを電気的に接続する手段と、前記光
センサ半導体チツプを封止する構造とを有する密
着マルチチツプ型リニアイメージセンサモジユー
ルにおいて、前記基板が、ガラスエポキシ樹脂基
板であることを特徴とする密着マルチチツプ型リ
ニアイメージセンサモジユール。 (2) 前記密着マルチチツプ型リニアイメージセ
ンサモジユールにおいて、信号処理装置と電気的
に接続するためのコネクタが、ガラスエポキシ樹
脂基板に直接取り付けてあることを特徴とする実
用新案登録請求の範囲第１項記載の密着マルチチ
ツプ型リニアイメージセンサモジユール。[Claims for Utility Model Registration] (1) An optical sensor semiconductor chip, a substrate on which the optical sensor semiconductor chip is attached, means for electrically connecting the optical sensor semiconductor chip and the substrate, and sealing of the optical sensor semiconductor chip. 1. A close-contact multi-chip linear image sensor module having a structure in which the substrate is a glass epoxy resin substrate. (2) Claim 1 of the utility model registration, characterized in that in the close-contact multi-chip linear image sensor module, a connector for electrically connecting to a signal processing device is directly attached to the glass epoxy resin substrate. The close-contact multi-chip linear image sensor module described in 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12403790U JPH0480174U (en) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12403790U JPH0480174U (en) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480174U true JPH0480174U (en) | 1992-07-13 |
Family
ID=31871712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12403790U Pending JPH0480174U (en) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480174U (en) |
-
1990
- 1990-11-26 JP JP12403790U patent/JPH0480174U/ja active Pending
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