JPH0482077B2 - - Google Patents
Info
- Publication number
- JPH0482077B2 JPH0482077B2 JP60115015A JP11501585A JPH0482077B2 JP H0482077 B2 JPH0482077 B2 JP H0482077B2 JP 60115015 A JP60115015 A JP 60115015A JP 11501585 A JP11501585 A JP 11501585A JP H0482077 B2 JPH0482077 B2 JP H0482077B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- thin plate
- die
- wiring pattern
- conductive thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 17
- 238000004080 punching Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子、電気機器に用いられるプリント
配線板を形成するプリント配線パターンの打抜加
工方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for punching printed wiring patterns forming printed wiring boards used in electronic and electrical equipment.
従来の技術
従来、プリント配線板の製法にはスクリーン印
刷法またはフオトレジスト法により銅張積層板上
に配線パターンを作成し、その後エツチング、電
気メツキにより配線パターンを銅に置き換えるサ
ブトラクテイブ法かまたは基板と銅箔を未硬化の
接着剤で貼合せ、配線パターン形状の刃型を有す
るダイで銅箔を配線パターンに打ち抜き、配線パ
ターン部分の接着剤を硬化させた後、不要部分を
取り除くダイスタンプ法が一般に用いられてい
る。Conventional technology Conventionally, printed wiring boards have been manufactured using a subtractive method in which a wiring pattern is created on a copper-clad laminate using a screen printing method or a photoresist method, and then the wiring pattern is replaced with copper by etching or electroplating. The die stamp method involves bonding copper foil with uncured adhesive, punching out the copper foil into a wiring pattern using a die with a blade shaped like the wiring pattern, curing the adhesive in the wiring pattern area, and then removing unnecessary parts. Generally used.
発明が解決しようとする問題点
上記のサブトラクテイブ法は精密な配線パター
ンのプリント配線板の製造に適してはいるが、大
量の銅箔をエツチング除去し、更に電気メツキを
行う必要があつた。これらはいわゆる電気化学的
処理方法である為、処理薬品や廃水処理等公害防
止に対処せねばならず、高価な処理設備を導入し
なければならないという問題点がある。また電気
化学的処理方法であるため、製造に長時間を要す
るという欠点がある。Problems to be Solved by the Invention Although the above-mentioned subtractive method is suitable for manufacturing printed wiring boards with precise wiring patterns, it is necessary to remove a large amount of copper foil by etching and further perform electroplating. Since these are so-called electrochemical treatment methods, there are problems in that pollution prevention such as treatment chemicals and waste water treatment must be taken care of, and expensive treatment equipment must be introduced. Furthermore, since it is an electrochemical treatment method, it has the disadvantage that it takes a long time to manufacture.
更にサブトラクテイブ法では配線パターンの厚
みを厚くすることがむつかしく、電流容量が大き
くなる回路用のプリント配線板の製造には不適で
ある。これは銅箔を厚くすると、製造時における
エツチング処理効率が著しく低下するためであ
る。一方ダイスタンプ法は乾式によるプリント配
線板の製造法であるため、サブトラクテイブ法の
様に公害に対する問題もなく、工程は単純で大量
生産に適してはいるが、精巧な刃型でなければ銅
箔がきれいに打ち抜けず、加工に長時間を要す
る。また、スタンピングダイに精密な配線パター
ンを彫ることが困難であることと不要部分の除去
がむつかしいため、精密な配線パターンのプリン
ト配線板の製造に不適であるという問題点があ
る。 Furthermore, with the subtractive method, it is difficult to increase the thickness of the wiring pattern, making it unsuitable for manufacturing printed wiring boards for circuits with large current capacity. This is because when the copper foil is made thicker, the etching efficiency during manufacturing is significantly reduced. On the other hand, the die stamping method is a dry method for manufacturing printed wiring boards, so it does not have the problem of pollution like the subtractive method, and the process is simple and suitable for mass production. It does not punch out cleanly, and processing takes a long time. In addition, it is difficult to carve a precise wiring pattern on the stamping die and it is difficult to remove unnecessary parts, so there is a problem that it is unsuitable for manufacturing printed wiring boards with precise wiring patterns.
さらに、基板材料として樹脂積層板には使用で
きるが、セラミツクのような硬い基板では刃型を
損傷するため、また、フレキシブル配線板のよう
にフイルム状の基板では反対に基板をも切断して
しまい、使用できないという種々の問題点があつ
た。 Furthermore, although it can be used as a substrate material for resin laminates, it will damage the blade shape for hard substrates such as ceramics, and will also cut the substrate for film-like substrates such as flexible wiring boards. However, there were various problems that made it unusable.
問題点を解決するための手段
本発明は上記問題点を解消するものであり、プ
リント配線パターンを形成するための導電性薄板
材料を電磁成形用コイルとダイを用いる電磁成形
法を利用することによつて無公害で短時間かつ安
価に精密なる配線パターンを連続かつ大量に打抜
き加工せんとするものである。Means for Solving the Problems The present invention solves the above problems by utilizing an electromagnetic forming method using an electromagnetic forming coil and die to produce a conductive thin plate material for forming a printed wiring pattern. Therefore, it is an object of the present invention to punch out precise wiring patterns continuously and in large quantities in a pollution-free manner in a short time and at low cost.
作 用
プリント配線パターン形成のため導電性薄板材
料を電磁成形用コイルとダイを組合せ用いる電磁
成形装置により、成形に必要な電磁力をコンデン
サに貯えられた充電エネルギーをコイルを含む回
路に電流を放出することによつて、被加工材とす
る導電性薄板材料に電流が誘導され薄板材料とコ
イルの間に強力で脈状の電磁力が作用し、配線パ
ターン抜型としてのダイに打ち当て、配線パター
ンの打抜加工が高速で瞬時に行われる。従つて従
来のパンチとダイによるプレス打抜きでは困難な
精密な配線パターンが短時間で連続的に製造でき
る。また、ダイセツトに電磁成形用コイル、ダ
イ、導電性薄板材料、およびプリント配線板用基
板をそれぞれ設置しプレス機に取り付け自動化す
ることにより、精密なプリント配線板が連続的に
得られる。Function To form a printed wiring pattern, an electromagnetic forming device that uses a combination of an electromagnetic forming coil and a die to form a conductive thin plate material generates the electromagnetic force necessary for forming the electromagnetic force by releasing the charged energy stored in the capacitor into a circuit containing the coil. By doing so, a current is induced in the conductive thin plate material used as the workpiece, and a strong pulse-like electromagnetic force acts between the thin plate material and the coil, which is struck against a die that serves as a wiring pattern cutting die, and the wiring pattern is cut out. The punching process is performed instantly at high speed. Therefore, it is possible to continuously manufacture precise wiring patterns in a short time, which is difficult to do with conventional press punching using a punch and die. In addition, by installing the electromagnetic forming coil, die, conductive thin plate material, and printed wiring board substrate in a die set, and automating the process by attaching them to a press machine, precise printed wiring boards can be continuously obtained.
以下本発明の一実施例を図面に従つて説明す
る。 An embodiment of the present invention will be described below with reference to the drawings.
実施例
第１図に示す如く、直流高電圧発生装置１を上
部に有し、充電スイツチ２により発生させた電流
を蓄えるコンデンサ３及び放電スイツチ４により
瞬間的にコイル５に大電流を流し、コイル周辺に
磁場を形成せしめ、この磁場におけるクーロン力
（電磁力）を利用する電磁成形装置６の下部に、
配線パターンを成すスリツト７を形成したダイ８
を配置し、上記ダイ上に導電性薄板材料９を載置
したのち、コイル５に大電流を流し、コイル周辺
に形成される電磁力を利用し、該導電性薄板材料
を、ダイ８に切られたスリツト７の形状に打抜く
ものである。Embodiment As shown in FIG. 1, a DC high voltage generator 1 is provided on the upper part, and a large current is instantaneously passed through a coil 5 by a capacitor 3 that stores the current generated by a charging switch 2 and a discharge switch 4. At the bottom of the electromagnetic forming device 6 , which forms a magnetic field around the periphery and utilizes the Coulomb force (electromagnetic force) in this magnetic field,
A die 8 with a slit 7 forming a wiring pattern
After placing the conductive thin plate material 9 on the die, a large current is passed through the coil 5, and the electromagnetic force formed around the coil is used to cut the conductive thin plate material into the die 8. The slit 7 is punched out in the shape of the slit 7.
第２図にはこのようにして打ち抜いたプリント
配線パターン１０をプリント配線板用基板１１上
に固着せしめたプリント配線板を示す。 FIG. 2 shows a printed wiring board in which the printed wiring pattern 10 punched out in this manner is fixed onto a printed wiring board substrate 11.
尚、上記加工方法に於て使用する電磁成形用コ
イル５の形状は第３図に示す如く、らせん巻コイ
ル１２を使用したが、第４図に示す様にうず巻形
コイル１３であつてもよい。また、導電性薄板材
料９には厚さ50μｍおよび100μｍの銅箔を使用し
たが、銅箔以外でも導電性を有する厚さ5μｍな
いし１mmの薄板材料であれば打抜き可能である。 Incidentally, the shape of the electromagnetic forming coil 5 used in the above processing method is a spiral wound coil 12 as shown in FIG. 3, but a spiral wound coil 13 as shown in FIG. good. Furthermore, although copper foils with thicknesses of 50 μm and 100 μm were used as the conductive thin plate material 9, any conductive thin plate material other than copper foil with a thickness of 5 μm to 1 mm can be punched.
上記電磁成形における電磁力のエネルギ量は次
式で表わされる。 The amount of energy of the electromagnetic force in the above electromagnetic forming is expressed by the following equation.
Ｅ＝１／２CV2
ただし、Ｅ：エネルギ量(J)、Ｃ：コンデンサ容
量（μF）、Ｖ：充電電圧（KV）。 E=1/2CV 2However , E: energy amount (J), C: capacitor capacity (μF), V: charging voltage (KV).
板厚50μｍの銅箔では、Ｃ＝100μF、Ｖ＝5KV
に設定し、エネルギ量1250J、板厚100μｍの銅箔
ではＣ＝100μF、Ｖ＝7KVに設定し、エネルギ量
は2450Jで打ち抜きを行つた。更にダイ８には各
種の鋼板やセラミツクス、タングステンカーバイ
トが用いられ、配線パターン形成用のスリツト７
をワイヤカツト放電加工法或はレーザー加工法や
切削加工によつて形成した厚さ0.5mmないし10mm
の範囲のものを使用しても良い。 For copper foil with a plate thickness of 50 μm, C = 100 μF, V = 5 KV
For the copper foil with a plate thickness of 100 μm, C = 100 μF, V = 7 KV, and punching was performed with an energy amount of 2450 J. Furthermore, various steel plates, ceramics, and tungsten carbide are used for the die 8, and the slit 7 for forming wiring patterns is used.
Thickness 0.5mm to 10mm formed by wire cut electric discharge machining method, laser processing method or cutting processing.
You may use a range of .
また打抜加工に当り電磁成形用コイルと導電性
薄板材料とは密接していても、或は一定の間隔を
もたせても差支えなく打抜加工が実施できる。更
にダイセツトをプレス機に取りつけ、導電性薄板
材料及びプリント配線板用基板を連続的に供給す
ることにより、自動打抜きによる大量生産を行う
ことができる。 In addition, the punching process can be carried out even if the electromagnetic forming coil and the conductive thin plate material are in close contact with each other or with a certain distance between them. Furthermore, by attaching the die set to a press and continuously supplying the conductive thin plate material and the printed wiring board substrate, mass production by automatic punching can be performed.
発明の効果
以上のように本発明によればプリント配線パタ
ーンの形成に電磁成形用コイルとプリント配線パ
ターンのスリツトを設けたダイを用いることによ
つて、従来のサブトラクテイブ法の如く大量の銅
箔の除去や電気メツキを行う必要もなく、処理薬
品や廃水処理等の設備も不要となり、無公害で短
時間かつ安価に製造できる。また、ダイスタンプ
法の如くプリント配線用基板の種類に制限を受け
ず、精密なる配線パターンの打抜が可能となり、
高精度のプリント配線板が連続かつ大量に製造で
きる等の種々の効果を有する発明である。Effects of the Invention As described above, according to the present invention, by using an electromagnetic forming coil and a die provided with a slit for the printed wiring pattern to form a printed wiring pattern, a large amount of copper foil can be formed unlike the conventional subtractive method. There is no need for removal or electroplating, and there is no need for processing chemicals or equipment for waste water treatment, so it can be produced in a short time and at low cost without any pollution. In addition, unlike the die stamp method, it is not limited by the type of printed wiring board, making it possible to punch out precise wiring patterns.
This invention has various effects, such as being able to continuously manufacture high-precision printed wiring boards in large quantities.
第１図は本発明の実施に用いる電磁成形法を示
す概略斜視図、第２図は同プリント配線板の斜視
図、第３図及び第４図は夫々本発明に用いる電磁
成形用コイルの斜視図である。
１…直流高電圧発生装置、２…充電スイツチ、
３…コンデンサ、４…放電スイツチ、５…コイ
ル、６…電磁成形装置、７…スリツト、８…ダ
イ、９…導電性薄板材料、１０…プリント配線パ
ターン、１１…プリント配線板用基板、１２…ら
せん巻コイル、１３…うず巻形コイル。
Fig. 1 is a schematic perspective view showing the electromagnetic forming method used in carrying out the present invention, Fig. 2 is a perspective view of the same printed wiring board, and Figs. 3 and 4 are perspective views of the electromagnetic forming coil used in the present invention, respectively. It is a diagram. 1...DC high voltage generator, 2...Charging switch,
3... Capacitor, 4... Discharge switch, 5... Coil, 6 ... Electromagnetic forming device, 7... Slit, 8... Die, 9... Conductive thin plate material, 10... Printed wiring pattern, 11... Printed wiring board substrate, 12... Spiral-wound coil, 13... Spiral-wound coil.
Claims (1)
ダイの上方に、5μｍないし１mmの導電性薄板材
料を載置し、該導電性薄板材料の上方に位置せし
めた電磁成形用コイルに、上記導電性薄板材料の
厚さに対応して変化させた電磁力を発生させるこ
とによつて導電性薄板材料を配線パターン状に打
抜くことを特徴とするプリント配線パターンの打
抜加工方法。1. A conductive thin plate material of 5 μm to 1 mm is placed above a die with a slit that forms a wiring pattern, and the conductive thin plate is placed on an electromagnetic forming coil positioned above the conductive thin plate material. A printed wiring pattern punching method characterized by punching a conductive thin plate material into a wiring pattern shape by generating an electromagnetic force that varies depending on the thickness of the material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11501585A JPS61271892A (en) | 1985-05-27 | 1985-05-27 | Punching for printed wiring pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11501585A JPS61271892A (en) | 1985-05-27 | 1985-05-27 | Punching for printed wiring pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61271892A JPS61271892A (en) | 1986-12-02 |
| JPH0482077B2 true JPH0482077B2 (en) | 1992-12-25 |
Family
ID=14652145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11501585A Granted JPS61271892A (en) | 1985-05-27 | 1985-05-27 | Punching for printed wiring pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61271892A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011158525A1 (en) * | 2010-06-17 | 2011-12-22 | 富士電機ホールディングス株式会社 | Manufacturing device for photoelectric conversion element |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420784B2 (en) * | 1972-06-14 | 1979-07-25 | ||
| JPS58209192A (en) * | 1982-05-31 | 1983-12-06 | 市光工業株式会社 | Method for manufacturing printed circuit boards using a press |
| JPS59127933A (en) * | 1983-01-11 | 1984-07-23 | Amada Co Ltd | Electromagnetic working device |
-
1985
- 1985-05-27 JP JP11501585A patent/JPS61271892A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011158525A1 (en) * | 2010-06-17 | 2011-12-22 | 富士電機ホールディングス株式会社 | Manufacturing device for photoelectric conversion element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61271892A (en) | 1986-12-02 |
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