JPH0480355A - Device for forming film - Google Patents
Device for forming filmInfo
- Publication number
- JPH0480355A JPH0480355A JP19309590A JP19309590A JPH0480355A JP H0480355 A JPH0480355 A JP H0480355A JP 19309590 A JP19309590 A JP 19309590A JP 19309590 A JP19309590 A JP 19309590A JP H0480355 A JPH0480355 A JP H0480355A
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- substrate
- raw material
- evaporation
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 abstract description 57
- 238000001704 evaporation Methods 0.000 abstract description 53
- 239000000178 monomer Substances 0.000 abstract description 45
- 229920006254 polymer film Polymers 0.000 abstract description 23
- 238000004804 winding Methods 0.000 abstract description 11
- 239000007858 starting material Substances 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 description 47
- 239000002994 raw material Substances 0.000 description 42
- 239000010408 film Substances 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、成膜装置に関し、更に詳細には高分子膜の原
料モノマーを蒸発させて基板上に高分子膜を形成する際
に用いる成膜装置に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a film forming apparatus, and more particularly to a film forming apparatus used for forming a polymer film on a substrate by evaporating a raw material monomer for the polymer film. Relating to a membrane device.
(従来の技術)
従来、この種の成膜装置としては、第4図示のように真
空処理室a内の下方に高分子膜の原料モノマーb、cを
蒸発させる蒸発源d、eを設けると共に、真空処理室a
内の上方で該蒸発源d、eに対向する位置に基板fを保
持する基板保持装置gを設け、該蒸発源d、eの上方に
支軸りにより軸支され側方に回転自在のシャッターSを
設けた装置が知られている。(Prior Art) Conventionally, this type of film forming apparatus has been provided with evaporation sources d and e for evaporating raw material monomers b and c of a polymer film at the lower part of a vacuum processing chamber a, as shown in FIG. , vacuum processing chamber a
A substrate holding device g is provided above the evaporation sources d and e for holding the substrate f at a position facing the evaporation sources d and e, and a shutter is provided above the evaporation sources d and e and is rotatable laterally. Devices equipped with S are known.
そして、前記装置で高分子膜を形成させる場合は、シャ
ッターSで原料モノマーb、cを充填した蒸発源d、e
の上方を閉じた状態で真空処理室a内を所定圧に減圧し
、該蒸発源d、 eで原料モノマーb、cを加熱し、
所定の蒸発量が得られた時点でシャッターSを支軸りを
中心として側方に回転させて各蒸発源d、eの上方を開
放すると共に、該シャッターSの開閉調整で原料モノマ
ーb、cの蒸発量を制御しながら蒸発させ、これを基板
f上で蒸着、重合させて高分子膜を形成させるものであ
る。When forming a polymer film using the above apparatus, the shutter S is used to evaporate sources d and e filled with raw material monomers b and c.
With the top closed, the inside of the vacuum processing chamber a is reduced to a predetermined pressure, and the raw material monomers b and c are heated with the evaporation sources d and e,
When a predetermined amount of evaporation is obtained, the shutter S is rotated laterally about the support axis to open the upper part of each evaporation source d and e, and the opening and closing of the shutter S is adjusted to release the raw material monomers b and c. is evaporated while controlling the amount of evaporation, and is vapor-deposited and polymerized on the substrate f to form a polymer film.
尚、図中、iは真空処理室aの真空排気系、jは真空処
理室aの壁面、kは蒸発源d、eのヒーター、gは両蒸
発源d、e間に設けた仕切板、mは各蒸発源d、e近傍
に設けたレートモニタ、nは基板fの近傍に設けた膜厚
モニタを夫々示す。In the figure, i is the evacuation system of vacuum processing chamber a, j is the wall of vacuum processing chamber a, k is the heater for evaporation source d and e, g is a partition plate provided between both evaporation sources d and e, m indicates a rate monitor provided near each evaporation source d and e, and n indicates a film thickness monitor provided near the substrate f.
(発明が解決しようとする課題)
しかしながら、前記成膜装置で基板上に形成させるのに
用いる高分子膜の原料モノマーは有機化合物であるため
、蒸発源d、eて加熱され、蒸発する原料モノマーは真
空処理室a内のシャッタ−51壁面j等にモノマー単独
、或いは重合した高分子物として付着するので、これら
を除去しなければならないが、付着した原料モノマーや
高分子物は除去しにくいので除去作業か繁雑となり、特
に蒸発源d、eの上方に設けたシャッターSにはこれら
が多量に付着しやすく、かつ多量に付着しているため容
易に除去する出来ないのでシャッターSの交換が必要と
する問題がある。(Problem to be Solved by the Invention) However, since the raw material monomer of the polymer film used to form on the substrate in the film forming apparatus is an organic compound, the raw material monomer is heated by the evaporation sources d and e and evaporated. is attached to the wall surface j of the shutter 51 in the vacuum processing chamber a, either as a monomer alone or as a polymerized polymer, so these must be removed, but the attached raw material monomer and polymer are difficult to remove. The removal work becomes complicated, and in particular, a large amount of these particles tend to adhere to the shutters S installed above the evaporation sources d and e, and since they are attached in large quantities, they cannot be easily removed, so the shutter S needs to be replaced. There is a problem with this.
そこで、第5図示のように下方に例えばアルミニウム箔
から成る筒状のカバー0を取り付はンヤッターSを用い
るようにしているが、蒸発源d、eから大量の原料モノ
マーb、cを蒸発させた場合には、これら原料モノマー
や重合した高分子物が短時間に多量に付着するので、シ
ャッターSの交換を頻繁に行わねばならないという問題
がある。Therefore, as shown in Figure 5, a cylindrical cover 0 made of, for example, aluminum foil is attached to the lower part using Nyatter S, but large amounts of raw material monomers b and c are evaporated from evaporation sources d and e. In this case, a large amount of these raw material monomers and polymerized polymers adheres in a short period of time, so there is a problem that the shutter S must be replaced frequently.
本発明は、かかる問題点を解消した成膜装置を提供する
ことを目的とする。An object of the present invention is to provide a film forming apparatus that eliminates such problems.
(課題を解決するための手段)
本発明の成膜装置は、真空処理室内に、高分子膜の原料
モノマーを蒸発させる蒸発源または外部蒸発源からの蒸
発口と、該蒸発源または該蒸発口からの原料モノマーの
蒸着重合で高分子膜が形成される基板とを互いに対向し
て設け、該蒸発源または該蒸発口と該基板の間にシャッ
ターを設けた成膜装置において、該シャッターは巻取自
在のシャッターであることを特徴とする。(Means for Solving the Problems) The film forming apparatus of the present invention includes an evaporation source or an evaporation port from an external evaporation source for evaporating a raw material monomer of a polymer film, and an evaporation source or an evaporation port for evaporating raw material monomer of a polymer film, in a vacuum processing chamber. In a film forming apparatus in which a substrate on which a polymer film is formed by vapor deposition polymerization of raw material monomers is provided facing each other, and a shutter is provided between the evaporation source or the evaporation port and the substrate, the shutter is It is characterized by a removable shutter.
(作 用)
真空処理室内で蒸発源または蒸発口より原料モノマーを
蒸発させると該原料モノマーは基板上で蒸着重合して高
分子膜を形成する。この場合、巻取自在のシャッターを
移動させて基板の前面を開放させて基板上に原料モノマ
ーを蒸む、重合させる。また、シャッターを移動させて
基板前面を遮蔽し、遮蔽時にモノマー単独、高分子物が
付着したシャッターは巻き取れる。(Function) When the raw material monomer is evaporated from the evaporation source or the evaporation port in the vacuum processing chamber, the raw material monomer is vapor-deposited and polymerized on the substrate to form a polymer film. In this case, the shutter, which can be rolled up freely, is moved to open the front surface of the substrate, and the raw material monomer is steamed and polymerized on the substrate. In addition, the front surface of the substrate is shielded by moving the shutter, and when shielding, the shutter to which monomer alone or polymeric material is attached can be rolled up.
(実施例) 本発明装置の実施例を添付図面に基づき説明する。(Example) Embodiments of the device of the present invention will be described based on the accompanying drawings.
第1図および第2図は本発明成膜装置の1例を示すもの
であり、図中、1は真空処理室を示し、該真空処理室1
内を真空ポンプ等の真空排気系2に接続した。そして真
空処理室1内の下方に高分子膜の原料モノマーA、Bを
蒸発させるためのガラスまたはA1、ステンレス、銅等
の金属材から成る蒸発源3.3を設け、該蒸発源3近傍
に設けたヒーター4によって前記原料モノマーA、Bを
所定温度に加熱出来るようにした。また、真空処理室1
内の上方に蒸発源3に対向させて高分子膜を形成せしめ
るべき基板5を基板保持装置6によって保持するように
した。また、前記各蒸発源3と基板5との間にシャッタ
ー7を設けた。1 and 2 show an example of the film forming apparatus of the present invention, and in the figures, 1 indicates a vacuum processing chamber;
The inside was connected to a vacuum evacuation system 2 such as a vacuum pump. An evaporation source 3.3 made of glass or a metal material such as A1, stainless steel, or copper is provided in the lower part of the vacuum processing chamber 1 to evaporate the raw material monomers A and B of the polymer film. The raw material monomers A and B were able to be heated to a predetermined temperature by a heater 4 provided. In addition, vacuum processing chamber 1
A substrate 5 on which a polymer film is to be formed is held by a substrate holding device 6 above the evaporation source 3 . Further, a shutter 7 was provided between each of the evaporation sources 3 and the substrate 5.
かかる構成は従来装置と特に変わるところはないが、本
発明のものは、各蒸発源3と基板5との間に設けただシ
ャッター7を巻取自在としたもので、図示例ではシャッ
ター7を厚さ25μm程度、幅150IIlffl程度
、長さ1000m程度の可撓性材料から成る帯状とし、
また、真空処理室1内に送出ローラー8と、巻取ローラ
ー9を互いに対向させて設けると共に、前記シャッター
7の一端を送出ローラー8に、その他端を巻取ローラー
9に夫々取り付けし、該シャッター7の大部分を送出ロ
ーラー8に巻き付けて、両ローラー8.9間に張架し、
モーター等の巻取用駆動装置(図示せず)によってシャ
ッタ7を任意に送出ローラー8側より巻取ローラー9側
(矢印C)に移動させながら巻取ローラー9に巻き取り
出来るようにした。またシャッター7を基板5の前面5
a側に近接して配置すると共に、シャッター7、送出ロ
ーラー8および巻取ローラー9をモーター等の移動用駆
動装置(図示せず)によって送出ローラー側、または巻
取ローラー側(第2図X方向)、或いはシャッターのい
ずれか1方の側縁側(第2図X方向)に移動出来るよう
にして、基板5の前面5aを遮蔽、或いは開放して蒸発
源3からの高分子膜原料モノマーを基板5に蒸着出来る
ようにした。Although this configuration is not particularly different from the conventional device, the device of the present invention is provided with a shutter 7 provided between each evaporation source 3 and the substrate 5, and can be wound up freely.In the illustrated example, the shutter 7 is A band made of a flexible material with a thickness of about 25 μm, a width of about 150IIffl, and a length of about 1000 m,
Further, a delivery roller 8 and a take-up roller 9 are provided in the vacuum processing chamber 1 to face each other, and one end of the shutter 7 is attached to the delivery roller 8 and the other end is attached to the take-up roller 9, and the shutter 7 is wound around the delivery roller 8 and stretched between both rollers 8 and 9,
The shutter 7 can be arbitrarily moved from the delivery roller 8 side to the take-up roller 9 side (arrow C) by a winding drive device (not shown) such as a motor, and can be wound onto the take-up roller 9. In addition, the shutter 7 is connected to the front surface 5 of the board 5.
In addition, the shutter 7, the delivery roller 8, and the take-up roller 9 are arranged close to the delivery roller side or the take-up roller side (in the X direction in Figure 2) by a moving drive device (not shown) such as a motor. ), or the shutter can be moved toward one of the side edges (in the X direction in FIG. 2) to shield or open the front surface 5a of the substrate 5 so that the polymer film raw material monomer from the evaporation source 3 is transferred to the substrate. 5 can now be evaporated.
尚、シャッター7材としては可撓性を備え、原料モノマ
ーや重合した高分子物が付着可能な材料であれば特に限
定はなく、該材料としてはアルミニウム薄膜、ポリエチ
レンテレフタレー1− (PET) 、ポリイミド等の
プラスチックフィルム等が挙げられる。The material for the shutter 7 is not particularly limited as long as it is flexible and is capable of adhering raw material monomers and polymerized polymers; examples of such materials include aluminum thin film, polyethylene terephthalate (PET), Examples include plastic films such as polyimide.
また、両蒸発源3とシャッター7との間に外周面にヒー
ター10を巻回した筒状の防む板11を配置した。Furthermore, a cylindrical protective plate 11 having a heater 10 wound around its outer peripheral surface was arranged between both evaporation sources 3 and the shutter 7.
尚、図中、12は両蒸発源3間に設けた仕切板、13は
蒸発源3近傍に配置したレートモニタ、14は基板5近
傍に配置した膜厚モニタを夫々示す。In the figure, 12 indicates a partition plate provided between both evaporation sources 3, 13 indicates a rate monitor disposed near the evaporation source 3, and 14 indicates a film thickness monitor disposed near the substrate 5.
次に、前記装置を用い、基板5上にポリイミド膜を高分
子膜として形成する場合について説明する。Next, a case will be described in which a polyimide film is formed as a polymer film on the substrate 5 using the above-mentioned apparatus.
先ず、原料モノマーの蒸発源3,3の一方に原料モノマ
ーAとしてピロメリット酸二無水物と、他方に原料モノ
マーBとして4,4′−ジアミノジフェニルエーテルを
充填した状態で真空処理室1内を真空排気系2を介して
1×10−6に設定した。First, the vacuum processing chamber 1 is evacuated with one of the raw material monomer evaporation sources 3, 3 filled with pyromellitic dianhydride as raw material monomer A, and the other filled with 4,4'-diaminodiphenyl ether as raw material monomer B. The air pressure was set to 1×10 −6 via the exhaust system 2.
次に、送出ローラー8と巻取ローラー9を移動用駆動装
置(図示せず)の作動で基板5の前面5a側に移動させ
て両ローラー8.9間のシャッター7で基板5および基
板保持装置6を遮蔽した。Next, the delivery roller 8 and the take-up roller 9 are moved to the front surface 5a side of the substrate 5 by the operation of a moving drive device (not shown), and the shutter 7 between both rollers 8 and 9 moves the substrate 5 and the substrate holding device. 6 was shielded.
続いて、レートモニタ13で蒸発源3.3からの各原料
モノマーA、Bの蒸発レートを測定しながら各原料モノ
マーA、Bが1:1のモル比で蒸発するように原料モノ
マーAを180±2℃に、原料モノマーBを160±2
℃に夫々ヒーター4で加熱した。尚、この時の真空処理
室1内の圧力は5 X 10−6Torrとした。Next, while measuring the evaporation rate of each raw material monomer A and B from the evaporation source 3.3 with the rate monitor 13, the raw material monomer A was evaporated at 180 ml of evaporation rate so that each raw material monomer A and B were evaporated at a molar ratio of 1:1. 160±2 of raw material monomer B at ±2℃
℃ using a heater 4. Note that the pressure inside the vacuum processing chamber 1 at this time was 5×10 −6 Torr.
次に、原料モノマーが所定温度に達して所要の蒸発レー
トが得られた時点で両ローラー8゜9を移動用駆動装置
(図示せず)の作動で送出ローラー8側に移動させてシ
ャッター7による基板5の遮蔽を解除して基板5の前面
5aを開放し、所定時間基板5上で原料モノマーA、
Bを蒸着、重合させて所定膜厚のポリアミド酸から成
る高分子膜を形成した後、再び両ローラー8.9を移動
用駆動装置(図示せず)により巻取ローラー9側に移動
させてシャッター7で基板5を遮蔽し、この遮蔽状態で
高分子膜が形成された基板5を基板保持装置6より取り
外した後、該基板5とは別個の新しい基板5を該基板保
持装置に取付けた。尚、ポリアミド酸から成る膜を後で
200℃に加熱してポリイミド膜を形成した。Next, when the raw material monomer reaches a predetermined temperature and the required evaporation rate is obtained, both rollers 8.9 are moved to the delivery roller 8 side by the operation of a moving drive device (not shown), and the shutter 7 is moved. The shielding of the substrate 5 is released to open the front surface 5a of the substrate 5, and the raw material monomer A,
After B is vapor-deposited and polymerized to form a polymer film made of polyamic acid with a predetermined thickness, both rollers 8 and 9 are again moved to the take-up roller 9 side by a moving drive device (not shown) and the shutter is closed. 7, the substrate 5 on which the polymer film was formed was removed from the substrate holder 6 in this shielded state, and then a new substrate 5 separate from the substrate 5 was attached to the substrate holder. Incidentally, the film made of polyamic acid was later heated to 200° C. to form a polyimide film.
次に、前記と同様にシャッター7を移動させて新しい基
板5の前面5aの遮蔽を解除して所定時間開放−し、該
基板5上で原料モノマーを蒸着、重合させて高分子膜を
形成した後、再びシャッター7で該基板5の前面5aを
遮蔽した。Next, in the same manner as described above, the shutter 7 was moved to release the shielding of the front surface 5a of the new substrate 5 and opened for a predetermined time, and the raw material monomer was vapor-deposited and polymerized on the substrate 5 to form a polymer film. After that, the front surface 5a of the substrate 5 was again covered with the shutter 7.
尚、シャッター7の巻取ローラー9側への巻き取り操作
はシャッターに付着する原料モノマー量や高分子物量、
即ち原料モノマーの種類、加熱温度、蒸発量、蒸着時間
、形成される高分子膜の膜厚に応じて適宜に行えばよい
。そして、かかる巻き取り操作は前記第1図および第2
図示例の場合は、基板への原料モノマーの蒸着中に、或
いは基板保持装置への基板交換中に行えばよい。Note that the winding operation of the shutter 7 toward the winding roller 9 side depends on the amount of raw material monomer and polymeric substance adhering to the shutter,
That is, it may be carried out as appropriate depending on the type of raw material monomer, heating temperature, evaporation amount, vapor deposition time, and film thickness of the polymer film to be formed. This winding operation is performed as shown in FIGS. 1 and 2 above.
In the case of the illustrated example, it may be performed during vapor deposition of raw material monomer onto the substrate or during exchange of the substrate to the substrate holding device.
また、シャッター7の巻き取るための送出ローラー8、
巻取ローラー9の配置位置は、真空処理室1内の構成に
応じて適宜選択すればよく、該配置位置としては、前記
図示例のように両ローラー8.9をシャッター7の下方
即ち蒸発源3側に配置、両ローラー8.9をシャッター
7の上方即ち基板保持装置6側に配置(図示せず)、送
出ローラー8、巻取ローラー9のいずれか一方のローラ
ーをシャッター7の下方、他方のローラーをシャッター
の上方に配置(図示せず)等が挙げられる。Also, a delivery roller 8 for winding up the shutter 7;
The arrangement position of the take-up roller 9 may be appropriately selected depending on the configuration inside the vacuum processing chamber 1, and the arrangement position may be such that both rollers 8 and 9 are placed below the shutter 7, that is, close to the evaporation source, as in the illustrated example. 3 side, both rollers 8.9 are placed above the shutter 7, that is, on the substrate holding device 6 side (not shown), and one of the delivery roller 8 and take-up roller 9 is placed below the shutter 7, the other For example, a roller (not shown) may be placed above the shutter.
また、図示例では原料モノマーの蒸発源を真空処理室内
に配置したが、原料モノマーの蒸発源を真空処理室の外
部に配置し、該蒸発源からの原料モノマーの蒸発口をモ
ノマー導入管を介して真空処理室内に設けるようにして
もよい。Further, in the illustrated example, the evaporation source for the raw material monomer is placed inside the vacuum processing chamber, but the evaporation source for the raw material monomer is placed outside the vacuum processing chamber, and the evaporation port for the raw material monomer from the evaporation source is connected through the monomer introduction pipe. It may also be provided within the vacuum processing chamber.
また、図示例のように蒸発源3.3とシャッター7の間
に防着板11を配置し、ヒーター10で該防着板11を
加熱するようにすれば、蒸発源3から蒸発する原料モノ
マーは防着板11内を通過して基板5に集中的に蒸着さ
せることが出来、また、原料上ツマー蒸発待機中、或い
は基板交換中はシャッター以外には付むしないので、真
空処理室1内の汚れを低減することが出来る利点を有す
る。In addition, if the adhesion prevention plate 11 is arranged between the evaporation source 3.3 and the shutter 7 as shown in the illustrated example, and the adhesion prevention plate 11 is heated by the heater 10, the raw material monomers evaporated from the evaporation source 3. can pass through the deposition prevention plate 11 and be intensively deposited on the substrate 5, and while waiting for evaporation of the raw material or during substrate replacement, it will not adhere to anything other than the shutter, so that the inside of the vacuum processing chamber 1 It has the advantage of being able to reduce contamination.
第3図は本発明装置に用いるシャッターの他の実施例を
示すものであり、この実施例ではシャッター7の一部に
基板5の大きさに対応した大きさの開口部15を所定間
隔に設けたものである。FIG. 3 shows another embodiment of the shutter used in the device of the present invention. In this embodiment, openings 15 of a size corresponding to the size of the substrate 5 are provided in a part of the shutter 7 at predetermined intervals. It is something that
そして基板5に高分子膜を形成させるには、先ず、原料
モノマーの蒸発待機中はシャッター7の開口部15のな
いシャッタ−7a部分で基板5および基板保持装置6を
遮蔽し、次に、シャッター7を巻取ローラー9で巻き取
りながら開口部15が基板5の前面5aに到達した時、
シャッター7の巻き取りを停止させ、該開口部15で基
板5の遮蔽を解除し、前面5aが開放状態の基板5に該
開口部15を介して各蒸発源3から各原料モノマーを所
定時間蒸発させて、基板5上で原料モノマーを蒸着、重
合させた後、シャッター7を巻取ローラー9で巻き取り
、開口部15のないシャッタ−7a部分で再び基板5お
よび基板保持装置6を遮蔽する。In order to form a polymer film on the substrate 5, first, the substrate 5 and the substrate holding device 6 are shielded by the shutter 7a portion without the opening 15 of the shutter 7 while waiting for the evaporation of the raw material monomer, and then the shutter When the opening 15 reaches the front surface 5a of the substrate 5 while winding up the substrate 7 with the winding roller 9,
The winding of the shutter 7 is stopped, the shielding of the substrate 5 is released by the opening 15, and each raw material monomer is evaporated from each evaporation source 3 for a predetermined period of time through the opening 15 onto the substrate 5 with the front surface 5a open. After the raw material monomer is vapor-deposited and polymerized on the substrate 5, the shutter 7 is wound up by the take-up roller 9, and the substrate 5 and the substrate holding device 6 are again shielded by the portion of the shutter 7a without the opening 15.
かくするときは、シャッター7の巻き取りたけで基板前
面5aを遮蔽したり、開放したりすることが出来るので
、シャッター7による基板前面5aの遮蔽、開放操作が
簡単であり、また、シャッター7を動かす装置は巻取用
駆動装置のみとなるから、シャッターの全体構成を簡素
化することが出来るという利点を有する。In this case, the front surface 5a of the board can be shielded or opened depending on the winding depth of the shutter 7, so the operation of shielding or opening the front surface 5a of the board with the shutter 7 is easy. Since the only moving device is the take-up drive device, there is an advantage that the overall structure of the shutter can be simplified.
また、前記開口部の代わりに部分的に開口部を穿設した
マスクを用いれば、基板の必要個所のみに高分子膜を形
成することも出来る。Further, by using a mask having partially formed openings instead of the openings described above, it is possible to form the polymer film only at the necessary locations on the substrate.
(発明の効果)
このように本発明成膜装置によるときは、シャッターを
巻取自在のシャッターとしたので、原料モノマー、重合
した高分子物の付着状況に応じてシャッターを巻き取る
ことが出来るから、従来装置のような固定式シャッター
とは異なりシャッターの掃除が不要となり、また、使用
ずみシャッターを交換すれば長時間メンテナンスフリー
が可能となって原料モノマーの蒸発量が多くても従来装
置のようなシャッター交換を頻繁に行わなくてもよいか
ら、−個のシャッターで多数の基板への高分子膜の形成
を効率よく行える等の効果がある。(Effects of the Invention) As described above, when using the film forming apparatus of the present invention, the shutter is a shutter that can be rolled up freely, so the shutter can be rolled up depending on the adhesion status of raw material monomers and polymerized polymers. This eliminates the need to clean the shutter, unlike the fixed shutter of conventional equipment, and by replacing the used shutter, maintenance-free operation can be achieved for a long period of time. Since it is not necessary to replace the shutters frequently, there are advantages such as the ability to efficiently form polymer films on a large number of substrates using - number of shutters.
第1図および第2図は本発明成膜装置の1例を示すもの
であり、第1図はその概略載断面図、第2図は本発明装
置に用いるシャッターの要部を示す斜視図、第3図は本
発明装置に用いるシャッターの他の実施例の要部を示す
斜視図、第4図および第5図は従来装置を示すものであ
り、第4図はその概略載断面図、第5図はシャッターの
斜視図である。1 and 2 show an example of the film forming apparatus of the present invention, FIG. 1 is a schematic cross-sectional view thereof, and FIG. 2 is a perspective view showing the main parts of a shutter used in the apparatus of the present invention. FIG. 3 is a perspective view showing the main parts of another embodiment of the shutter used in the device of the present invention, FIGS. 4 and 5 show the conventional device, and FIG. FIG. 5 is a perspective view of the shutter.
Claims (1)
る蒸発源または外部蒸発源からの蒸発口と、該蒸発源ま
たは該蒸発口からの原料モノマーの蒸着重合で高分子膜
が形成される基板とを互いに対向して設け、該蒸発源ま
たは該蒸発口と該基板の間にシャッターを設けた成膜装
置において、該シャッターは巻取自在のシャッターであ
ることを特徴とする成膜装置。In the vacuum processing chamber, an evaporation source or an evaporation port from an external evaporation source for evaporating the raw material monomer of the polymer film, and a substrate on which the polymer film is formed by vapor deposition polymerization of the raw material monomer from the evaporation source or the evaporation port. What is claimed is: 1. A film forming apparatus in which a shutter is provided between the evaporation source or the evaporation port and the substrate, the shutter being a rollable shutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19309590A JPH0480355A (en) | 1990-07-23 | 1990-07-23 | Device for forming film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19309590A JPH0480355A (en) | 1990-07-23 | 1990-07-23 | Device for forming film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480355A true JPH0480355A (en) | 1992-03-13 |
Family
ID=16302153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19309590A Pending JPH0480355A (en) | 1990-07-23 | 1990-07-23 | Device for forming film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480355A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101407226B1 (en) * | 2006-09-07 | 2014-06-16 | 황창훈 | Large size organic film deposition apparatus and sputter deposition apparatus |
-
1990
- 1990-07-23 JP JP19309590A patent/JPH0480355A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101407226B1 (en) * | 2006-09-07 | 2014-06-16 | 황창훈 | Large size organic film deposition apparatus and sputter deposition apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5000114A (en) | Continuous vacuum vapor deposition system having reduced pressure sub-chambers separated by seal devices | |
| US20130056333A1 (en) | Transporting device, in particular for transporting sheet-like substrates through a coating installation | |
| US3895129A (en) | Method for metallizing plastic film | |
| JPH0480355A (en) | Device for forming film | |
| JPH05222520A (en) | Film forming system | |
| JP2012092371A (en) | Vacuum deposition device | |
| JPS6160912B2 (en) | ||
| JPS61278032A (en) | Method and device for manufacturing magnetic recording medium | |
| JPS61159573A (en) | Vacuum deposition equipment | |
| JPH0532468B2 (en) | ||
| JPH04341583A (en) | Pattern formation method for synthetic resin thin film | |
| JPH0711170Y2 (en) | Thin film forming equipment | |
| JP2615241B2 (en) | Vacuum deposition equipment | |
| JPH03295033A (en) | Apparatus for producing magnetic recording medium | |
| JPS5984516A (en) | Continuous thin film pattern forming apparatus | |
| JPS5914106B2 (en) | Vapor-deposited film manufacturing equipment | |
| JPS5924446A (en) | Method for manufacturing magnetic recording media | |
| JPS6227569A (en) | Thin film producing apparatus | |
| JPH1143769A (en) | Vapor depositing device | |
| JPH11236668A (en) | Thin film forming device and vacuum deposition device | |
| JP2023173544A (en) | Deposition source for vacuum evaporation equipment | |
| JPS63230863A (en) | Shutter mechanism of sputtering equipment | |
| JPS5922932A (en) | Preparation of thin film | |
| JPS62107066A (en) | Thin film forming device | |
| JPS61266574A (en) | Sputtering device |