JPH0481845B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic mechanical component in which a case housing a rotating mechanism including a rotor is provided with an opening through which a tool for rotating the rotor can be inserted. The present invention relates to a method for forming a cover sheet so as to close an opening to form a sealed electronic mechanical component. There are various types of electronic mechanical parts of this type, such as trimmer capacitors, variable resistors, variable coils, and rotary switches, and the present invention can be used for all of these electronic mechanical parts.

BACKGROUND TECHNOLOGY In electronic mechanical parts, a rotating mechanism including a rotor is
It is built into a case. In such electronic mechanical parts, by rotating the rotor,
For example, in a trimmer capacitor, the capacitance is changed,
For example, it is possible to change the resistance value of a variable resistor. Therefore, in order to make desired adjustments by changing the characteristics of each of the electronic mechanical components by external operation, the case is provided with an opening through which the rotor can be rotated. ing.

By the way, when electronic mechanical components are mounted on a printed circuit board, flux during soldering generally enters through the opening provided in the case.
This had an adverse effect on the characteristics of electronic mechanical parts. Furthermore, in order to improve workability and reduce mass production costs, it is desired to be able to pass the entire electronic component into a molten solder bath and solder a plurality of electronic components to a printed circuit board or the like at once. However, in the case of electronic mechanical components, since solder enters through the opening provided in the case, it has an adverse effect on the rotor, etc., and as a result, for example, the rotor may become unable to rotate. For this reason, it was necessary to separately solder only the electronic mechanical components, such as the trimmer capacitor, at a later stage.

Therefore, so-called sealed electronic mechanical parts have been proposed in which a cover sheet is attached to close the opening of the case to prevent flux during soldering and solder from entering when using a molten solder bath. . Such a sealed electronic mechanical component is disclosed, for example, in Japanese Patent Application Laid-Open No. 72353/1983. In this conventional example, a heat-resistant cover sheet is adhered to the outer surface of the case using a heat-resistant adhesive so as to close the opening of the case. Therefore, in such sealed electronic mechanical parts, flux is prevented from entering during soldering, and
Even when immersed in a molten solder bath, solder is prevented from entering the case, making it possible to perform soldering with other electronic components in a simultaneous process.

Note that the cover sheet is made of a material that is thick and strong enough to be easily torn with a screwdriver, etc., so if it becomes necessary to rotate the rotor of an electronic mechanical component, use a screwdriver etc. to tear the cover sheet. While tearing, the rotor can be rotated using the screwdriver.

Problems to be Solved by the Invention However, in the case of the above-mentioned prior art, there was a problem in that the process of attaching the cover sheet was troublesome. In other words, for example, when attaching a cover sheet to parts each measuring a few mm square, both the parts and the cover sheet become so small that it becomes difficult to handle them, and it is difficult to attach such cover sheets to small parts. , becomes extremely difficult. It is also possible to prepare a large cover sheet and attach it to many parts, but in this case, the work of cutting the cover sheet after pasting is involved, and the cover sheet is cut along the outer periphery of the case. It is also cumbersome to cut. Furthermore, the thickness or height of the electronic mechanical component increases by the amount of the cover sheet attached, and such an increase in size is not desirable, especially for small components.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for efficiently forming a cover sheet in an opening of an electronic mechanical component while solving the problems of the conventional method as described above.

Means for Solving the Problems This invention is characterized by using a resin that is curable and has shape retention properties before curing, and utilizes the change in the state of such resin from an uncured state to a hardened state. This is an attempt to efficiently form a cover sheet. More specifically, it includes a film forming step in which a resin that is curable and has shape retention properties before curing is spread on a base plate to form a film in an uncured stage; and an electronic mechanical component is attached to the film. Place the case on the uncured film with the opening of the case facing, and bite the edge of the opening into the film so that a part of the film comes into contact with the inner peripheral surface of the edge of the opening. a pressing step of introducing a resin material to become a cover sheet into the opening to close the opening; after the pressing step, at least a portion of the film to become the cover sheet is removed from the base plate together with the case; It is characterized in that it includes a peeling step, and a step of curing the resin material to become the cover sheet after the pressing step.

Effects of the Invention According to the present invention, in one step for finally forming the cover sheet, the resin that becomes the cover sheet is treated as a viscous body. Such a viscous body can be easily formed into a film. This film-like form corresponds to the final form of the cover sheet. The case is pushed into the film stretched on the base plate in its uncured state, and just by such an operation, the resin material to be the cover sheet can be introduced into the opening of the case. That is, the resin material to be such a cover sheet is in contact with the inner circumferential surface of the edge of the opening. after that,
When the resin material is cured, a cover sheet can be formed to close the opening of the case and adhere to the inner peripheral surface of the opening. Since the cover sheet is formed through such steps, it is possible to form the cover sheet more efficiently than in the conventional case where a separately prepared cover sheet is attached to the case.

Further, since the cover sheet according to the present invention is formed in a state where it is adhered to the inner peripheral surface of the edge of the opening of the case, it is possible to provide the cover sheet in a manner that does not protrude from the outer surface of the case, and the electronic mechanism It becomes possible to provide a cover sheet without increasing the thickness or height of the component. Further, by selecting the material, thickness, etc. of the cover sheet, it is possible to prevent it from becoming an obstacle when rotating the rotor. That is, the cover sheet may be constructed so that it easily ruptures when the rotor is rotated, or it may be constructed so that it stretches, or it may be constructed so that it is in an intermediate state, i.e., it stretches and stretches simultaneously. The portion may be configured to be broken. The thickness of the cover sheet can be easily adjusted by first adjusting the thickness of the film formed on the base plate.

Embodiment FIG. 1 is a plan view showing a trimmer capacitor as an example of an electronic mechanical component to which the present invention is applied, and FIG. 2 is a sectional view taken along the line - in FIG. 1.

The case 1 is molded with two terminals 2 and 3 embedded therein. Case 1 is a material that can withstand the melting temperature of solder, e.g.
Constructed from a heat-resistant thermosetting resin that can withstand temperatures of 300℃. The end of the terminal 3 inside the case 1 is fixed in a state where the central axis 4 inside the case 1 is received, and constitutes a cylindrical part 5 that forms a cylindrical outer peripheral surface around the central axis 4. . central axis 4
is formed by filling the cylindrical portion 5 with resin when the terminal 3 including the cylindrical portion 5 is integrally molded into the case 1. End 6 of terminal 2 inside case 1
is provided so that a portion thereof is exposed from the bottom surface of the case 1. Each of the terminals 2 and 3 is led out to the outside of the case 1.

An opening 7 is formed in the case 1.
A rotation mechanism section is housed below the case 1 and inside the case 1 . Since the illustrated electronic mechanism component is a trimmer capacitor, this rotating mechanism part is
In FIG. 2, from the bottom, it is comprised of a dielectric plate 8, which becomes a stator, a metal rotor 9, which becomes a part of a rotor, a spring 10, and a driver plate 11, respectively. A substantially semicircular electrode conductor 12 that contacts the terminal 2 is formed on the lower surface of the dielectric plate 8 . The metal rotor 9 includes a rotor electrode 13 facing the electrode conductor 12 with a dielectric plate 8 in between, and the area facing the electrode conductor 12 can be changed by rotation of the metal rotor 9. The upper surface of the metal rotor 9 has grooves 1
4 is provided, and the above-mentioned spring 10 is provided here,
It is inserted between the metal rotor 9 and the metal rotor 9 so as not to rotate with each other. The driver plate 11 is mechanically fixed to the spring 10 by caulking its lower end. As clearly shown in FIG. 1, the driver plate 11 is formed with a generally cross-shaped adjustment groove 15. As shown in FIG.

With the configuration described so far, for example, when the tip of the driver is fitted into the adjusting groove 15 of the driver plate 11 and a rotational force is applied thereto, the spring 1
0, the metal rotor 9 is rotated. Therefore, the opposing area between the electrode conductor 12 and the rotor electrode 13 is changed, and the capacitance can be adjusted. This capacitance is taken out by a terminal 2 in contact with an electrode conductor 12 and another terminal 3 connected via a driver plate 11 via a spring 10 in contact with a metal rotor 9.

In such a trimmer capacitor, as shown in FIG.
It is formed in a state where it is adhered to the inner circumferential surface of the edge part of. This cover sheet 16 is shown as transparent in FIG. 1 so that the inside of the case 1 can be seen through. Note that the cover sheet 16 is
In fact, it may be transparent, and in that case, the rotational positions of the driver plate 11, metal rotor 9, etc. can be easily seen from the outside of the case 1.

The cover sheet 16 is made of a thermosetting silicone adhesive with excellent adhesive strength and heat resistance that can withstand the melting temperature of solder (for example, can withstand immersion in a molten solder bath at 270° C. for 20 seconds). Preferably, it is configured. Note that the reason why the thermosetting resin is used in this way is to efficiently proceed with the process for forming the cover sheet 16 described below. Furthermore, among thermosetting resins, thermosetting resins are easier to control over the curing time than room temperature curing types, resulting in less time loss.

Next, one embodiment of a method for forming the cover sheet 16 will be schematically described with reference to FIGS. 3-6.

FIG. 3 shows the film forming process. The film 17 is attached to the base plate 18 (with a flatness of 0.05
(below) is stretched with a uniform thickness on top. This base plate 18 may or may not be in the form of a flexible sheet. This also applies to the base plate 18, which will be described later. The film 17 must have shape retention properties so that the film thickness does not change before curing, and therefore, the film 17 must have a high viscosity, for example, 10,000~
A viscosity of about 400,000 cps is used. The thickness of the film 17 can be changed arbitrarily, but
For example, it is selected to be around 0.05 to 0.5 mm. Such thickness is related to the elongation and breaking strength of the cover sheet 16, which will be explained later, and is adjusted appropriately to obtain the desired elongation and breaking strength. Note that the base plate 18 is designed to prevent the film 17 from sticking, at least on the surface that contacts the film 17. For example, the base plate 18 itself may be made of Teflon (trade name) or coated with Teflon.

Next, as shown in FIG. 4, a pressing step is performed. Electronic mechanical parts such as trimmer capacitors 1
9 is placed on the film 17 with the opening 7 of the case 1 facing the film 17. It should be noted that the electronic mechanical components shown in FIG. 4 and subsequent FIGS. 5 to 7 may be understood as trimmer capacitors shown in FIGS. What can be seen inside the partially broken case 1 is the driver plate 1.
This shows a part of 1. However, it should be noted that some modifications have been made to the dimensions to make it easier to understand the purpose of each step. Note that the terminals 2 and 3 are shown above the case 1, and these are bent downward from the state shown in FIG. 2 so as to surround the case 1.
The result is shown in the figure as a result of the chip shape. In the state shown in FIG. 4, the film 17 is in an uncured stage. Therefore, the pressure 20 from the bottom side of case 1
is applied, the edge of the aperture 7 will be exposed to the film 1
7 , and a part of the film 17 comes into contact with the inner peripheral surface of the edge of the opening 7 . As a result, the resin material that is to become a cover sheet for closing the opening 7 is introduced into the opening 7. In this example, the pressure 2 is applied to such an extent that the edge of the opening 7 contacts the base plate 18 and cuts the film 17.
0 is added. Also, in case 1,
A portion of the driver plate 11 is in contact with or buried in the film 17. In order to realize this state, the upper surface of the driver plate 11 must be
It is preferable to be located approximately 0.05 to 0.1 mm lower than the upper surface of the .

When carrying out the process shown in Fig. 4, at the same time, the base plate 1
8 is given heat as shown by arrow 21.
Heating conditions vary depending on the material constituting the film 17, but for example, in the case of a silicone adhesive, a temperature of 130 to 150°C is applied. If the state shown in FIG. 4 is maintained under such heating conditions, the resin constituting the film 17 will begin to harden. but,
This heating is performed until the resin has not yet obtained sufficient adhesive strength, that is, is in a semi-cured state, and is then cooled once. When a heat-curable silicone adhesive is used as the film 17, this semi-cured state can be obtained, for example, at 130° C. for 4 minutes.

Next, as shown in FIG. 5, a peeling step is performed. This peeling step is realized by separating the electronic mechanical component 19 from the base plate 18. That is, in response to this, the portion of the film 17 that should become the cover sheet is peeled off from the base plate 18 together with the case 1. Note that the film 17 that is in contact with the outer peripheral surface of the case 1 still has insufficient adhesive strength, so it easily separates from the case 1 and closes the opening 7 of the case 1.
Only the film 17 inside is the electronic mechanism component 19.
to act together. Therefore, when this peeling process is carried out, a removal process for removing the excess film 17 on the outer circumference of the edge of the opening 7 of the case 1 is also carried out.

Next, as shown in FIG.
A curing process for the film 17 introduced therein is carried out. That is, the film 17 is heated and thereby completely cured, and the cover sheet 16 is formed in a state in which it is adhered to the inner peripheral surface of the edge of the opening 7 of the case 1. In this way, the electronic mechanical component 19 is sealed by the cover sheet 16.
is obtained.

In this example, a silicone adhesive was used as the material constituting the cover sheet 16.
Therefore, the cover sheet 16 has its own stretch and does not become an obstacle to inserting a driver or the like into the driver plate 11. For example, it is possible to insert it with a load of 50g or less. When the driver plate 11 is rotated by this driver, since the cover sheet 16 is as thin as about 0.05 to 0.5 mm, the inner circumferential surface of the case 1 and the driver plate 11 as shown by 22 in FIG. It breaks easily between the outer peripheral surface and does not require large torque. For example, rupture is possible with a torque of 150 gcm or less. Furthermore, even if a break line is formed at the position indicated by "22" in this way, since most of the cover sheet 16 is held by the driver plate 11, a large gap will not be created, and therefore the adjustment will be difficult. You can also expect a dustproof effect later on.

In the above description, the cover sheet 16 is broken by the adjustment operation, but the cover sheet 16 is not limited to this, and may simply be stretched or only a portion may be broken. Changes in the cover sheet 16 due to adjustment operations are
It is determined by factors such as the material or thickness of the material.

Next, a specific implementation method of the film forming process shown in FIG. 3 will be explained.

FIG. 8 shows a state in which a film forming process is being carried out. On the base plate 18 is a frame plate 23 having the same thickness as the film to be obtained.
will be posted. The uncured resin 24 is stored on one side of the squeegee 25, and in this state it is indicated by the arrow 26.
By moving the squeegee 25 in the direction of
is formed. The squeegee 25 is made of, for example, metal or rubber with a hardness of 80 or more.

Film 17 formed as shown in FIG.
is an attempt to take out some cover sheets 16 from here. On the other hand, as shown in FIG.
A film may be formed using In this case, each film formed within each window 28 is
Each is used to constitute a cover sheet for one electronic mechanical component.

10 and 11 show another example of the film forming process. In this example, base plate 1
8 is continuously sent in the direction of arrow 30. Base plate 18
Above, a roller 31 is arranged on the upstream side, and a blade 32 is arranged on the downstream side. The roller 31 is rotationally driven in the direction of an arrow 33. The outer peripheral surface of the roller 31 forms a predetermined gap with respect to the base plate 18. End guides 34 are provided on both sides of the roller 31. The end guide 34 rotates independently of the roller 31 and comes into contact with the base plate 18 so that the base plate 1
It rotates according to the movement of 8. This end guide 3
4 may have a rectangular shape, in which case it is used as one that is elastically pressed onto the base plate 18 and does not rotate. The blade 32 contacts the base plate 18 at both ends thereof, but at its intermediate portion,
A predetermined gap is formed between the base plate 18 and the base plate 18.

The uncured resin 24 is supplied upstream of the roller 31 . This resin 24 is pressed against the base plate 18 by the action of the roller 31, thereby ensuring that it adheres to the base plate 18. resin 24
When passing under the roller 31, the end guide 3
4, the width of the resin 24 is substantially constant when it passes the roller 31. Note that the resin 24 after passing through the roller 31 is in the form of a film with a substantially uniform thickness;
It is slightly thicker than the thickness of the film you are trying to obtain. Next, when passing through the blade 32, a film 17 with a uniform thickness is obtained.

The moving speed of the base plate 18 in the direction of arrow 30 and the rotational speed of the roller 31 in the direction of arrow 33 during the above-mentioned process are based on the resin 24a (No. 1) stored immediately upstream of the blade 32. Figure 11)
The amount may be controlled while monitoring the amount. For example, when the amount of resin 24a reaches the maximum, the speed of roller 31 may be slowed down or stopped so that a substantially constant amount of resin 24a is always stored immediately upstream of blade 32. good.

In the example shown in FIG. 2 and the examples described with reference to FIGS. 3 to 6, the cover sheet 1
6 was provided without protruding from the end surface of the case 1. However, as shown in FIG. 12, although the cover sheet 16 is adhered to the inner peripheral surface of the green end of the opening 7 of the case 1,
The opening 7 of the case 1 may be formed so as to extend up to the upper end surface of the green portion at the end. Cover sheet 1 like this
6 can be made possible, for example, by changing the conditions of the pressure 20 in FIG. 4 described above. According to this example, the contact area between the cover sheet 16 and the case 1 increases, the adhesive strength also increases, and the sealing performance is further improved.

By the way, when attempting to form the cover sheet 16 in the manner shown in FIG. 12, there may be cases where the above-described peeling step or removal step shown in FIG. 5 cannot be carried out smoothly. This problem is advantageously solved by the methods shown in FIGS. 13 to 15, respectively.

In FIG. 13, a holding plate 36 provided with a hole 35 for receiving the case 1 is used. This presser plate 3
6 is placed on the film 17 with the case 1 received in the hole 35. When the case 1 is pulled out from the hole 35 while preventing the holding plate 36 from lifting up, the film 17 formed to close the opening 7 of the case 1 is peeled off from the base plate 18 together with the case 1, and the film 17 is removed from the base plate 18 together with the case 1. The film 17 located on the outer circumferential side is left on the base plate 18 while being held down by the holding plate 36. In this way, the stripping and removal steps corresponding to the steps shown in FIG. 5 described above are advantageously carried out.

In the example shown in FIG. 14, the presser plate 36 and the punch 3
7 is used. In this example, when performing the peeling process, the film 17 is completely peeled off from the base plate 18. That is, the case 1 holds the edge of the opening 7 as one sheet, including the inner circumference side and the outer circumference side. On this film 17, the 13th
A holding plate 36 similar to that shown in the figure is mounted.
The case 1 is received in the hole 35 of the holding plate 36, and it is preferable that the holding plate 36 is in contact with the film 17 in this state. Then, a punch 37 having a shape that fits the edge of the opening 7 of the case 1 is placed below, and when this punch 37 is applied in the direction of the arrow 38 to the part that is to become the cover sheet, the case 1 is pushed into the hole 37 of the holding plate 36. At the same time, the film 17 is cut at the outer periphery of the case 1.

The example shown in FIG. 14 is an example of the removal process when the peeling process and the removal process are performed separately. Another example of a removal process in a similar case is shown in FIG.

Referring to FIG. 15, a state in which a plurality of cases 1 are arranged vertically and horizontally and held on one sheet of film 17 is shown. When applying the removal process to such cases 1, it is performed for each row of cases 1 arranged. That is, for example, cases 1 lined up in the rightmost row are placed on an appropriate jig 39.
In this state, the right edge of the film 17 is pulled in the direction shown by the arrow 40. In response to this, the film 17 is broken with appropriate elongation, and the film 17 is separated from the upper, lower and right sides of the case 1. after that,
If case 1 is pulled in the direction of arrow 40, film 1
It can be separated from 7.

In each of the above-mentioned Examples, the peeling process and the removal process were performed at the stage of semi-curing the resin constituting the cover sheet. However, the stripping or removal step can also be carried out after the cured state of such resin.

To explain in more detail, if the base plate 18 is made of a material with poor adhesion to the resin constituting the film 17, or if surface treatment is applied to reduce the adhesion, the film 17 can be completely cured. Even later, it can be easily peeled off from the base plate 18. The size of the adhesive force with the film 17 is as follows:
The material of the base plate 18 or the surface treatment method thereof may be selected depending on the resin material to be used, since it varies depending on the type of resin material constituting the film 17. For example, if the base plate 18 is made of fluororesin or coated with fluororesin, it can provide low adhesion to most resins. Also, the application of a mold release agent commonly used in plastic molding is effective in reducing such adhesion.

Further, when a thermosetting resin is used as the material constituting the film 17, the base plate 18 should be made of a material that can withstand the heat applied to semi-cure or completely cure the resin. Must be configured. Therefore, it is preferable that the base plate 18 is made of, for example, an aluminum plate coated with fluororesin, or a heat-resistant resin sheet. As the latter heat-resistant resin sheet, polyester, polypropylene, polyether sulfone, TPX polymer, etc. are used.

Note that the resin constituting the cover sheet 16 may be a resin that hardens at room temperature, so the base plate 18 does not necessarily need to have heat resistance.

Note that the film 1 constituting the cover sheet 16
In particular, when the peeling or removal step is carried out after 7 has been completely cured, the methods shown in FIGS. 13 to 15, respectively, are advantageously applied. In this case, if adhesion between the outer circumferential surface of the case 1 and the film 17 becomes a problem, a release agent may be applied in advance to a location where it is desired to prevent the case 1 from being attached.

16 and 17, cover sheet 1
6 and the opening 7 of the case 1 are shown.

In FIG. 16, a stepped portion 41 is formed along the edge of the opening 7 of the case 1, and the cover sheet 16 is formed to rest on this stepped portion 41.

In FIG. 17, the inner peripheral surface of the edge of the opening 7 of the case 1 is defined by a sloped surface.
Therefore, the cover sheet 16 is formed in a state where it is adhered to the inner peripheral surface of the edge of the opening 7 having the slope. In this embodiment, a knife edge is formed around the opening 7 of the case 1, so
In the process shown in FIG. 4 described above, the film 17 can be cut without applying much pressure 20.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a trimmer capacitor as an example of an electronic mechanical component to which an embodiment of the present invention is applied. FIG. 2 is a sectional view taken along line - in FIG. 1. FIGS. 3 to 6 sequentially show the steps of an embodiment of the present invention.
FIG. 7 shows a state in which the cover sheet 16 is broken when an adjustment operation is performed on the electronic mechanism component 19. FIG. 8 shows an example of the implementation state of the film forming step included in the method of the present invention. FIG. 9 is a perspective view of a frame plate 29 used in place of the frame plate 23 in the process shown in FIG. FIG. 10 is a perspective view showing another example in which the above film forming process is carried out. Figure 11 shows the first
2 is a sectional view showing the implementation state of FIG. 0. FIG. 12 is a sectional view showing another example of the state in which the cover sheet 16 is formed. FIG. 13 is a sectional view showing a preferred example of the peeling step included in the method of the present invention. FIG. 14 is a partially sectional front view showing an example of the removal step included in the embodiment of the present invention. FIG. 15 is a plan view showing another example of the above-mentioned removal process. FIGS. 16 and 17 are cross-sectional views showing still other examples of how the cover sheet 16 is formed. In the figure, 1 is a case, 7 is an opening, 8 is a stator (dielectric plate), 9 is a rotor (metal rotor),
11 is a driver plate as part of the rotor;
15 is an adjustment groove, 16 is a cover sheet, 17 is a film, 18 is a base plate, 19 is an electronic mechanism component, 20
is pressure, 21 is an arrow indicating heating, 23 is a frame plate, 2
4 is an uncured resin, 25 is a squeegee, 29 is a frame plate, 32 is a blade, 35 is a hole, 36 is a presser plate, and 37 is a punch.

Claims (1)

[Scope of Claims] 1. A rotation mechanism unit including a rotor is built into a case, and the case is provided with an opening into which a tool for rotating the rotor can be inserted. A method for forming a cover sheet in a closed manner, the film forming method comprising spreading a resin that is curable and has shape retention properties before curing onto a base plate to form a film in an uncured stage. Step: Place the case on the uncured film with the opening facing the film, and bite the edge of the opening into the film so that a part of the film touches the edge of the opening. a pressing step of introducing into the opening a resin material that will become a cover sheet that closes the opening while being in contact with the inner peripheral surface; and after the pressing step, at least a portion of the film that will become the cover sheet is pressed into the case; A method for forming a cover sheet in an opening of an electronic mechanical component, the method comprising: a peeling step of peeling the cover sheet from the base plate; and a step of curing a resin material to become the cover sheet after the pressing step. 2. The method of forming a cover sheet in an opening of an electronic mechanical component according to claim 1, wherein the peeling step is performed with the resin in a semi-cured state. 3. The method of forming a cover sheet in an opening of an electronic mechanical component according to claim 1, wherein the peeling step is performed while the resin is in a cured state. 4. The opening of an electronic mechanical component according to any one of claims 1 to 3, further comprising a removing step of removing excess film on the outer periphery of the edge of the opening of the case. How to form a cover sheet. 5. The method of forming a cover sheet in an opening of an electronic mechanical component according to claim 4, wherein the removing step is accomplished simultaneously with the peeling step. 6. The film forming step is carried out by placing a frame plate having the same thickness as the film to be obtained on the base plate and applying a squeegee from above the frame plate. A method for forming a cover sheet in an opening of an electronic mechanical component according to any one of items 1 to 5. 7. The film forming step is performed by moving a blade placed on the base plate with a predetermined gap formed therebetween relative to the base plate.
A method for forming a cover sheet in an opening of an electronic mechanical component according to any one of claims 1 to 5. 8. The electronic device according to any one of claims 1 to 7, wherein the pressing step is carried out to the extent that the edge of the opening contacts the base plate and cuts the film. A method of forming a cover sheet over an opening in a mechanical part. 9. The electronic mechanism according to any one of claims 1 to 7, wherein the pressing step is performed to such an extent that the edge of the opening does not contact the base plate and the film is not cut. A method of forming a cover sheet over an opening in a part. 10. According to any one of claims 1 to 9, the surface of the base plate is treated to prevent the film from sticking in order to smoothly carry out the peeling process. A method for forming a cover sheet over an opening in an electronic mechanical component. 11 The peeling step includes preparing a holding plate provided with a hole for receiving the case, and placing the holding plate on the film while receiving the case in the hole;
5. The method of forming a cover sheet in an opening of an electronic mechanical component according to claim 4, wherein the case is pulled out from the hole in that state, thereby performing the removing step at the same time. 12 In the peeling step, the entire film including the portion on the outer periphery of the edge of the opening is peeled off from the base plate, and in the removing step, a holding plate provided with a hole for receiving the case is prepared. Then, with the case received in the hole, a presser plate is placed in contact with the film, and a punch having a shape that fits the edge of the opening is applied to the portion that will become the cover sheet,
5. A method for forming a cover sheet in an opening of an electronic mechanical component according to claim 4, wherein the portion to be the cover sheet is punched out. 13. The method for forming a cover sheet in an opening of an electronic mechanical component according to any one of claims 1 to 12, wherein the resin constituting the cover sheet is a thermosetting resin. 14. The method for forming a cover sheet in an opening of an electronic mechanical component according to claim 13, wherein the thermosetting resin is a silicone adhesive. 15. The method of forming a cover sheet in an opening of an electronic mechanical component according to claim 13 or 14, wherein the base plate is made of a heat-resistant material. 16. The film thickness of the cover sheet is selected so as to fill a part of the rotor.
A method for forming a cover sheet in an opening of an electronic mechanical component according to any one of claims 1 to 15.