JPH0483365A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent yield from decreasing and cost from increasing by arranging spacers to prevent outer lead pins from bending toward the adjacent lead pins between at least a part of the outer lead pins. CONSTITUTION:Spacers 13 to prevent outer lead pins 12 from bending toward the adjacent lead pins are arranged between at least a part of the outer lead pins. The synthetic resin spacers 13 are normally integrated with a package 11 with a metal mold in molding the package 11 because manufacture is facilitated and cost is lowered. The spacers 13 are in contact with the side faces of the bases of the outer lead pins 12. Even if external pressure is applied to the outer lead pins 12 the bases of which are in contact with the spacers 13, the spacers 13 prevent the outer lead pins 12 from being bent toward the adjacent lead pins.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a semiconductor device, and particularly to a resin molded flat package.

(Prior Art) Flat packages for semiconductor products are generally made of synthetic resin. FIG. 9(a) shows a top view of an example of a semiconductor device having a conventional resin molded flat package.
A part of the side cross section taken along line B is shown in FIG. 9(b).

Here, 91 is a package body made of synthetic resin in which a semiconductor chip mounted on the bed part of a lead frame is housed by molding, and 92 . . . is a lead frame made of metal that protrudes from this package body 91 to the outside. This is the outer lead pin.

However, in the conventional semiconductor device as described above, since nothing exists between the outer lead pins 92, the outer lead bin 92 is pushed against the adjacent outer lead pin by external pressure, as shown in FIG. Sometimes the mold is bent to the side. Moreover, such bending of the outer lead bin may occur after the semiconductor product is obtained by a user, which poses a problem of lowering the reliability of the semiconductor product. Also, if the outer lead pin bends as described above,
There is a problem in that the yield decreases when the outer lead bin is cut or bent in subsequent steps, and costs increase due to the work to correct the bending of the outer lead bin.

(Problems to be Solved by the Invention) As described above, in semiconductor devices having conventional resin molded flat packages, the outer lead bin tends to bend toward the adjacent lead bin due to external pressure, reducing the reliability of the semiconductor product. However, there is a problem in that when it is incorporated into a system product, it causes a decrease in yield and an increase in cost.

The present invention has been made to solve the above problems, and its purpose is to prevent the outer lead bin from bending toward the adjacent lead pin even when subjected to external pressure, improve reliability,
An object of the present invention is to provide a semiconductor device having a resin molded flat package that can prevent a decrease in yield and an increase in cost when incorporated into a system product.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a semiconductor device in which a semiconductor chip is housed in a resin molded flat package, in which an outer lead bin is provided between at least some of the outer lead pins. A spacer is provided to prevent bending toward the adjacent lead bin. This spacer is formed integrally with the package, for example, from synthetic resin.

(Function) Even if pressure is applied to the outer lead bin from the outside, the presence of the spacer prevents the outer lead bin from bending toward the adjacent lead bin, so the lead pins will not bend after the user obtains the semiconductor product. This will eliminate the occurrence of this problem, improving the reliability of semiconductor products. Furthermore, since the outer lead bin is prevented from bending as described above, it is possible to prevent a decrease in yield when cutting or bending the outer lead bin, and to prevent an increase in costs associated with work to correct the bending of the outer lead bin. .

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1(a) shows the top surface of a semiconductor device having a synthetic resin molded flat-bottom package.
A part of the side cross section taken along line B is shown in FIG. 1(b).

Here, 11 is a package body made of synthetic resin that accommodates a semiconductor chip mounted on the bed of a lead frame by molding, This is an outer lead bin of a lead frame made of a protruding metal.Furthermore, 13... is an outer lead bin between at least some of the outer lead pins (in this example, between outer lead pins extending in the same direction from each side of the package 11). , is a spacer provided to prevent the outer lead bin 12 from bending toward the adjacent lead bin.This spacer 13
. . . are usually formed integrally with the package 11 from a synthetic resin using a mold used for molding the package 11 in consideration of ease of manufacture, cost, and the like.

Further, the spacers 13 are in contact with the side surfaces of the base end portions (near the portion protruding from the package body portion 11) of the outer lead bins 12, and in this example, the spacers 13 are The cross-sectional shape of the outer lead bin 12 is
The package body 11 has a rectangular shape with approximately the same thickness as...
stands out from

According to the semiconductor device of the above embodiment, the spacer 1 is provided at the base end.
3... is in contact with the outer lead bin 12...
Even if external pressure is applied to the lead bins, the adjacent lead bin side hair outer lead bins 12 are prevented from bending through the spacer 13.

Note that the present invention is not limited to the above embodiments,
Various modified embodiments will be described below.

That is, for example, the cross-sectional shape of the spacer 13 may be thicker than the outer lead pin 12, like the spacer 14 shown in FIG. It may protrude in a triangular shape, or it may protrude in a triangular shape from the upper edge to the lower edge of the package body 11, like the spacer 16 shown in FIG. 4, or it may protrude like the spacer 17 shown in FIG. Alternatively, it may protrude from the package body 11 in a substantially trapezoidal shape.

Further, the spacers are provided not only between the outer lead pins as in the above embodiment, but also between the outer lead bin groups on each side of the package body 11, as shown in FIGS. 6 to 8. Providing a spacer 18...
In other words, by providing the spacers 18 on both sides of the base end of all the outer lead bins 12, even if pressure is applied to any of the outer lead bins 12 from the outside, the spacer 18 This prevents the adjacent lead bin side hair outer lead pins 12 from bending.

[Effects of the Invention] As described above, according to the semiconductor device of the present invention, even if pressure is applied to the outer lead bin from the outside, the presence of the spacer prevents the outer lead bin from bending toward the adjacent lead pin side. Therefore, the lead pins will not bend after the user obtains them, improving the reliability of the semiconductor product.

Furthermore, since the outer lead bin is prevented from bending as described above, it is possible to prevent a decrease in yield when cutting or bending the outer lead bin, and to prevent an increase in costs associated with work to correct the bending of the outer lead bin. .

Incidentally, when developing system products that use semiconductor devices with multi-bin resin molded flat packages, the probability that the outer lead bin would bend during the cutting and bending process during the assembly process was conventionally approximately 10%. However, when using the semiconductor device of the present invention, it is almost 0%, and this effect is remarkable.

[Brief explanation of the drawing]

FIG. 1(a) is a top view showing an embodiment of the semiconductor device of the present invention, FIG. 1(b) is a side cross-sectional view showing a part along line BB in FIG. 1(a), and FIG. 5 to 5 are side cross-sectional views showing a part of a modified example of the semiconductor device in FIG. 1, and FIGS. 6 to 8, respectively.
9(a) is a top view showing a modification of the semiconductor device shown in FIG. 1, FIG. 9(a) is a top view showing a conventional semiconductor device, and FIG.
Figure (b) is a side cross-section showing a portion along the line B-B in Figure (a), and Figure 10 shows the outer lead bin of a conventional semiconductor device bent toward the adjacent outer lead pin due to external pressure. FIG. 3 is a top view showing the situation. 11...Package, 12...Outer lead part,
13-18...Spacer. (a) (b) Figure 1 Figure 2 Figure 3 Applicant's agent Patent attorney Takehiko Suzue Figure 4 Figure Figure Figure Figure Figure

Claims (1)

[Claims] (1) In a semiconductor device in which a semiconductor chip is housed in a resin-molded flat package, at least some of the outer lead pins are prevented from bending toward adjacent lead pins. A semiconductor device characterized by being provided with a spacer for. (2) The semiconductor device according to claim 1, wherein the spacers are provided on both sides of the base end portions of all the outer lead pins. (3) The semiconductor device according to claim 1 or 2, wherein the spacer is formed integrally with the package from synthetic resin.