JPH0482269A - Two-dimensional array photodetector - Google Patents

Two-dimensional array photodetector

Info

Publication number
JPH0482269A
JPH0482269A JP2196948A JP19694890A JPH0482269A JP H0482269 A JPH0482269 A JP H0482269A JP 2196948 A JP2196948 A JP 2196948A JP 19694890 A JP19694890 A JP 19694890A JP H0482269 A JPH0482269 A JP H0482269A
Authority
JP
Japan
Prior art keywords
photoelectric conversion
substrate
dimensional array
microlens
compound semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2196948A
Other languages
Japanese (ja)
Inventor
Masahiro Hibino
日比野 政博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2196948A priority Critical patent/JPH0482269A/en
Publication of JPH0482269A publication Critical patent/JPH0482269A/en
Pending legal-status Critical Current

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  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To reduce a crosstalk without lowering an aperture rate by a method wherein a microlens is formed on a substrate on the side of an incident face in such a way that it corresponds to each photoelectric conversion part. CONSTITUTION:A substrate 1 is etched to be a concave shape. After that, a layer which is transparent with reference to incident light and whose refractive index is larger than that of the substrate 1 is formed on it. Then, its surface is polished to be a plane shape; a microlens is formed on the incident face of the substrate 1 on the same axis as each photoelectric conversion part 3. By this constitution, the incident light on the lens 8 is narrowed to a small spot and is incident on the photoelectric conversion part 3; and the outer shape of each microlens 8 becomes a photodetection part 4. As a result, the photoelectric conversion part 3 of the photodetection part 4 can be made small. Consequently, an interval between adjacent photoelectric conversion parts can be made larger than the diffusion distance of carriers from both sides, and a crosstalk between picture elements can be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、アレイ状の光電変換可能な受光部を有する
背面入射型の光検出器に関し、特にクロストークの低減
と、開口率向上ができる二次元アレイ光検出器に関する
ものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a back-illuminated photodetector having an array of photoelectrically convertible light-receiving sections, and in particular to a back-illuminated photodetector that can reduce crosstalk and improve the aperture ratio. This invention relates to a two-dimensional array photodetector.

〔従来の技術〕[Conventional technology]

第3図及び第4図は従来の二次元プレイ光検出器の構造
を示す断面図及び光電変換部の配置を示す平面図である
3 and 4 are a sectional view showing the structure of a conventional two-dimensional playback photodetector and a plan view showing the arrangement of a photoelectric conversion section.

これらの図において、lは高抵抗体の基板、2は化合物
半導体層、3は光電変換部、4は受光部、5及び5′は
電気信号を取り出すための電極、6は光学フィルタであ
る。
In these figures, 1 is a high-resistance substrate, 2 is a compound semiconductor layer, 3 is a photoelectric conversion section, 4 is a light receiving section, 5 and 5' are electrodes for extracting electrical signals, and 6 is an optical filter.

次に動作について説明する。Next, the operation will be explained.

第3図は光電変換部3として、化合物半導体2上に形成
したPN接合によるフォトダイオードの場合の例を示し
ている。従って第4図に示すように、受光部4は、光電
変換部3の外側にキャリアの拡散長だけ半径を大きくし
た同心円になる。このため隣接する画素間でのクロスト
ーク(漏話)を低減するためには各画素の受光部間隔を
極力大きくし、少なくとも受光部が重ならないようにす
る必要がある。一方、受光面内での受光部の面積比率(
開口率)を上げるため、画素ピッチを広くすることは得
策ではない、このため従来の二次元アレイ光検出器は第
4図に示すように隣接する画素の受光部が互いに接する
程度に配置されていた。
FIG. 3 shows an example in which the photoelectric conversion section 3 is a photodiode formed by a PN junction formed on the compound semiconductor 2. In FIG. Therefore, as shown in FIG. 4, the light receiving section 4 forms a concentric circle with a radius increased by the carrier diffusion length on the outside of the photoelectric conversion section 3. Therefore, in order to reduce crosstalk between adjacent pixels, it is necessary to make the interval between the light receiving parts of each pixel as large as possible so that at least the light receiving parts do not overlap. On the other hand, the area ratio of the light receiving part within the light receiving surface (
It is not a good idea to widen the pixel pitch in order to increase the aperture ratio (aperture ratio); therefore, conventional two-dimensional array photodetectors are arranged so that the light-receiving areas of adjacent pixels are in contact with each other, as shown in Figure 4. Ta.

電極5及び5°は化合物半導体2の表面に形成されてい
るので、入射光は基板1側すなわち背面から入射させる
のが通常であり、また不用な光成分を除去するために入
射側に光学フィルタ6をセットしていた。
Since the electrodes 5 and 5° are formed on the surface of the compound semiconductor 2, the incident light is normally made to enter from the substrate 1 side, that is, the back surface, and an optical filter is provided on the incident side to remove unnecessary light components. I had set 6.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の二次元アレイ光検出器は以上のように構成されて
いたので、以下に述べるようにクロスト〜りが発生しや
すく改善が必要であった。
Since the conventional two-dimensional array photodetector was constructed as described above, it was easy to cause cross distortion as described below, and an improvement was required.

第4図に示した従来の二次元アレイ光検出器は開口率と
の関係上、各画素の受光部が接するように格子状に配置
されていたので、その境界に発生したキャリアは確率的
に上下または左右に分流することとなり、クロストーク
の発生は避けられなかった。
In the conventional two-dimensional array photodetector shown in Figure 4, due to the aperture ratio, the light-receiving areas of each pixel are arranged in a lattice shape so that they touch each other, so carriers generated at the boundaries are stochastically The current would be divided vertically or horizontally, and the occurrence of crosstalk was unavoidable.

また、第3図に示したように光学フィルタ6による反射
光7が他の画素へ入射することによってクロストークを
生じるという問題点があった。
Further, as shown in FIG. 3, there is a problem in that the reflected light 7 from the optical filter 6 enters other pixels, causing crosstalk.

この発明は上記のような問題点を解消するためになされ
たもので、開口率を下げることなくクロストークを低減
するとともに、光学フィルタを不用にして、その反射光
によるクロストークも無くすることのできる高性能の二
次元アレイ光検出器を得ることを目的とする。
This invention was made to solve the above-mentioned problems. It reduces crosstalk without lowering the aperture ratio, eliminates the need for an optical filter, and eliminates crosstalk caused by reflected light. The purpose of this study is to obtain a high-performance two-dimensional array photodetector.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る二次元アレイ光検出器は、入射面側の基
板上に各光電変換部に対応してマイクロレンズを形成し
たものである。
The two-dimensional array photodetector according to the present invention has microlenses formed on a substrate on the entrance surface side corresponding to each photoelectric conversion section.

さらに、第2の発明は上記のマイクロレンズを組成比を
変えて光学フィルタと等価な機能を持たせた化合物半導
体により形成したものである。
Furthermore, in a second invention, the above-mentioned microlens is formed of a compound semiconductor having a different composition ratio to have a function equivalent to an optical filter.

さらに、第3の発明は一つの画素の回りに6個の画素が
正六角形状に接するように光電変換部を配置したもので
ある。
Furthermore, in a third aspect of the invention, the photoelectric conversion sections are arranged so that six pixels are in contact with each other in a regular hexagonal shape around one pixel.

〔作用〕[Effect]

この発明における二次元アレイ光検出器は基板上に形成
したマイクロレンズにより入射光を小さいスポットに変
換して、光電変換部へ入射させる。
The two-dimensional array photodetector according to the present invention converts incident light into a small spot using a microlens formed on a substrate, and makes the spot enter a photoelectric conversion section.

また、上記マイクロレンズを組成比を変えた化合物半導
体で形成することにより光学フィルタと等価な機能を持
たせることができる。
Furthermore, by forming the microlenses from compound semiconductors with different composition ratios, it is possible to provide them with a function equivalent to that of an optical filter.

また、各光電変換部を互いに正六角形状に接するように
配置することにより開口率を向上させることができる。
Further, by arranging the photoelectric conversion parts so as to be in contact with each other in a regular hexagonal shape, the aperture ratio can be improved.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明の一実施例による二次元アレイ光検出器
を示し、図において、8は基板1の入射側面に形成した
マイクロレンズである。
FIG. 1 shows a two-dimensional array photodetector according to an embodiment of the present invention, and in the figure, 8 is a microlens formed on the entrance side of the substrate 1. In FIG.

第2図は一つの画素の回りに6つの画素が正六角形状に
接するように光電変換部を配置した例を示す。
FIG. 2 shows an example in which photoelectric conversion units are arranged so that six pixels are in contact with one pixel in a regular hexagonal shape.

次に動作について説明する。Next, the operation will be explained.

第1図において、マイクロレンズ8は基板1の入射面に
、各光電変換部3と同一軸上に形成したものである。こ
のマイクロレンズは、基板1を凹面状にエツチングした
後、その上に入射光に対して透明で屈折率が基板1より
大きな層を形成し、次にその表面を平面状に研磨するこ
とにより形成できる。このためマイクロレンズ8への入
射光は小さいスポットに絞られて光電変換部3へ入射す
ることになる。即ち各マイクロレンズの外形が第2図に
示す受光部4になる。このため従来と同じ大きさの受光
部4ならば光電変換部3は従来よりも小さくすることが
でき、その結果隣接する光電変換部間の間隔を双方から
のキャリアの拡散距離よりも大きくできるので画素間の
クロストークを大幅に低減することができる。
In FIG. 1, the microlens 8 is formed on the entrance surface of the substrate 1 on the same axis as each photoelectric conversion section 3. As shown in FIG. This microlens is formed by etching the substrate 1 into a concave shape, forming a layer thereon that is transparent to incident light and having a higher refractive index than the substrate 1, and then polishing the surface into a flat surface. can. Therefore, the light incident on the microlens 8 is focused into a small spot and is incident on the photoelectric conversion unit 3. That is, the outer shape of each microlens becomes the light receiving section 4 shown in FIG. Therefore, if the light receiving section 4 is the same size as the conventional one, the photoelectric conversion section 3 can be made smaller than before, and as a result, the distance between adjacent photoelectric conversion sections can be made larger than the diffusion distance of carriers from both. Crosstalk between pixels can be significantly reduced.

また、マイクロレンズ8の材料として、化合物半導体2
の組成を変えて、吸収波長帯を変えたものを用いること
により従来の光学フィルタと同じ機能を持たせることが
できる。このマイクロレンズ8は光学フィルタに比べて
高精度に加工され、受光部4との平行度も十分に良いの
で、従来の光学フィルタの場合に比べて不用な反射光に
よるクロストークを大幅に減少できる。なお、この場合
マイクロレンズ8と基板1との界面による反射強度は弱
いので問題は無い。
In addition, as a material for the microlens 8, a compound semiconductor 2
By changing the composition and using a filter with a different absorption wavelength band, it is possible to provide the same function as a conventional optical filter. This microlens 8 is processed with higher precision than an optical filter, and its parallelism with the light receiving section 4 is sufficiently good, so crosstalk caused by unnecessary reflected light can be significantly reduced compared to the case of conventional optical filters. . Note that in this case, the reflection intensity at the interface between the microlens 8 and the substrate 1 is weak, so there is no problem.

また、第2図は一つの受光部4の回りに他の6つの受光
部が正六角形状に接するように画素を配置した二次元ア
レイ光検出素子の平面配置を示しており、この例では受
光部4間の不用なスキマが減少し、開口率が79%から
91%に向上している。
FIG. 2 shows the planar arrangement of a two-dimensional array photodetector in which pixels are arranged so that one light receiving section 4 is surrounded by six other light receiving sections in contact with each other in a regular hexagonal shape. In this example, the light receiving section is Unnecessary gaps between the parts 4 are reduced, and the aperture ratio is improved from 79% to 91%.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば入射面側の基板上に各
光電変換部に対応してマイクロレンズを形成したので、
光電変換部を相対的に小さくでき、その結果クロストー
クを小さくできる効果がある。
As described above, according to the present invention, microlenses are formed on the substrate on the entrance surface side corresponding to each photoelectric conversion section, so that
The photoelectric conversion section can be made relatively small, which has the effect of reducing crosstalk.

さらに、第2の発明によれば、上記のマイクロレンズを
組成を変えた化合物半導体により形成したので、光学フ
ィルタと等価な機能を持たせることができ、従来の光学
フィルタを無くすることにより反射光によるクロストー
クを減少できる効果がある。
Furthermore, according to the second invention, since the above-mentioned microlens is formed of a compound semiconductor with a different composition, it can be provided with a function equivalent to an optical filter, and by eliminating the conventional optical filter, reflected light can be reduced. This has the effect of reducing crosstalk due to

さらに、第3の発明によれば、受光部を互いに正六角形
状に接するように配置したので開口率を向上させること
ができる効果がある。
Furthermore, according to the third invention, since the light receiving parts are arranged so as to be in contact with each other in a regular hexagonal shape, there is an effect that the aperture ratio can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例による二次元アレイ光検出
器を示す断面図、第2図はこの発明の第2の実施例によ
る二次元アレイ光検出器を示す断面図、第3図及び第4
図は従来の二次元アレイ光検出器を示す断面図、及び平
面図である。 図において、1は基板、2は化合物半導体、3は光電変
換部、4は受光部、8はマイクロレンズである。 なお図中同一符号は同−又は相当部分を示す。
FIG. 1 is a sectional view showing a two-dimensional array photodetector according to an embodiment of the present invention, FIG. 2 is a sectional view showing a two-dimensional array photodetector according to a second embodiment of the invention, and FIG. Fourth
The figures are a sectional view and a plan view showing a conventional two-dimensional array photodetector. In the figure, 1 is a substrate, 2 is a compound semiconductor, 3 is a photoelectric conversion section, 4 is a light receiving section, and 8 is a microlens. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (3)

【特許請求の範囲】[Claims] (1)高抵抗体の基板と、その上に形成した化合物半導
体と、上記化合物半導体上に二次元アレイ状に配列した
複数の光電変換部から成る二次元アレイ光検出器におい
て、 上記基板の他の面上に基板よりも大きい屈折率を有する
透明な材料でマイクロレンズを形成したことを特徴とす
る二次元アレイ光検出器。
(1) In a two-dimensional array photodetector consisting of a high-resistance substrate, a compound semiconductor formed on the substrate, and a plurality of photoelectric conversion sections arranged in a two-dimensional array on the compound semiconductor, in addition to the substrate, A two-dimensional array photodetector characterized in that microlenses are formed on a surface of a transparent material having a refractive index larger than that of a substrate.
(2)マイクロレンズの材料として、光電変換部を構成
する化合物半導体と組成比が異なる化合物半導体を用い
、光学フィルタと等価な機能を持たせたことを特徴とす
る第1項記載の二次元アレイ光検出器。
(2) The two-dimensional array according to item 1, characterized in that a compound semiconductor having a composition ratio different from that of the compound semiconductor constituting the photoelectric conversion section is used as the material of the microlens, and has a function equivalent to an optical filter. Photodetector.
(3)光電変換部の配列を1つの画素の回りに6個の画
素が正六角形状に接するような配列としたことを特徴と
する第1項記載の二次元アレイ光検出器。
(3) The two-dimensional array photodetector according to item 1, wherein the photoelectric conversion units are arranged in such a manner that six pixels are arranged around one pixel in a regular hexagonal shape.
JP2196948A 1990-07-24 1990-07-24 Two-dimensional array photodetector Pending JPH0482269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2196948A JPH0482269A (en) 1990-07-24 1990-07-24 Two-dimensional array photodetector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2196948A JPH0482269A (en) 1990-07-24 1990-07-24 Two-dimensional array photodetector

Publications (1)

Publication Number Publication Date
JPH0482269A true JPH0482269A (en) 1992-03-16

Family

ID=16366323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2196948A Pending JPH0482269A (en) 1990-07-24 1990-07-24 Two-dimensional array photodetector

Country Status (1)

Country Link
JP (1) JPH0482269A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710870A1 (en) * 1994-11-02 1996-05-08 Hughes Aircraft Company Amorphous-silicon pedestal liquid crystal light valve and method for producing same
US9196762B2 (en) 2012-11-06 2015-11-24 Kabushiki Kaisha Toshiba Method for manufacturing solid-state imaging device, and solid-state imaging device
WO2019065291A1 (en) * 2017-09-28 2019-04-04 ソニーセミコンダクタソリューションズ株式会社 Image capturing element and image capturing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710870A1 (en) * 1994-11-02 1996-05-08 Hughes Aircraft Company Amorphous-silicon pedestal liquid crystal light valve and method for producing same
US5612800A (en) * 1994-11-02 1997-03-18 Hughes Aircraft Company LCLV having photoconductive pedestals each having a cross-sectional area no greater than 5 percent of the area of its respective reflective pad
US9196762B2 (en) 2012-11-06 2015-11-24 Kabushiki Kaisha Toshiba Method for manufacturing solid-state imaging device, and solid-state imaging device
US9305955B2 (en) 2012-11-06 2016-04-05 Kabushiki Kaisha Toshiba Method for manufacturing solid-state imaging device, and solid-state imaging device
WO2019065291A1 (en) * 2017-09-28 2019-04-04 ソニーセミコンダクタソリューションズ株式会社 Image capturing element and image capturing device
JPWO2019065291A1 (en) * 2017-09-28 2020-09-10 ソニーセミコンダクタソリューションズ株式会社 Image sensor and image sensor
US10840284B2 (en) 2017-09-28 2020-11-17 Sony Semiconductor Solutions Corporation Imaging element with a first and second converging portion for converging light between a first and second signal extraction portion of adjacent pixels

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