JPH0481023U - - Google Patents

Info

Publication number
JPH0481023U
JPH0481023U JP12416090U JP12416090U JPH0481023U JP H0481023 U JPH0481023 U JP H0481023U JP 12416090 U JP12416090 U JP 12416090U JP 12416090 U JP12416090 U JP 12416090U JP H0481023 U JPH0481023 U JP H0481023U
Authority
JP
Japan
Prior art keywords
pair
metal plates
heat
sensitive element
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12416090U
Other languages
Japanese (ja)
Other versions
JP2515114Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12416090U priority Critical patent/JP2515114Y2/en
Publication of JPH0481023U publication Critical patent/JPH0481023U/ja
Application granted granted Critical
Publication of JP2515114Y2 publication Critical patent/JP2515114Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第4図は本考案の一実施例を示すもの
で、第1図は平面図、第2図は同上のB−B断面
図、第3図はその製造工程の平面図、第4図は使
用状態の側面図、第5図は熱応答特性図、第6図
は従来の温度センサの平面図である。 A……リードフレーム、C……温度センサ、1
,1′……幅広部、11a,11a′……連結部
、2……薄膜シート、3……感熱素子、4,5…
…保持体、6……充填材、7……被覆シート。
1 to 4 show an embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a sectional view taken along line B-B of the same, and FIG. FIG. 4 is a side view of the temperature sensor in use, FIG. 5 is a thermal response characteristic diagram, and FIG. 6 is a plan view of the conventional temperature sensor. A...Lead frame, C...Temperature sensor, 1
, 1'... Wide portion, 11a, 11a'... Connection portion, 2... Thin film sheet, 3... Heat sensitive element, 4, 5...
... Holder, 6... Filler, 7... Covering sheet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部引出線を接続するための外部引出部を有す
る一対の帯状の金属板と、該一対の金属板を保持
すべく該一対の金属板の少なくとも一端に形成さ
れた保持体と、前記一対の金属板の隙間に配設さ
れて、該一対の金属板に電気的に接続されている
感熱素子と、該感熱素子と金属板の一面を被覆し
て、被測定物に接触する薄膜シートと、該感熱素
子の周囲を囲繞する充填材と、少なくとも該充填
材と感熱素子を前記薄膜シートとの間に密封、固
定する被覆シートとを備えたことを特徴とする温
度センサ。
A pair of band-shaped metal plates having an external lead-out portion for connecting an external lead-out line, a holder formed at at least one end of the pair of metal plates to hold the pair of metal plates, and the pair of metal plates. A heat-sensitive element disposed in a gap between the plates and electrically connected to the pair of metal plates; a thin film sheet that covers one side of the heat-sensitive element and the metal plate and contacts the object to be measured; A temperature sensor comprising: a filler surrounding a heat-sensitive element; and a covering sheet that seals and fixes at least the filler and the heat-sensitive element between the thin film sheet.
JP12416090U 1990-11-28 1990-11-28 Temperature sensor Expired - Lifetime JP2515114Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12416090U JP2515114Y2 (en) 1990-11-28 1990-11-28 Temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12416090U JP2515114Y2 (en) 1990-11-28 1990-11-28 Temperature sensor

Publications (2)

Publication Number Publication Date
JPH0481023U true JPH0481023U (en) 1992-07-15
JP2515114Y2 JP2515114Y2 (en) 1996-10-30

Family

ID=31871822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12416090U Expired - Lifetime JP2515114Y2 (en) 1990-11-28 1990-11-28 Temperature sensor

Country Status (1)

Country Link
JP (1) JP2515114Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111777032A (en) * 2020-07-30 2020-10-16 中冶赛迪技术研究中心有限公司 Lead Positioning Devices for Packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111777032A (en) * 2020-07-30 2020-10-16 中冶赛迪技术研究中心有限公司 Lead Positioning Devices for Packages

Also Published As

Publication number Publication date
JP2515114Y2 (en) 1996-10-30

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